HSD468 Epitaxial Planar Transistor Description HSD468 d
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Spec. HE6535 Issued Date 1992.11.25 Revised Date 2006.07.27 Page
HSD468
Epitaxial Planar Transistor
Description
HSD468 designed general purpose frequency power amplifier applications.
TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature. +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TA=25°C) Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current
Electrical Characteristics =25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE
Min.
Typ.
Max.
Unit IC=10uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=20V, IE=0
Test Conditions
IC=0.8A, IB=80mA VCE=2V, IC=500mA VCE=2V, IC=500mA
VCE=2V, IC=500mA VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 120-240
HSD468
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000.0 VCE(sat) IC=10IB
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2006.07.27 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
100.0
VCE=2V 1000 10.0
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Cutoff Frequency
1000
Cutoff Frequency (MHz).
Voltage (mV)
VCE=2V
VBE(ON) VCE=2V
1000
1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
10000 PT=1ms PT=100m
Safe Operating Area
Collector Current-IC (mA)
1000 PT=1s
Capacitance (pF)
1000
Reverse Biased Voltage
Forward Voltage-Vce
HSD468
HSMC Product Specification
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2006.07.27 Page
Power Temperature Derating
1000
Reflow Profile
10+/-2
Power Dissipation (mW)
Temperature(
150+/-30 40+/-20
Case Temperature (°C)
Time(sec)
Temperature Profile Soldering
10+/-2
Temperature(
120+/-20
Time(sec)
HSD468
HSMC Product Specification
TO-92 Dimension
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2006.07.27 Page
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Control Code
Date Code
Note: Green label used pb-free packing
Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 4.33 4.33 12.70 0.36 3.36 0.36
Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27
Typical, Unit:
3-Lead TO-92 Plastic Package HSMC Package Code:
TO-92 Taping Dimension
F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00
Unit:
F1F2
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD468 HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2006.07.27 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly <3oC/sec
Pb-Free Assembly <3oC/sec
100oC 150oC 60~120
150oC 200oC 60~180
<3oC/sec
<3oC/sec
183oC 60~150 +0/-5 10~30 <6oC/sec minutes
217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature 245oC ±5oC 260oC ±5oC
Dipping time 10sec ±1sec 10sec ±1sec
HSD468
HSMC Product Specification
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