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HSA733 Epitaxial Planar Transistor Description HSA733 d
Top Searches for this datasheetSpec. HE6507 Issued Date 1992.12.16 Revised Date 2006.07.28 Page HSA733 Epitaxial Planar Transistor Description HSA733 designed driver stage amplifier applications. TO-92 Absolute Maximum Ratings Maximum Temperatures Storage Temperature. +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (TA=25°C) Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current -100 Base Current Electrical Characteristics =25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE Min. -0.55 Typ. -0.18 -0.62 Max. -0.1 -0.1 -0.3 -0.7 Unit IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-60V, IE=0 VEB=-5V, IC=0 Test Conditions IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-1mA VCE=-6V, IC=-10mA VCB=-10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification Rank Range 135-270 200-400 HSA733 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 1000 Spec. HE6507 Issued Date 1992.12.16 Revised Date 2006.07.28 Page Saturation Voltage Collector Current Saturation Voltage (mV) VCE(sat) IC=10IB VCE=6V 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Voltage Collector Current 1000 Cutoff Frequancy Collector Current 1000 Cutoff Frequance (MHz). VCE=6V Voltage (mV) VBE(ON) VCE=6V 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance Reverse-Biased Voltage 10000 PT=1ms 1000 Safe Operating Area Collector Current-IC (mA) PT=100ms Capacitance (pF) PT=1s Reverse-Biased Voltage Forward Voltage-VCE HSA733 HSMC Product Specification Spec. HE6507 Issued Date 1992.12.16 Revised Date 2006.07.28 Page PD-Ta Power Dissipation-PD (mW) Ambient Temperature-Ta HSA733 HSMC Product Specification TO-92 Dimension Spec. HE6507 Issued Date 1992.12.16 Revised Date 2006.07.28 Page Marking: Free Mark Pb-Free: (Note) Normal: None Control Code Date Code Note: Green label used pb-free packing Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 4.33 4.33 12.70 0.36 3.36 0.36 Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27 Typical, Unit: 3-Lead TO-92 Plastic Package HSMC Package Code: TO-92 Taping Dimension F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 Unit: F1F2 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSA733 HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HE6507 Issued Date 1992.12.16 Revised Date 2006.07.28 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly <3oC/sec Pb-Free Assembly <3oC/sec 100oC 150oC 60~120 150oC 200oC 60~180 <3oC/sec <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes Peak temperature 245oC ±5oC 260oC ±5oC Dipping time 10sec ±1sec 10sec ±1sec HSA733 HSMC Product Specification Other recent searchesUIS5022HC - UIS5022HC UIS5022HC Datasheet tfs243 - tfs243 tfs243 Datasheet SM312CVGQD - SM312CVGQD SM312CVGQD Datasheet Si2335DS - Si2335DS Si2335DS Datasheet SCAS666C - SCAS666C SCAS666C Datasheet PIC16CXXX - PIC16CXXX PIC16CXXX Datasheet Ni20U-MT30H-AP6X-H1141 - Ni20U-MT30H-AP6X-H1141 Ni20U-MT30H-AP6X-H1141 Datasheet IS93C46B - IS93C46B IS93C46B Datasheet AMTNE08027 - AMTNE08027 AMTNE08027 Datasheet
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