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HMJE13007A EPITAXIAL PLANAR TRANSISTOR Description High
Top Searches for this datasheetSpec. HE200501 Issued Date 2005.06.01 Revised Date 2007.03.06 Page HMJE13007A EPITAXIAL PLANAR TRANSISTOR Description High Voltage, High Speed Power Switch Switch Regulators Inverters Motor Controls Solenoid Relay Drivers Deflection Circuits TO-220 Absolute Maximum Ratings (TA=25°C) Maximum Temperatures Storage Temperature. +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C). Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage. VCEO Collector Emitter Voltage VEBO Emitter Base Voltage. Collector Current (Continuous) Base Current (Continuous) Electrical Characteristics (TA=25°C) Characteristic Breakdown Collector-Base Voltage Breakdown Collector-Emitter Voltage Emitter Cut-off Current Collector Cut-off Current Symbol BVCBO BVCEO IEBO ICEX *VCE(sat)1 Collector-Emitter Saturation Voltage *VCE(sat)2 *VCE(sat)3 Base-Emitter Saturation Voltage *VBE(sat) *VBE(sat) *hFE1 Current Gain *hFE2 *hFE3 Min. Typ. Max. Unit IC=1mA IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=2A, IB=0.4A IC=5A, IB=1A IC=8A, IB=2A IC=2A, IB=0.4A IC=5A, IB=1A IC=0.5A, VCE=5V IC=2A, VCE=5V IC=4A, VCE=5V *Pulse Test: Pulse Width 380us, Duty Cycle2% Test Conditions HMJE13007A HSMC Product Specification Characteristics Curve Current Gain Collector Current Spec. HE200501 Issued Date 2005.06.01 Revised Date 2007.03.06 Page Saturation Voltage Collector Current 10000 VCE(sat) IB=5IB Saturation Voltage (mV) 1000 VCE=5V 1000 10000 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 10000 VCE(sat) IC=4IB 10000 Saturation Voltage Collector Current VBE(sat) IC=5IB 1000 Saturation Voltage (mV) Saturation Voltage (mV) 1000 1000 10000 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Switchange Time Collector Current VCC=125V, IC=5IB1, IC=2IB2 1000 Collector Output Capacitance Switching Time (uS). Capacitance (pF) Tstg Collector Current-IC Collector Base Voltage HMJE13007A HSMC Product Specification Spec. HE200501 Issued Date 2005.06.01 Revised Date 2007.03.06 Page Safe Operating Area 10000 Collector Current-IC (mA) 1000 100mS 1000 Forward Voltage-VCE HMJE13007A HSMC Product Specification TO-220AB Dimension Marking: Free Mark Pb-Free: (Note) Normal: None Spec. HE200501 Issued Date 2005.06.01 Revised Date 2007.03.06 Page 13007A Control Code Date Code Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 Typical, Unit: 3-Lead TO-220AB Plastic Package HSMC Package Code: Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMJE13007A HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10 C~35 Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HE200501 Issued Date 2005.06.01 Revised Date 2007.03.06 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec Pb-Free Assembly C/sec 60~120 60~180 C/sec C/sec 60~150 +0/-5 10~30 C/sec minutes 60~150 +0/-5 20~40 C/sec minutes Peak temperature Dipping time 10sec ±1sec 10sec ±1sec HMJE13007A HSMC Product Specification Other recent searchesTCST5250 - TCST5250 TCST5250 Datasheet LH28F800BVE-BV85 - LH28F800BVE-BV85 LH28F800BVE-BV85 Datasheet HM62W4100HC - HM62W4100HC HM62W4100HC Datasheet HCPL-2601 - HCPL-2601 HCPL-2601 Datasheet 2611 - 2611 2611 Datasheet HCPL-2630 - HCPL-2630 HCPL-2630 Datasheet 2631 - 2631 2631 Datasheet 4661 - 4661 4661 Datasheet EPCB3HSF-50744 - EPCB3HSF-50744 EPCB3HSF-50744 Datasheet
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