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MC74HC157A identical pinout LS157. device inputs compatible with stand
Top Searches for this datasheetMC74HC157A Quad 2-Input Data Selectors Multiplexers MC74HC157A identical pinout LS157. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device routes nibbles single port determined Select input. data presented outputs noninverted form. high level Output Enable input sets four outputs level. Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs 20.5 Equivalent Gates LOGIC DIAGRAM NIBBLE INPUTS NIBBLE INPUTS DATA OUTPUTS PDIP-16 SUFFIX CASE MC74HC157AN AWLYYWW SO-16 SUFFIX CASE 751B HC157A AWLYWW TSSOP-16 SUFFIX CASE 948F Assembly Location Wafer Year Work Week 157A ALYW ASSIGNMENT SELECT OUTPUT ENABLE SELECT OUTPUT ENABLE FUNCTION TABLE Inputs Output Enable Select Outputs ORDERING INFORMATION Device MC74HC157AN MC74HC157AD MC74HC157ADR2 MC74HC157ADT MC74HC157ADTR2 Package PDIP-16 SOIC-16 SOIC-16 TSSOP-16 TSSOP-16 Shipping 2000 Rail 2500 Reel Rail 2500 Reel don't care levels respective Data-Word Inputs. Semiconductor Components Industries, LLC, 2000 March, 2000 Rev. Publication Order Number: MC74HC157A/D MC74HC157A MAXIMUM RATINGS* Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package) *Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Unit Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Vin, Vout Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions 25_C 3.15 1.35 85_C 125_C 3.15 1.35 3.15 1.35 Unit Minimum High-Level Input Voltage Vout |Iout| Maximum Low-Level Input Voltage Vout |Iout| Minimum High-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 2.48 3.98 5.48 2.34 3.84 5.34 Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 0.26 0.26 0.26 0.33 0.33 0.33 http://onsemi.com MC74HC157A ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions 25_C 85_C 125_C Unit Maximum Input Leakage Current Maximum Three-State Leakage Current Output High-Impedance State Vout Iout Maximum Quiescent Supply Current (per Package) NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). ELECTRICAL CHARACTERISTICS Input Guaranteed Limit Symbol tPLH, tPHL Parameter 25_C 85_C 125_C Unit Maximum Propagation Delay, Input Output (Figures tPLH, tPHL Maximum Propagation Delay, Select Output (Figures tPLH, tPHL Maximum Propagation Delay, Output Enable Output (Figures tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Package)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). http://onsemi.com MC74HC157A DESCRIPTIONS INPUTS (Pins Nibble inputs. data present these pins transferred outputs when Select input level Output Enable input level. data presented outputs noninverted form. (Pins data present these pins noninverted form. Output Enable input high level, outputs level. CONTROL INPUTS Select (Pin Nibble inputs. data present these pins transferred outputs when Select input high level Output Enable input level. data presented outputs noninverted form. OUTPUTS (Pins Nibble select. This input determines data word transferred outputs. level this input selects inputs high level selects inputs. Output Enable (Pin Output Enable input. level this input allows selected input data presented outputs. high level this input sets outputs level. Data outputs. selected input Nibble presented these outputs when Output Enable input level. SWITCHING WAVEFORMS INPUT tPLH OUTPUT tTLH tTHL tPHL SELECT tPLH OUTPUT tTLH tTHL tPHL Figure HC157A OUTPUT ENABLE tPHL OUTPUT tTHL Figure versus Select, Noninverted tPLH tTLH Figure HC157A TEST POINT OUTPUT DEVICE UNDER TEST *Includes probe capacitance Figure Test Circuit http://onsemi.com MC74HC157A EXPANDED LOGIC DIAGRAM NIBBLE OUTPUTS OUTPUT ENABLE SELECT DATA OUTPUTS http://onsemi.com MC74HC157A PACKAGE DIMENSIONS PDIP-16 SUFFIX CASE 648-08 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES MILLIMETERS 0.740 0.770 18.80 19.55 0.250 0.270 6.85 6.35 0.145 0.175 4.44 3.69 0.015 0.021 0.53 0.39 0.040 0.070 1.77 1.02 0.100 2.54 0.050 1.27 0.008 0.015 0.38 0.21 0.110 0.130 3.30 2.80 0.295 0.305 7.74 7.50 0.020 0.040 1.01 0.51 0.25 (0.010) SEATING PLANE SOIC-16 SUFFIX CASE 751B-05 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 0.25 0.19 0.25 0.10 6.20 5.80 0.50 0.25 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019 0.25 (0.010) SEATING PLANE 0.25 (0.010) http://onsemi.com MC74HC157A PACKAGE DIMENSIONS TSSOP-16 SUFFIX CASE 948F-01 ISSUE 0.10 (0.004) 0.15 (0.006) IDENT. SECTION 0.25 (0.010) 0.15 (0.006) DETAIL NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 0.10 (0.004) SEATING PLANE DETAIL http://onsemi.com MC74HC157A Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. 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