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HML1225/HXL1225 0.8A 300/380 VOLTAGE SCRS IGT
Top Searches for this datasheetSpec. HA200406 Issued Date 1992.11.25 Revised Date 2004.08.13 Page HML1225/HXL1225 0.8A 300/380 VOLTAGE SCRS IGT<200uA Description HML1225/HXL1225 series silicon controlled rectifiers high performance planner diffused PNPN devices. These parts intended cost high volume applications. Absolute Maximum Ratings (TA=25°C) Parameter Repetitive Peak State Voltage On-State Current Average On-State Current Peak Reverse Gate Voltage Peak Gate Current Gate Dissipation Operating Temperature Storage Temperature Soldering Temperature Part HXL1225 HML1225 Symbol VDRM VDRM IT(rms) IT(AV) VGRM PG(AV) Tstg Tsld Unit TO-92 Test Conditions TJ=40°C 125°C (RGK=1K) TC=40°C Half Cycle=180°,TC=40°C IGR=10uA 10us 20ms 1.6mm from case Classification Rank HML1225 HXL1225 10-18 10-18 12-23 12-23 17-28 17-28 22-55 22-55 45-105 45-105 95-155 Electrical Characteristics (TA=25°C) Parameter Off-State Leakage Current Off-State Leakage Current On-State Voltage On-State Threshold Voltage On-State Slops Resistance Gate Trigger Current Gate Trigger Voltage Holding Current Latching Current Critical Rate Voltage Rise Crtical Rate Current Rise Gate Controlled Delay Time Commutated Turn-off Time Thermal Resistance junc.to case Thermal Resistance junc. HML1225, HXL1225 Symbol IDRM IDRM VT(TO) dv/dt di/dt 0.95 Unit V/us A/us Test Conditions @VDRM (RGK=1K), TJ=125°C @VDRM (RGK=1K), TJ=25°C IT=0.4A, TJ=25°C IT=0.8A, TJ=25°C TJ=125°C TJ=125°C VD=7V VD=7V RGK=1K(ohm) RGK=1K(ohm) VD=0.67*VDRM(RGK=1K), TJ=125°C IG=10mA,diG/dt=0.1A/us, TJ=125°C IG=10mA,diG/dt=0.1A/us TC=85°C,VD=0.67*VDRM VR=35V,IT=IT(AV) HSMC Product Specification TO-92 Dimension Spec. HA200406 Issued Date 1992.11.25 Revised Date 2004.08.13 Page Marking: Free Mark Pb-Free: (Note) Normal: None Product Series (M,X) Date Code Control Code Note: Green label used pb-free packing Style: 1.Cathode 2.Gate 3.Anode Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.33 4.33 12.70 0.36 3.36 0.36 Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 Typical, Unit: 3-Lead TO-92 Plastic Package HSMC Package Code: TO-92 Taping Dimension F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 Unit: F1F2 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HML1225, HXL1225 HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HA200406 Issued Date 1992.11.25 Revised Date 2004.08.13 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes Peak temperature Dipping time 5sec ±1sec 5sec ±1sec +0/-5 HML1225, HXL1225 HSMC Product Specification Other recent searchesWIT910 - WIT910 WIT910 Datasheet WIT2410 - WIT2410 WIT2410 Datasheet WIT910s - WIT910s WIT910s Datasheet ISO9000 - ISO9000 ISO9000 Datasheet WIT910 - WIT910 WIT910 Datasheet TIBPAL22V10-10C - TIBPAL22V10-10C TIBPAL22V10-10C Datasheet SiP21106 - SiP21106 SiP21106 Datasheet SiP21107 - SiP21107 SiP21107 Datasheet SiP21108 - SiP21108 SiP21108 Datasheet ICS9112-43 - ICS9112-43 ICS9112-43 Datasheet CT2214F - CT2214F CT2214F Datasheet CT4015F - CT4015F CT4015F Datasheet B4690 - B4690 B4690 Datasheet ADS828 - ADS828 ADS828 Datasheet
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