INPUT +10V VOLTAGE DOUBLER FEATURES Complies with 89/336/EEC

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INPUT +10V VOLTAGE DOUBLER FEATURES Complies with 89/336/EEC

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EMI-EMC-Compliant, Protected, RS-232 Line Drivers/Receivers
INPUT
+10V VOLTAGE DOUBLER
FEATURES Complies with 89/336/EEC Directive Protection IEC1000-4-2 (801.2) Contact Discharge Air-Gap Discharge Human Body Model Fast Transient Burst (EFT) Immunity (IEC1000-4-4) Emissions (EN55022) Eliminates Costly TranZorbs* kbits/s Data Rate Guaranteed Single Power Supply Shutdown Mode Plug-In Upgrade MAX2xxE Space Saving TSSOP Package Available APPLICATIONS Laptop Computers Notebook Computers Printers Peripherals Modems GENERAL DESCRIPTION
6.3V T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN
+10V -10V VOLTAGE INVERTER
T1IN CMOS INPUTS* T2IN T3IN T4IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT R5OUT (ADM211E) (ADM213E)
EIA/TIA-232 OUTPUTS
EIA/TIA-232 INPUTS**
ADM211E
ADM213E
SHDN (ADM211E) SHDN (ADM213E)
ADM2xxE family robust RS-232 V.28 interface devices that operates from single power supply. These products suitable operation harsh electrical environments compliant with directive (89/336/EEC). level emissions immunity both compliance. immunity includes protection excess lines (1000-4-2), Fast Transient Burst protection (1000-4-4) Radiated Immunity (1000-4-3). emissions include radiated conducted emissions required Information Technology Equipment EN55022, CISPR22. devices fully conform EIA-232E CCITT V.28 specifications operate data rates kbps. Shutdown Enable control pins provided some products. Please refer Table shutdown function ADM211E disables charge pump transmitters receivers. ADM213E
*TranZorb registered trademark General Semiconductor Industries, Inc.
NOTES: INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
charge pump, transmitters, three five receivers disabled. remaining receivers remain active, thereby allowing monitoring peripheral devices. This feature allows device shut down until peripheral device begins communication. active receivers alert processor which then take ADM213E shutdown mode. Operating from single supply, four external capacitors required. ADM207E ADM208E available 24-lead DIP, SSOP TSSOP packages. ADM211E ADM213E available 28-lead SSOP TSSOP packages. products backward-compatible with earlier ADM2xx products, facilitating easy upgrading older designs.
Table Selection Table
Model ADM206E ADM207E ADM208E ADM211E ADM213E REV.
Supply Voltage
Drivers
Receivers
Protection
Shutdown (SD)*
Enable (EN)
Packages R-24 RU-24 RU-24 RU-28 RU-28
*Two receivers active.
Information furnished Analog Devices believed accurate reliable. However, responsibility assumed Analog Devices use, infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights Analog Devices.
Technology Way, P.O. 9106, Norwood, 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Site: www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2001
(VCC
Parameter Operating Voltage Range Power Supply Current Shutdown Supply Current Input Pull-Up Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Input Logic Threshold High, VINH CMOS Output Voltage Low, CMOS Output Voltage High, CMOS Output Leakage Current EIA-232 Input Voltage Range EIA-232 Input Threshold EIA-232 Input Threshold High EIA-232 Input Hysteresis EIA-232 Input Resistance Output Voltage Swing Transmitter Output Resistance RS-232 Output Short Circuit Current Maximum Data Rate Receiver Propagation Delay TPHL, TPLH Receiver Output Enable Time, Receiver Output Disable Time, Transmitter Propagation Delay TPHL, TPLH Transition Region Slew Rate
10%, C1-C4 specifications TMIN TMAX unless otherwise noted.)
0.05 0.25 Unit kbps V/µs TIN, SHDN, SHDN, SHDN, SHDN IOUT IOUT VCC, GND, ROUT Test Conditions/Comments Load
85°C Transmitter Outputs Loaded with Ground VOUT 2500
2500 2500 Measured from Human Body Model IEC1000-4-2 Discharge IEC1000-4-2 Contact Discharge IEC1000-4-3
Protection (I-O Pins)
Immunity
NOTES Guaranteed design. Specifications subject change without notice.
REV.
ABSOLUTE MAXIMUM RATINGS*
25°C unless otherwise noted.)
-0.3 (VCC -0.3 +0.3 Input Voltages -0.3 (V+, +0.3 Output Voltages TOUT ROUT -0.3 (VCC +0.3 Short Circuit Duration TOUT Continuous Power Dissipation N-24 (Derate 13.5 mW/°C above 70°C) 1000 R-24 SOIC (Derate mW/°C above 70°C)
RS-24 SSOP (Derate mW/°C above 70°C) RU-24 TSSOP (Derate mW/°C above 70°C) R-28 SOIC (Derate mW/°C above 70°C) RS-28 SSOP (Derate mW/°C above 70°C) RU-28 TSSOP (Derate mW/°C above 70°C) Operating Temperature Range Industrial Version) -40°C +85°C Storage Temperature Range -65°C +150°C Lead Temperature (Soldering, sec) 300°C Rating (MIL-STD-883B) (I-O Pins) Rating (IEC1000-4-2 Air) (I-O Pins) Rating (IEC1000-4-2 Contact) (I-O Pins)
*This stress rating only functional operation device these other conditions above those indicated operation sections this specification implied. Exposure absolute maximum rating conditions extended periods time affect reliability.
Table ADM211E Truth Table
ORDERING GUIDE
SHDN
Don't Care.
Status Normal Operation Normal Operation Shutdown
TOUT1-4 Enabled Enabled Disabled
ROUT1-5 Enabled Disabled Disabled Model ADM206EAR ADM207EAN ADM207EAR ADM207EARS ADM207EARU ADM208EAN ADM208EAR ADM208EARS ADM208EARU ADM211EAR ADM211EARS ADM211EARU ADM213EAR ADM213EARS ADM213EARU
Temperature Range -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C
Package Package Description Option SOIC SOIC SSOP TSSOP SOIC SSOP TSSOP SOIC SSOP TSSOP SOIC SSOP TSSOP R-24 N-24 R-24 RS-24 RU-24 N-24 R-24 RS-24 RU-24 R-28 RS-28 RU-28 R-28 RS-28 RU-28
Table III. ADM213E Truth Table
SHDN
Status Shutdown Shutdown Normal Operation Normal Operation
TOUT1-4 Disabled Disabled Enabled Enabled
ROUT1-3 Disabled Disabled Disabled Enabled
ROUT4-5 Disabled Enabled Disabled Enabled
CAUTION (electrostatic discharge) sensitive device. Electrostatic charges high 4000 readily accumulate human body test equipment discharge without detection. Although features proprietary protection circuitry, permanent damage occur devices subjected high-energy electrostatic discharges. Therefore, proper precautions recommended avoid performance degradation loss functionality.
WARNING!
SENSITIVE DEVICE
REV.
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T4OUT R2IN R2OUT
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T4OUT R2IN R2OUT T5IN
VIEW T4IN T1IN (Not Scale) T3IN R3OUT R3IN
ADM206E
VIEW T4IN T1IN (Not Scale) T3IN R3OUT R3IN
ADM207E
T5OUT
Figure ADM206E DIP/SOIC/SSOP Configuration
Figure ADM207E Configuration
INPUT
INPUT
+10V VOLTAGE DOUBLER 6.3V
6.3V
+10V VOLTAGE DOUBLER
6.3V
+10V -10V VOLTAGE INVERTER
+10V -10V VOLTAGE INVERTER
T1IN
T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN EIA/TIA-232 INPUTS** EIA/TIA-232 OUTPUTS
T1IN T2IN T3IN T4IN R1OUT TTL/CMOS OUTPUTS R2OUT
T1OUT
T2IN
TTL/CMOS INPUTS*
T2OUT RS-232 OUTPUTS
CMOS INPUTS* T3IN T4IN
T3OUT
T4OUT
T5IN
R1IN
R1OUT
R2IN R3IN
RS-232 INPUTS**
CMOS OUTPUTS
R2OUT
R3OUT
R3OUT
ADM206E
ADM207E
*INTERNAL 400k PULL-UP RESISTOR EACH TTL/CMOS INPUT **INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
*INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT **INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
Figure ADM206E Typical Operating Circuit
Figure ADM207E Typical Operating Circuit
REV.
T3OUT T2OUT T1OUT R2IN R2OUT T1IN R1OUT T3OUT R3IN R3OUT T4IN T1OUT T2OUT R2IN R2OUT T4OUT R3IN R3OUT SHDN
ADM211E
ADM208E
T4OUT
VIEW T2IN (Not Scale) R4IN T1IN R1OUT R1IN R4OUT T4IN T3IN R5OUT R5IN
VIEW T3IN R1IN (Not Scale) T2IN R4OUT R4IN
Figure ADM208E Configuration
Figure ADM211E Configuration
INPUT
INPUT +10V VOLTAGE DOUBLER
+10V VOLTAGE DOUBLER
6.3V
6.3V
+10V -10V VOLTAGE INVERTER
T1OUT T2OUT EIA/TIA-232 OUTPUTS T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SHDN EIA/TIA-232 INPUTS**
+10V -10V VOLTAGE INVERTER
T1OUT T2OUT EIA/TIA-232 OUTPUTS CMOS INPUTS*
T1IN T2IN T3IN
T1IN T2IN CMOS INPUTS* T3IN T4IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT
T4IN R1OUT
T3OUT T4OUT R2OUT R1IN R2IN EIA/TIA-232 INPUTS** R3IN R5OUT R4IN TTL/CMOS OUTPUTS R3OUT R4OUT
ADM208E
ADM211E
*INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT **INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
*INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT **INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
Figure ADM208E Typical Operating Circuit
Figure ADM211E Typical Operating Circuit
REV.
INPUT
T3OUT T1OUT T2OUT R2IN R2OUT T4OUT R3IN R3OUT SHDN
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
6.3V
ADM213E
VIEW T2IN (Not Scale) R4IN* T1IN R1OUT R1IN R4OUT* T4IN T3IN R5OUT* R5IN*
T1OUT T2OUT RS-232 OUTPUTS T3OUT T4OUT R1IN R2IN R3IN R4IN3 R5IN3 SHDN RS-232 INPUTS2
T1IN T2IN TTL/CMOS INPUTS1 T3IN T4IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT3 R5OUT3
*ACTIVE SHUTDOWN
Figure ADM213E Configuration
ADM213E
NOTES 1INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT 2INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT 3ACTIVE SHUTDOWN
Figure ADM213E Typical Operating Circuit
FUNCTION DESCRIPTIONS
Mnemonic C1+, C2+, TOUT ROUT EN/EN
Function Power Supply Input: 10%. Internally Generated Positive Supply nominal). Internally Generated Negative Supply nominal). Ground Pin. Must Connected External Capacitor connected between these pins. capacitor recommended larger capacitors used. External Capacitor connected between these pins. capacitor recommended larger capacitors used. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. internal pull-up resistor connected each input. Transmitter (Driver) Outputs. These RS-232 signal levels (Typically Receiver Inputs. These inputs accept RS-232 signal levels. internal pull-down resistor connected each input. Receiver Outputs. These CMOS output logic levels. Receiver Enable (Active High ADM213E, Active ADM211E); This input used enable/disable receiver outputs. With ADM211E High ADM213E), receiver outputs enabled. With High ADM213E), receiver outputs placed high impedance state. Shutdown Control (Active ADM213E, Active High ADM211E); Refer Table shutdown charge pump disabled, transmitter outputs turned receiver outputs (ADM211E), receivers (ADM213E) placed high impedance state. Receivers ADM213E continue operate normally during shutdown. Power consumption shutdown parts reduces REV.
SHDN/SHDN
Typical Performance Characteristics
LIMIT
START 30.0 STOP 200.0
LIMIT
FREQUENCY
Conducted Emissions
Radiated Emissions
LOADED
LOADED
1500 1000 2000 LOAD CAPACITANCE
2500
3000
Transmitter Output Voltage High/Low Load Capacitance kbps
Transmitter Output Voltage
LOAD CURRENT
5.00V 5.00V
5.00V
50.0µs
3.1V
EXITING
Transmitter Output Voltage Load Current
Charge Pump Exiting Shutdown
REV.
IMPEDANCE
V+/V-
LOAD CURRENT-
Charge Pump Impedance
Charge Pump Current
REV.
GENERAL DESCRIPTION
FROM VOLTAGE DOUBLER -(V+)
ruggedized RS-232 line drivers/receivers which operate from single supply. Step-up voltage converters coupled with level shifting transmitters receivers allow RS-232 levels developed while operating from single supply. Features include power consumption, high transmission rates compatibility with directive electromagnetic compatibility. compatibility includes protection against radiated conducted interference including high levels electrostatic discharge. RS-232 inputs outputs contain protection against electrostatic discharges electrical fast transients This ensures compliance IE1000-4-2 IEC1000-4-4 requirements. devices ideally suited operation electrically harsh environments where RS-232 cables frequently being plugged/ unplugged. They also immune high field strengths without special shielding precautions. Emissions also controlled within very strict limits. CMOS technology used keep power dissipation absolute minimum allowing maximum battery life portable applications. ADMxxE modification, enhancement improvement AD230-AD241 family derivatives thereof. essentially plug-in compatible does have materially different applications.
CIRCUIT DESCRIPTION
INTERNAL OSCILLATOR
Figure Charge Pump Voltage Inverter
Transmitter (Driver) Section
drivers convert logic input levels into EIA-232 output levels. With driving EIA-232 load, output voltage swing typically Unused inputs left unconnected, internal pull-up resistor pulls them high forcing outputs into state. input pull-up resistors typically source when grounded, unused inputs should either connected left unconnected order minimize power consumption.
Receiver Section
receivers inverting level shifters which accept EIA-232 input levels translate them into logic output levels. inputs have internal pull-down resistors ground also protected against overvoltages guaranteed switching thresholds minimum maximum. Unconnected inputs pulled internal pull-down resistor. This, therefore, results Logic output level unconnected inputs inputs connected GND. receivers have Schmitt trigger input with hysteresis level This ensures error-free reception both noisy inputs inputs with slow transition times.
ENABLE SHUTDOWN
internal circuitry consists four main sections. These are: charge pump voltage converter. logic EIA-232 transmitters. EIA-232 logic receivers. Transient protection circuit lines.
Charge Pump DC-DC Voltage Converter
charge pump voltage converter consists oscillator switching matrix. converter generates supply from input level. This done stages using switched capacitor technique illustrated below. First, input supply doubled using capacitor charge storage element. level then inverted generate using storage element. Capacitors used reduce output ripple. desired, larger capacitors used capacitors C1-C4. This facilitates direct substitution with older generation charge pump RS-232 transceivers. supplies also used power external circuitry current requirements small. Please refer Typical Performance Characteristics section.
2VCC
Table Table show truth tables enable shutdown control signals. enable function intended facilitate data connections where desirable three state receiver outputs. disabled mode, receiver outputs placed high impedance state. shutdown function intended shut device down, thereby minimizing quiescent current. shutdown, transmitters disabled receivers ADM211E three-stated. ADM213E, receivers remain enabled shutdown. Note that transmitters disabled three-stated shutdown, permitted connect multiple (RS-232) driver outputs together. shutdown feature very useful battery operated systems since reduces power consumption During shutdown charge pump also disabled. shutdown control input active high ADM211E, active ADM213E. When exiting shutdown, charge pump restarted takes approximately reach steady state operating conditions.
INTERNAL OSCILLATOR
Figure Charge Pump Voltage Doubler
REV.
High Baud Rate
ADM2xxE feature high slew rates permitting data transmission rates well excess EIA-232-E specifications. RS-232 levels maintained data rates kb/s even under worst case loading conditions. This allows high-speed data links between terminals, indeed suitable generation modem standards which require data rates kb/s. slew rate internally controlled less than V/µs order minimize interference.
INPUT
RECEIVER INPUT
Figure 15a. Receiver Input Protection Scheme
TOUT
TRANSMITTER OUTPUT
-0.1V RECEIVER OUTPUT +0.1V
Figure 15b. Transmitter Output Protection Scheme
TESTING (IEC1000-4-2)
NOTE: COMPLEMENT ADM213E
Figure Receiver-Disable Timing
INPUT
+3.5V RECEIVER OUTPUT +0.8V
IEC1000-4-2 (previously 801-2) specifies compliance testing using coupling methods, contact discharge, air-gap discharge. Contact discharge calls direct connection unit being tested. Air-gap discharge uses higher test voltage does make direct contact with unit under test. With discharge, discharge moved toward unit under test, developing across gap; hence term airdischarge. This method influenced humidity, temperature, barometric pressure, distance, rate closure discharge gun. contact-discharge method, while less realistic, more repeatable, gaining acceptance preference airgap method. Although very little energy contained within pulse, extremely fast rise-time, coupled with high voltages, cause failures unprotected semiconductors. Catastrophic destruction occur immediately result arcing heating. Even catastrophic failure does occur immediately, device suffer from parametric degradation which result degraded performance. cumulative effects continuous exposure eventually lead complete failure. lines particularly vulnerable damage. Simply touching plugging cable result static discharge that damage completely destroy interface product connected port. Traditional test methods such MIL-STD-883B method 3015.7 fully test product's susceptibility this type discharge. This test intended test product's susceptibility damage during handling. Each tested with respect other pins. There some important differences between traditional test test: test much more stringent terms discharge energy. peak current injected over four times greater. current rise-time significantly faster test. test carried while power applied device. possible that discharge could induce latch-up device under test. This test, therefore, more representative real-world discharge where equipment operating normally with power applied. maximum peace mind, however, both tests should performed, thus ensuring maximum protection both during handling later, during field service. REV.
NOTE: COMPLEMENT ADM213E
Figure Receiver Enable Timing
ESD/EFT Transient Protection Scheme
ADM2xxE uses protective clamping structures inputs outputs that clamp voltage safe level dissipates energy present (Electrostatic) (Electrical Fast Transients) discharges. simplified schematic protection structure shown Figures 15b. Each input output contains back-to-back high-speed clamping diodes. During normal operation, with maximum RS-232 signal levels, diodes have effect other reverse-biased, depending polarity signal. however, voltage exceeds about reverse breakdown occurs voltage clamped this level. diodes large junctions designed handle instantaneous current surge which exceed several amperes. transmitter outputs receiver inputs have similar protection structure. receiver inputs also dissipate some energy through internal resistor well through protection diodes. protection structure achieves protection protection RS-232 lines. methods used test protection scheme discussed later.
-10-
HIGH VOLTAGE GENERATOR
Table IEC1000-4-2 Compliance Levels
DEVICE UNDER TEST
Level
Contact Discharge (kV)
Discharge (kV)
TEST METHOD BODY MIL-STD883B IEC1000-4-2
1.5k
100pF 150pF
Figure Test Standards
Table ADM2xxE Test Results
Test Method
(kV)
IPEAK
MIL-STD-883B IEC1000-4-2 Contact
36.8
FAST TRANSIENT BURST TESTING (IEC1000-4-4)
TIME
Figure Human Body Model Current Waveform
IPEAK
IEC1000-4-4 (previously 801-4) covers electrical fast-transient/ burst (EFT) immunity. Electrical fast transients occur result arcing contacts switches relays. tests simulate interference generated when example power relay disconnects inductive load. spark generated well known back effect. fact, spark consists burst sparks relay contacts separate. voltage appearing line, therefore, consists burst extremely fast transient impulses. similar effect occurs when switching fluorescent lights. fast transient burst test defined IEC1000-4-4 simulates this arcing, waveform illustrated Figure consists burst transients repeating intervals. specified both power data lines.
30ns 60ns
300ms 15ms
TIME
Figure IEC1000-4-2 Current Waveform
ADM2xxE family products tested using both above-mentioned test methods. pins tested with respect other pins MIL-STD-883B specification. addition, pins tested test specification. products were tested under following conditions: Power-On-Normal Operation Power-On-Shutdown Mode Power-Off There four levels compliance defined IEC1000-4-2. ADM2xxE family products meet most stringent compliance level both contact air-gap discharge. This means that products able withstand contact discharges excess air-gap discharges excess
50ns
0.2/0.4ms
Figure IEC1000-4-4 Fast Transient Waveform
REV.
-11-
Table
Level
Peak (kV)
Peak (kV) 0.25
Testing immunity involves irradiating device with field. There various methods achieving this, including anechoic chamber, stripline cell, cell, GTEM cell. stripline cell consists parallel plates with electric field developed between them. device under test placed within cell exposed electric field. There three severity levels having field strengths ranging from V/m. Results classified similar fashion those IEC1000-4-4. Normal operation. Temporary degradation loss function which selfrecoverable when interfering signal removed. Temporary degradation loss function which requires operator intervention system reset when interfering signal removed. Degradation loss function which recoverable damage. ADM2xxE family products easily meets Classification most stringent (Level requirement. fact, field strengths showed performance degradation, errorfree data transmission continued even during irradiation.
Table VII. Test Severity Levels (IEC1000-4-3)
simplified circuit diagram actual generator illustrated Figure transients coupled onto signal lines using coupling clamp. clamp long completely surrounds cable providing maximum coupling capacitance typ) between clamp cable. High energy transients capacitively coupled onto signal lines. Fast rise times specified standard result very effective coupling. This test very severe since high voltages coupled onto signal lines. repetitive transients often cause problems where single pulses not. Destructive latch-up induced high energy content transients. Note that this stress applied while interface products powered transmitting data. test applies hundreds pulses with higher energy than ESD. Worst-case transient current line high 40A. Test results classified according following: Normal performance within specification limits. Temporary degradation loss performance which selfrecoverable. Temporary degradation loss function performance which requires operator intervention system reset. Degradation loss function which recoverable damage. ADM2xxE have been tested under worst-case conditions using unshielded cables, meet Classification Data transmission during transient condition corrupted, resumed immediately following event without user intervention.
OUTPUT
Level
EMISSIONS/INTERFERENCE
Field Strength
EN55 022, CISPR22 defines permitted limits radiated conducted interference from Information Technology (IT) equipment. objective standard minimize level emissions both conducted radiated. ease measurement analysis, conducted emissions assumed predominate below radiated emissions assumed predominate above MHz.
CONDUCTED EMISSIONS
HIGH VOLTAGE SOURCE
Figure IEC1000-4-4 Fast Transient Generator
IEC1000-4-3 RADIATED IMMUNITY
IEC1000-4-3 (previously IEC801-3) describes measurement method defines levels immunity radiated electromagnetic fields. originally intended simulate electromagnetic fields generated portable radio transceivers other device that generates continuous wave radiated electromagnetic energy. scope since been broadened include spurious energy which radiated from fluorescent lights, thyristor drives, inductive loads, etc.
This measure noise that conducted onto line power supply. Switching transients from charge pump which magnitude containing significant energy lead conducted emissions. Other sources conducted emissions overlap switch on-times charge pump voltage converter. voltage doubler shown below, fully turned before turns this results transient current glitch between which results conducted emissions. therefore important that switches charge pump guarantee break-before-make switching under conditions that instantaneous short circuit conditions occur. ADM2xxE been designed minimize switching transients ensure break-before-make switching thereby minimizing conducted emissions. This resulted level emissions being well below limits required specification. additional filtering/decoupling other than recommended capacitor required.
-12-
REV.
Conducted emissions measured monitoring line power supply. equipment used consists LISN (Line Impedance Stabilizing Network) which essentially presents fixed impedance spectrum analyzer. spectrum analyzer scans emissions plot ADM211E shown Figure
RADIATED EMISSIONS
INTERNAL OSCILLATOR
Radiated emissions measured frequencies excess MHz. RS-232 outputs designed operation high baud rates while driving cables radiate high frequency energy. reasons already discussed which cause conducted emissions also responsible radiated emissions. Fast RS-232 output transitions radiate interference, especially when lightly loaded driving unshielded cables. Charge pump devices also prone radiating noise high frequency oscillator high voltages being switched charge pump. move towards smaller capacitors order conserve board space resulted higher frequency oscillators being employed charge pump design. This resulted higher levels emission, both conducted radiated. RS-232 outputs ADM2xxE products feature controlled slew rate order minimize level radiated emissions, fast enough support data rates kBaud.
RADIATED NOISE
Figure Charge Pump Voltage Doubler
SWITCHING GLITCHES
TURNTABLE ADJUSTABLE ANTENNA RECEIVER
Figure Switching Glitches Figure Radiated Emissions Test Setup
LIMIT
Figure shows plot radiated emissions frequency. This shows that levels emissions well within specifications without need additional shielding filtering components. ADM2xxE operated maximum baud rates configured typical RS-232 interface. Testing radiated emissions carried shielded anechoic chamber.
FREQUENCY
Figure Conducted Emissions Plot
START 30.0 STOP 200.0
LIMIT
Figure Radiated Emissions Plot
REV.
-13-
OUTLINE DIMENSIONS
Dimensions shown inches (mm).
24-Lead (N-24)
1.275 (32.30) 1.125 (28.60)
0.280 (7.11) 0.240 (6.10) 0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93)
0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) 0.060 (1.52) 0.015 (0.38) 0.150 (3.81) 0.070 (1.77) SEATING 0.045 (1.15) PLANE
0.015 (0.381) 0.008 (0.204)
24-Lead SOIC (R-24)
0.6141 (15.60) 0.5985 (15.20)
0.2992 (7.60) 0.2914 (7.40)
0.4193 (10.65) 0.3937 (10.00)
0.1043 (2.65) 0.0926 (2.35)
0.0291 (0.74) 0.0098 (0.25)
0.0118 (0.30) 0.0500 0.0040 (0.10) (1.27)
0.0192 (0.49) SEATING 0.0125 (0.32) 0.0138 (0.35) PLANE 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
28-Lead SOIC (R-28)
0.7125 (18.10) 0.6969 (17.70)
0.2992 (7.60) 0.2914 (7.40)
0.4193 (10.65) 0.3937 (10.00)
0.1043 (2.65) 0.0926 (2.35)
0.0291 (0.74) 0.0098 (0.25)
0.0118 (0.30) 0.0040 (0.10)
0.0500 (1.27)
0.0192 (0.49) SEATING 0.0125 (0.32) PLANE 0.0138 (0.35) 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
-14-
REV.
OUTLINE DIMENSIONS
Dimensions shown inches (mm).
24-Lead SSOP (RS-24)
0.328 (8.33) 0.318 (8.08)
0.212 (5.38) 0.205 (5.21)
0.311 (7.9) 0.301 (7.64)
0.078 (1.98) 0.068 (1.73) 0.015 (0.38) 0.010 (0.25) 0.07 (1.78) 0.066 (1.67)
0.008 (0.203) 0.002 (0.050)
0.0256 (0.65)
SEATING PLANE
0.009 (0.229) 0.005 (0.127)
0.037 (0.94) 0.022 (0.559)
28-Lead SSOP (RS-28)
0.407 (10.34) 0.397 (10.08)
0.212 (5.38) 0.205 (5.21)
0.311 (7.9) 0.301 (7.64)
0.078 (1.98) 0.068 (1.73)
0.07 (1.79) 0.066 (1.67)
0.008 (0.203) 0.0256 (0.65) 0.002 (0.050)
0.015 (0.38) SEATING 0.010 (0.25) PLANE
0.009 (0.229) 0.005 (0.127)
0.03 (0.762) 0.022 (0.558)
24-Lead TSSOP (RU-24)
0.311 (7.90) 0.303 (7.70)
0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25)
0.006 (0.15) 0.002 (0.05) 0.0433 (1.10)
SEATING PLANE
0.0256 (0.65) 0.0118 (0.30) 0.0075 (0.19)
0.0079 (0.20) 0.0035 (0.090)
0.028 (0.70) 0.020 (0.50)
REV.
-15-
OUTLINE DIMENSIONS
Dimensions shown inches (mm).
28-Lead TSSOP (RU-28)
0.386 (9.80) 0.378 (9.60)
0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25)
0.006 (0.15) 0.002 (0.05) 0.0433 (1.10)
SEATING PLANE
0.0256 (0.65)
0.0118 (0.30) 0.0075 (0.19)
0.0079 (0.20) 0.0035 (0.090)
0.028 (0.70) 0.020 (0.50)
Revision History
Location Page
Changed from REV.
Features
Change kbits/s kbits/s
Specifications Table
Changed Min, Typ, Max, Test Conditions/Comments columns
Absolute Maximum Ratings
Deleted some items
Figures
Change made Figure
Typical Performance Characteristics
Changes made plots
Table
Column removed
-16-
REV.
PRINTED U.S.A.
C00068-0-3/01(C)

INPUT +10V VOLTAGE DOUBLER FEATURES Complies with 89/336/EEC

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