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HSC1959 EPITAXIAL PLANAR TRANSISTOR Description HSC1959
Top Searches for this datasheetSpec. HE6524 Issued Date 1993.01.15 Revised Date 2005.02.14 Page HSC1959 EPITAXIAL PLANAR TRANSISTOR Description HSC1959 designed audio frequency power amplifier applications. Features Excellent Linearity TO-92 Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TA=25°C) Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Electrical Characteristics (TA=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 Min. Typ. Max. 0.25 Unit IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=35V, IE=0 VEB=5V, IC=0 IC=100mA, IB=10mA VCE=1V, IC=100mA VCE=1V, IC=100mA VCE=6V, IC=400mA IC=20mA, VCE=6V IE=0, VCB=6V, f=1MHZ *Pulse Test: Pulse Width 380us, Duty Cycle2% Test Conditions HSC1959 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 1000 Spec. HE6524 Issued Date 1993.01.15 Revised Date 2005.02.14 Page Current Gain Collector Current VCE=1V VCE=6V 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 1000 VCE(sat) IC=10IB 1000 Voltage Collector Current Saturation Voltage (mV) Voltage (mV) VBE(ON) VCE=1V Collector Current-IC (mA) 1000 1000 Collector Current-IC (mA) Cutoff Frequency 1000 Capacitance Reverse-Biased Voltage Cutoff Frequency (MHz). VCE=6V Capacitance (pF) 1000 Collector Current (mA) Reverse Biased Voltage HSC1959 HSMC Product Specification Spec. HE6524 Issued Date 1993.01.15 Revised Date 2005.02.14 Page Safe Operating Area 10000 PT=1ms PT=100ms Collector Current-IC (mA) 1000 PT=1s Forward Voltage-VCE HSC1959 HSMC Product Specification TO-92 Dimension Spec. HE6524 Issued Date 1993.01.15 Revised Date 2005.02.14 Page Marking: Free Mark Pb-Free: (Note) Normal: None Control Code Date Code Note: Green label used pb-free packing Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.33 4.33 12.70 0.36 3.36 0.36 Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 Typical, Unit: 3-Lead TO-92 Plastic Package HSMC Package Code: TO-92 Taping Dimension F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 Unit: F1F2 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSC1959 HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HE6524 Issued Date 1993.01.15 Revised Date 2005.02.14 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes Peak temperature Dipping time 5sec ±1sec 5sec ±1sec +0/-5 HSC1959 HSMC Product Specification Other recent searchesTP6W80HFX - TP6W80HFX TP6W80HFX Datasheet Si4423DY - Si4423DY Si4423DY Datasheet PHP110NQ06LT - PHP110NQ06LT PHP110NQ06LT Datasheet MPEG-2 - MPEG-2 MPEG-2 Datasheet MPEG-1 - MPEG-1 MPEG-1 Datasheet KSK-1A35-1520 - KSK-1A35-1520 KSK-1A35-1520 Datasheet AN-937 - AN-937 AN-937 Datasheet 2SD1160 - 2SD1160 2SD1160 Datasheet
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