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HMJE13003D EPITAXIAL PLANAR TRANSISTOR Description High
Top Searches for this datasheetSpec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page HMJE13003D EPITAXIAL PLANAR TRANSISTOR Description High Voltage, High Speed Power Switch Switch Regulators Inverters Motor Controls Solenoid Relay Drivers Deflection Circuits TO-126ML Absolute Maximum Ratings (TA=25°C) Maximum Temperatures Storage Temperature. +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C). Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage. VCEO Collector Emitter Voltage VEBO Emitter Base Voltage. Collector Current (Continuous) Base Current (Continuous) 0.75 Electrical Characteristics (TA=25°C) Characteristic Breakdown Collector-Base Voltage Breakdown Collector-Emitter Voltage Emitter Cut-off Current Collector Cut-off Current Symbol BVCBO BVCEO IEBO ICEX *VCE(sat)1 Collector-Emitter Saturation Voltage *VCE(sat)2 *VCE(sat)3 Base-Emitter Saturation Voltage *VBE(sat) *VBE(sat) Current Gain *hFE1 *hFE2 Min. Typ. Max. Unit IC=1mA IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=1.5A, IB=0.5A IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=0.3A, VCE=5V IC=1A, VCE=5V *Pulse Test: Pulse Width 380us, Duty Cycle2% Test Conditions HMJE13003D HSMC Product Specification Characteristics Curve Current Gain Collector Current Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page Saturation Voltage Collector Current 1000 VCE(s IC=3IB Saturation Voltage (mV) VCE=5V Collector Current-IC (mA) 1000 10000 1000 10000 Collector Current-IC (mA) Saturation Voltage Collector Current 10000 VCE(sat) IC=4IB 10000 Saturation Voltage Collector Current VCE(sat) IC=5IB Saturation Voltage (mV) 1000 Saturation Vpltage (mV) 1000 1000 10000 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage Collector Current 10000 VBE(sat) IC=4IB 10000 Saturation Voltage Collector Current VBE(s IC=5IB Saturation Voltage (mV) Saturation Voltage (mV) 1000 1000 1000 10000 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) HMJE13003D HSMC Product Specification Characteristics Curve Safe Operating Area 10000 Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page PT=1mS Collector Current (mA) 1000 PT=10mS PT=1S 1000 Forward Voltage-V HMJE13003D HSMC Product Specification TO-126ML Dimension Marking: Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page Free Mark 13003 Date Code Pb-Free: (Note) Normal: None Control Code Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Min. 7.74 10.87 0.88 1.28 3.50 2.61 1.18 2.88 0.68 3.44 1.88 0.50 Max. 8.24 11.37 1.12 1.52 3.75 3.37 1.42 3.12 0.84 2.30 3.70 2.14 0.51 Typical, Unit: 3-Lead TO-126ML Plastic Package HSMC Package Code: Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMJE13003D HSMC Product Specification Soldering Methods HSMC's Products Storage environment: Temperature=10 C~35 Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile Ramp-up Tsmax Temperature Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page Critical Zone Tsmin Preheat Ramp-down 25oC Peak Time Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices. Sn-Pb Eutectic Assembly C/sec 60~120 C/sec 60~150 +0/-5 10~30 C/sec minutes Pb-Free Assembly C/sec 60~180 C/sec 60~150 +0/-5 20~40 C/sec minutes Peak temperature Dipping time 10sec ±1sec 10sec ±1sec HMJE13003D HSMC Product Specification Other recent searchesTK83361M - TK83361M TK83361M Datasheet PBLP-39 - PBLP-39 PBLP-39 Datasheet LMH7322 - LMH7322 LMH7322 Datasheet JCH10 - JCH10 JCH10 Datasheet IRS21850 - IRS21850 IRS21850 Datasheet IRS21851SPbF - IRS21851SPbF IRS21851SPbF Datasheet HD74HC190 - HD74HC190 HD74HC190 Datasheet HD74HC191 - HD74HC191 HD74HC191 Datasheet AN2827 - AN2827 AN2827 Datasheet 1761692001 - 1761692001 1761692001 Datasheet
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