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HMJE13003D EPITAXIAL PLANAR TRANSISTOR Description High


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Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page
HMJE13003D
EPITAXIAL PLANAR TRANSISTOR
Description
High Voltage, High Speed Power Switch Switch Regulators Inverters Motor Controls Solenoid Relay Drivers Deflection Circuits TO-126ML
Absolute Maximum Ratings (TA=25°C)
Maximum Temperatures Storage Temperature. +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C). Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage. VCEO Collector Emitter Voltage VEBO Emitter Base Voltage. Collector Current (Continuous) Base Current (Continuous) 0.75
Electrical Characteristics (TA=25°C)
Characteristic Breakdown Collector-Base Voltage Breakdown Collector-Emitter Voltage Emitter Cut-off Current Collector Cut-off Current Symbol BVCBO BVCEO IEBO ICEX *VCE(sat)1 Collector-Emitter Saturation Voltage *VCE(sat)2 *VCE(sat)3 Base-Emitter Saturation Voltage *VBE(sat) *VBE(sat) Current Gain *hFE1 *hFE2 Min. Typ. Max. Unit IC=1mA IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=1.5A, IB=0.5A IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=0.3A, VCE=5V IC=1A, VCE=5V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HMJE13003D
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page
Saturation Voltage Collector Current
1000 VCE(s IC=3IB
Saturation Voltage (mV)
VCE=5V
Collector Current-IC (mA) 1000 10000
1000 10000
Collector Current-IC (mA)
Saturation Voltage Collector Current
10000 VCE(sat) IC=4IB 10000
Saturation Voltage Collector Current
VCE(sat) IC=5IB
Saturation Voltage (mV)
1000
Saturation Vpltage (mV)
1000
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
10000 VBE(sat) IC=4IB 10000
Saturation Voltage Collector Current
VBE(s IC=5IB
Saturation Voltage (mV)
Saturation Voltage (mV)
1000
1000
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
HMJE13003D
HSMC Product Specification
Characteristics Curve
Safe Operating Area
10000
Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page
PT=1mS
Collector Current (mA)
1000 PT=10mS PT=1S
1000
Forward Voltage-V
HMJE13003D
HSMC Product Specification
TO-126ML Dimension
Marking:
Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page
Free Mark 13003 Date Code
Pb-Free: (Note) Normal: None
Control Code
Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 7.74 10.87 0.88 1.28 3.50 2.61 1.18 2.88 0.68 3.44 1.88 0.50
Max. 8.24 11.37 1.12 1.52 3.75 3.37 1.42 3.12 0.84 2.30 3.70 2.14 0.51
Typical, Unit:
3-Lead TO-126ML Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13003D
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10 C~35 Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HD200207 Issued Date 1993.04.12 Revised Date 2007.09.04 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 60~120 C/sec 60~150 +0/-5 10~30 C/sec minutes
Pb-Free Assembly C/sec 60~180 C/sec 60~150 +0/-5 20~40 C/sec minutes
Peak temperature
Dipping time 10sec ±1sec 10sec ±1sec
HMJE13003D
HSMC Product Specification

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