v03.0907 GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT Features

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v03.0907 GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT Features

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HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Features
Conversion Loss: 3Fo, Isolation: Passive: Bias Required
FREQUENCY MULTIPLIERS PASSIVE CHIP
HMC205 suitable for: Wireless Local Loop LMDS, VSAT, Point-to-Point Radios Test Equipment
Functional Diagram
General Description
HMC205 passive miniature frequency doubler MMIC die. Suppression undesired fundamental higher order harmonics typical with respect input signal level. doubler utilizes same GaAs Schottky diode/balun technology found Hittite MMIC mixers. features small size, bias, measurable additive phase noise onto multiplied signal.
Electrical Specifi cations, +25° Function Drive Level
Input Parameter Frequency Range, Input Frequency Range, Output Conversion Loss Isolation (with respect input level) Isolation (with respect input level) Isolation (with respect input level) Min. Typ. 12.0 14.0 24.0 Max. Min. Input Typ. 12.0 12.0 24.0 Max. Min. Input Typ. 12.0 12.0 24.0 Max. Units
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Conversion Gain Temperature Drive Level
Isolation Drive Level*
2*F0 3*F0 4*F0
CONVERSION GAIN (dB)
ISOLATION (dB)
INPUT FREQUENCY (GHz)
FREQUENCY (GHz)
*With respect input level
Input Return Loss Drive Level
Output Return Loss Several Input Frequencies
RETURN LOSS (dB)
RETURN LOSS (dB)
FREQUENCY (GHz)
OUTPUT FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
FREQUENCY MULTIPLIERS PASSIVE CHIP
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Conversion Gain 25°C Drive Level Output Return Loss with Input
CONVERSION GAIN (dB)
RETURN LOSS (dB) INPUT FREQUENCY (GHz)
FREQUENCY MULTIPLIERS PASSIVE CHIP
OUTPUT FREQUENCY (GHz)
Conversion Gain -55°C Drive Level
CONVERSION GAIN (dB)
Output Return Loss with Input
INPUT FREQUENCY (GHz)
RETURN LOSS (dB)
OUTPUT FREQUENCY (GHz)
Conversion Gain +85°C Drive Level
CONVERSION GAIN (dB)
Output Return Loss with Input
RETURN LOSS (dB)
INPUT FREQUENCY (GHz)
OUTPUT FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Absolute Maximum Ratings
Input Drive Storage Temperature Operating Temperature +150
FREQUENCY MULTIPLIERS PASSIVE CHIP
NOTES: DIMENSIONS INCHES [MM] BOND PADS .004" SQUARE TYPICAL BOND SPACING CENTER CENTER .006" EXCEPT SHOWN. BACKSIDE METALLIZATION: GOLD BACKSIDE METAL GROUND. BOND METALLIZATION: GOLD
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Packaging Information
Standard WP-2 Alternate
Refer "Packaging Information" section packaging dimensions. alternate packaging information contact Hittite Microwave Corporation.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Desciption
FREQUENCY MULTIPLIERS PASSIVE CHIP
Number
Function
Description
Interface Schematic
RFIN
coupled matched Ohm.
RFOUT
coupled matched Ohm.
Bottom
bottom must connected RF/DC ground.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC205
v03.0907
GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT
Handling Precautions
Follow these precautions avoid permanent damage. Storage: bare placed either Waffle based protective containers, then sealed protective shipment. Once sealed protective been opened, should stored nitrogen environment. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers.
FREQUENCY MULTIPLIERS PASSIVE CHIP
Mounting
chip back-metallized mounted with AuSn eutectic preforms with electrically conductive epoxy. mounting surface should clean flat. Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule.
Wire Bonding
Ball wedge bond with diameter pure gold wire. Thermosonic wirebonding wiht nominal stage temperature ball bonding force grams wedge bonding force grams recommended. minimum level ultrasonic energy achieve reliable wirebonds. Wirebonds should started chip terminated package. bonds should short possible.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com

v03.0907 GaAs MMIC PASSIVE FREQUENCY DOUBLER, INPUT Features

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