HD122 EPITAXIAL SILICON DARLINGTON TRANSISTOR Description
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Spec. HD200101 Issued Date 1998.12.01 Revised Date 2006.07.19 Page
HD122
EPITAXIAL SILICON DARLINGTON TRANSISTOR
Description
HD122 designed medium power linear switching applications.
Absolute Maximum Ratings (TA=25°C)
TO-126ML
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage. BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage. Collector Current Collector Current (Pulse)
Electrical Characteristics (TA=25°C)
Symbol BVCBO BVEBO ICEO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Min. 1000 1000 Typ. Max. Unit IC=1mA IE=1mA VCE=50V VCB=100V VBE=5V IC=1.5A, IB=30mA IC=2A, IB=40mA IC=3A, VCE=3V IC=0.5A, VCE=3V IC=3A, VCE=3V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HD122
HSMC Product Specification
Characteristics Curve
Collector Gain Collector Current
10000 10000
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2006.07.19 Page
Sturation Voltage Collector Current
25°C VCE=4V -40°C VCE=4V
Sturation Voltage (mV)
1000
-40°C VCE(s IC=100IB 1000 25°C VCE(s IC=100IB
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Sturation Voltage Collector Current
10000 10000
Voltage Collector Current
Sturation Voltage (mV)
-40°C VBE(sat) IC=100IB
1000
25°C VBE(s IC=100IB
Voltage (mV)
-40°C VBE(on) VCE=4V
1000
25°C VBE(on) VCE=4V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Switching Time Collector Current
VCC=30V, IC=250, IB1= -250IB2 1000
Capacitance Reverse-Biased Voltage
Switching Times (us)
Tstg
Capacitance (pF)
Collector Current-IC
Reverse-Biased Voltage
HD122
HSMC Product Specification
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2006.07.19 Page
Safe Operating Area
100000 PT=1ms
Power Derating
PD/PD(max) Normalized Power Dissipation
10000
Collector Current-IC (mA)
PT=100ms 1000 PT=1s
Forward-VCE
Temperature (°C) Ta/Tc
HD122
HSMC Product Specification
TO-126ML Dimension
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2006.07.19 Page
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Date Code Control Code
Note: Green label used pb-free packing Style: 1.Emitter 2.Collector 3.Base Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 7.74 10.87 0.88 1.28 3.50 2.61 1.18 2.88 0.68 3.44 1.88 0.50
Max. 8.24 11.37 1.12 1.52 3.75 3.37 1.42 3.12 0.84 2.30 3.70 2.14 0.51
Typical, Unit:
3-Lead TO-126ML Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HD122
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2006.07.19 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 10sec ±1sec 10sec ±1sec
HD122
HSMC Product Specification
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