GaAs MMIC MIXER HMC256 ideal for: Microwave Radio VSAT Featu

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GaAs MMIC MIXER HMC256 ideal for: Microwave Radio VSAT Featu

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HMC256
GaAs MMIC MIXER
HMC256 ideal for: Microwave Radio VSAT
Features
High Image Rejection: Input IP3: Wideband Size:
MIXERS MIXERS CHIP
Test Instrumentation Military Radios Radar Space
Functional Diagram
General Description
HMC256 chip compact, 2.08 mm2, Mixer MMIC which used Image Reject Mixer (IRM) Single Sideband (SSB) upconverter. chip utilizes standard Hittite double-balanced mixer cells Lange Coupler realized GaAs MESFET technology. data with chip test fixture connected 0.025 mil) diameter wire bonds minimal length <0.51 (<20 mils). frequency quadrature hybrid used interface MMIC ports output. This provides example Mixer application. used from GHz. This Mixer more reliable, much smaller replacement hybrid drop-in style Mixer assemblies.
Electrical Specifi cations, +25°
Parameter Min. Frequency Range, Frequency Range, Frequency Range, Conversion Loss Noise Figure (SSB) Image Rejection (IR) Isolation Isolation Isolation (Input) Gain Compression (Input) Typ. 10.5 10.5 Max. Min. Typ. 11.7 11.7 10.5 10.5 Max. Units
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC256
GaAs MMIC MIXER
Conversion Gain Desired Sideband Temperature dBm,
CONVERSION GAIN (dB)
Conversion Gain Desired Sideband Drive,
CONVERSION GAIN (dB)
-40C +25C +85C
FREQUENCY (GHz)
FREQUENCY (GHz)
Image Rejection Temperature dBm,
Image Rejection Drive,
IMAGE REJECTION (dB)
IMAGE REJECTION (dB)
-30C +25C +85C
FREQUENCY (GHz)
FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
MIXERS MIXERS CHIP
HMC256
GaAs MMIC MIXER
Return Loss
Isolations
ISOLATION (dB)
RF/IF LO/IF LO/RF
MIXERS MIXERS CHIP
RETURN LOSS (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Bandwidth
CONVERSION GAIN RETURN LOSS (dB) FREQUENCY (GHz)
Conversion Gain Return Loss
Input Drive,
THIRD ORDER INTERCEPT (dBm)
FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC256
GaAs MMIC MIXER
Absolute Maximum Ratings
Input Drive Channel Temperature Continuous Pdiss (derate 9.36 mW/°C above Thermal Resistance (RTH) (junction bottom) Storage Temperature Operating Temperature 0.61 106.8 °C/W +150
MIXERS MIXERS CHIP
NOTES: DIMENSIONS INCHES [MM]. BOND PADS .004" SQUARE. TYPICAL BOND SPACING CENTER CENTER .006". BACKSIDE METALLIZATION: GOLD. BOND METALLIZATION: GOLD. BACKSIDE METAL GROUND. CONNECTION REQUIRED UNLABELED BOND PADS.
Outline Drawing
Packaging Information
Standard WP-3 Alternate
Refer "Packaging Information" section packaging dimensions. alternate packaging information contact Hittite Microwave Corporation.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC256
GaAs MMIC MIXER
Descriptions
Number Function Description Interface Schematic
MIXERS MIXERS CHIP
This coupled matched Ohm.
This coupled matched Ohm.
IF1,
This coupled. operation must sink/source more than current failure result.
Backside
backside must connect ground.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC256
GaAs MMIC MIXER
Image Reject Mixer Suggested Application Circuit
Below Figure photo Figure schematic HMC256 image reject mixer MMIC connected quadrature hybrid (120 MHz) manufactured Merrimac Industries West Caldwell, (P/N QHZ-2A-120). Data presented HMC256 MMIC obtained using circuit described here. Please note that image rejection isolation performance dependent selection frequency hybrid. performance specification frequency quadrature hybrid well phase balance VSWR interface circuit HMC256 MMIC will effect overall performance.
MIXERS MIXERS CHIP
Figure Complete Assembly
Figure Schematic HMC256 MMIC Connected Quadrature Hybrid
Handling Precautions
Follow these precautions avoid permanent damage. Storage: bare placed either Waffle based protective containers, then sealed protective shipment. Once sealed protective been opened, should stored nitrogen environment. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers.
Mounting
chip back-metallized mounted with AuSn eutectic preforms with electrically conductive epoxy. mounting surface should clean flat. Eutectic Attach: 80/20 gold preform recommended with work surface temperature tool temperature When 90/10 nitrogen/hydrogen applied, tool temperature should expose chip temperature greater than more than seconds. more than seconds scrubbing should required attachment. Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule.
Wire Bonding
Ball wedge bond with 0.025 mil) diameter pure gold wire. Thermosonic wirebonding with nominal stage temperature ball bonding force grams wedge bonding force grams recommended. minimum level ultrasonic energy achieve reliable wirebonds. Wirebonds should started chip terminated package substrate. bonds should short possible <0.31 mils).
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com

GaAs MMIC MIXER HMC256 ideal for: Microwave Radio VSAT Featu

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