HMJE13007 EPITAXIAL PLANAR TRANSISTOR Description High
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Spec. HE200207 Issued Date 1993.04.12 Revised Date 2007.03.06 Page
HMJE13007
EPITAXIAL PLANAR TRANSISTOR
Description
High Voltage, High Speed Power Switch Switch Regulators Inverters Motor Controls Solenoid Relay Drivers Deflection Circuits TO-220
Absolute Maximum Ratings (TA=25°C)
Maximum Temperatures Storage Temperature. +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C). Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage. VCEO Collector Emitter Voltage VEBO Emitter Base Voltage. Collector Current (Continuous) Base Current (Continuous)
Electrical Characteristics (TA=25°C)
Characteristic Breakdown Collector-Base Voltage Breakdown Collector-Emitter Voltage Emitter Cut-off Current Collector Cut-off Current Symbol BVCBO BVCEO IEBO ICEX *VCE(sat)1 Collector-Emitter Saturation Voltage *VCE(sat)2 *VCE(sat)3 Base-Emitter Saturation Voltage *VBE(sat) *VBE(sat) *hFE1 Current Gain *hFE2 *hFE3 *hFE4 Min. Typ. Max. Unit IC=1mA IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=2A, IB=0.4A IC=5A, IB=1A IC=8A, IB=2A IC=2A, IB=0.4A IC=5A, IB=1A IC=0.5A, VCE=5V IC=1.0A, VCE=5V IC=2A, VCE=5V IC=8A, VCE=5V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HMJE13007
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
Spec. HE200207 Issued Date 1993.04.12 Revised Date 2007.03.06 Page
Saturation Voltage Collector Current
10000 VCE(sat) IB=5IB
Saturation Voltage (mV)
1000
VCE=5V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
10000 VCE(sat) IC=4IB 10000
Saturation Voltage Collector Current
VBE(sat) IC=5IB
1000
Saturation Voltage (mV)
Saturation Voltage (mV)
1000
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Switchange Time Collector Current
VCC=125V, IC=5IB1, IC=2IB2 1000
Collector Output Capacitance
Switching Time (uS).
Capacitance (pF)
Tstg
Collector Current-IC
Collector Base Voltage
HMJE13007
HSMC Product Specification
Spec. HE200207 Issued Date 1993.04.12 Revised Date 2007.03.06 Page
Safe Operating Area
10000
Collector Current-IC (mA)
1000 100mS
1000
Forward Voltage-VCE
HMJE13007
HSMC Product Specification
TO-220AB Dimension
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Spec. HE200207 Issued Date 1993.04.12 Revised Date 2007.03.06 Page
13007 Control Code
Date Code
Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter
Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48
Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87
Typical, Unit:
3-Lead TO-220AB Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13007
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10 C~35 Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HE200207 Issued Date 1993.04.12 Revised Date 2007.03.06 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec
Pb-Free Assembly C/sec
60~120
60~180
C/sec
C/sec
60~150 +0/-5 10~30 C/sec minutes
60~150 +0/-5 20~40 C/sec minutes
Peak temperature
Dipping time 10sec ±1sec 10sec ±1sec
HMJE13007
HSMC Product Specification
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