The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

HTL194 EPITAXIAL PLANAR TRANSISTOR Description HTL194 d


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



Spec. HE6549 Issued Date 1993.04.12 Revised Date 2005.02.15 Page
HTL194
EPITAXIAL PLANAR TRANSISTOR
Description
HTL194 designed high voltage power switching applications especially telephone telecommunication circuits. TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TA=25°C) Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage -400 VCEO Collector Emitter Voltage -400 Collector Current -300
Electrical Characteristics (TA=25°C)
Symbol BVCBO BVCEO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 Min. -400 -400 Typ. Max. -0.2 -200 -1.2 -900 Unit IC=-100uA, IE=0 IC=-1mA, IB=0 VCB=-400V, IE=0 VCE=-200V, IE=0 VEB=-6V, IC=0 IC=-20mA, IB=-2mA IC=-80mA, IB=-4mA IC=-20mA, IB=-2mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HTL194
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HE6549 Issued Date 1993.04.12 Revised Date 2005.02.15 Page
Saturation Voltage Collector Current
10000
Saturation Voltage (mV)
Current Gain-hFE
1000
VBE(sat) IC=10IB
VCE=10V
VCE(sat) IC=20IB VCE(sat) IC=10IB
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
10000
Capacitance Reverse-Biased Voltage
Voltage (mV)
Capacitance (pF)
1000
VBE(on) VCE=10V
1000
Collector Current-IC (mA)
Reverse-Biased Voltage
Safe Operating Area
1000
Collector Current-IC (mA)
PT=1ms PT=100ms PT=1s
1000
Forward Voltage-VCE
HTL194
HSMC Product Specification
TO-92 Dimension
Spec. HE6549 Issued Date 1993.04.12 Revised Date 2005.02.15 Page
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Control Code
Date Code
Note: Green label used pb-free packing
Style: 1.Emitter 2.Base 3.Collector Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 4.33 4.33 12.70 0.36 3.36 0.36
Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27
Typical, Unit:
3-Lead TO-92 Plastic Package HSMC Package Code:
TO-92 Taping Dimension
F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00
Unit:
F1F2
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTL194 HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HE6549 Issued Date 1993.04.12 Revised Date 2005.02.15 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 5sec ±1sec 5sec ±1sec
+0/-5
HTL194
HSMC Product Specification

Other recent searches


THS6022 - THS6022   THS6022 Datasheet
SON-8 - SON-8   SON-8 Datasheet
MK17-D-2 - MK17-D-2   MK17-D-2 Datasheet
MA807 - MA807   MA807 Datasheet
LM5067 - LM5067   LM5067 Datasheet
ELD-880-535 - ELD-880-535   ELD-880-535 Datasheet
DS21Q59 - DS21Q59   DS21Q59 Datasheet
DS21Q50 - DS21Q50   DS21Q50 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive