HBC558 EPITAXIAL PLANAR TRANSISTOR Description HBC558 d
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Spec. HA200104 Issued Date 2001.10.01 Revised Date 2004.07.16 Page
HBC558
EPITAXIAL PLANAR TRANSISTOR
Description
HBC558 designed switching amplifier amplification suitable automatic insertion thick thin-film circuits.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature. +150 Junction Temperature. +150 Maximum Power Dissipation Total Power Dissipation (TA=25°C). Maximum Voltages Currents (TA=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current -100
Electrical Characteristics (TA=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE Min. -600 Typ. -250 -700 -900 Max. -300 -650 -750 -800 Unit IC=-100uA IC=-1mA IE=-10uA VCB=-30V IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA VCE=-5V, IB=-2mA VCE=-5V, IB=-10mA VCE=-5V, IC=-2mA VCE=-5V, IC=-10mA VCB=-10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
Classification
Rank 110-220 200-450 420-800
HBC558
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HA200104 Issued Date 2001.10.01 Revised Date 2004.07.16 Page
Saturation Voltage Collector Current
10000
1000
Saturation Voltage (mV)
VCE=5V
CE(sat) IC=20IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage Collector Current
10000
10000
Voltage Collector Current
Saturation Voltage (mV)
Voltage (mV)
1000 BE(sat) IC=20IB
1000 BE(on) CE=5V
1000
1000
Collector Current (mA)
Collector Current (mA)
Cutoff Frequency Collector Current
1000
Cutoff Frequency (MHz)
VCE=5V
1000
Collector Current (mA)
HBC558
HSMC Product Specification
TO-92 Dimension
Spec. HA200104 Issued Date 2001.10.01 Revised Date 2004.07.16 Page
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Control Code
Date Code
Note: Green label used pb-free packing
Style: 1.Collector 2.Base 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 4.33 4.33 12.70 0.36 3.36 0.36
Max. 4.83 4.83 0.56 *1.27 3.76 0.56 *2.54 *1.27
Typical, Unit:
3-Lead TO-92 Plastic Package HSMC Package Code:
TO-92 Taping Dimension
F1,F2 Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 Max. 4.83 4.20 0.53 4.83 2.90 16.50 9.50 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00
Unit:
F1F2
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC558 HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HA200104 Issued Date 2001.10.01 Revised Date 2004.07.16 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 5sec ±1sec 5sec ±1sec
+0/-5
HBC558
HSMC Product Specification
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