| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
January 2009 4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M, H11
Top Searches for this datasheet4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers January 2009 4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M, H11A1M, H11A2M, H11A3M, H11A4M, H11A5M General Purpose 6-Pin Phototransistor Optocouplers recognized (File E90700, Volume recognized (File 102497) Description general purpose optocouplers consist gallium arsenide infrared emitting diode driving silicon phototransistor 6-pin dual in-line package. option (e.g., 4N25VM) Applications Power supply regulators Digital logic inputs Microprocessor inputs Schematic Package Outlines ANODE CATHODE CONNECTION EMITTER COLLECTOR BASE ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Absolute Maximum Ratings 25°C unless otherwise specified) Stresses exceeding absolute maximum ratings damage device. device function operable above recommended operating conditions stressing parts these levels recommended. addition, extended exposure stresses above recommended operating conditions affect device reliability. absolute maximum ratings stress ratings only. Symbol TOTAL DEVICE TSTG TOPR TSOL EMITTER IF(pk) DETECTOR VCEO VCBO VECO Collector-Emitter Voltage Collector-Base Voltage Emitter-Collector Voltage Storage Temperature Operating Temperature Parameter Value +150 +100 2.94 1.41 1.76 Units Wave solder temperature (see page reflow solder profile) Total Device Power Dissipation 25°C Derate above 25°C DC/Average Forward Input Current Reverse Input Voltage Forward Current Peak (300µs, Duty Cycle) Power Dissipation 25°C Derate above 25°C mW/°C mW/°C Detector Power Dissipation 25°C Derate above 25°C Electrical Characteristics 25°C unless otherwise specified) Individual Component Characteristics Symbol EMITTER DETECTOR BVCEO BVCBO BVECO ICEO ICBO Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Collector-Base Dark Current Capacitance 1.0mA, 100µA, 100µA, 10V, Input Forward Voltage Reverse Leakage Current 10mA 6.0V 1.18 0.001 1.50 Parameter Test Conditions Min. Typ.* Max. Unit Isolation Characteristics Symbol VISO RISO CISO Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance Test Conditions 60Hz, VI-O VI-O 1MHz Min. 7500 1011 Typ.* Max. Units Vac(pk) *Typical values 25°C ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Electrical Characteristics (Continued) 25°C unless otherwise specified) Transfer Characteristics Symbol Parameter Current Transfer Ratio, Collector Emitter Test Conditions 10mA, Device 4N35M, 4N36M, 4N37M H11A1M H11A5M 4N25M, 4N26M H11A2M, H11A3M 4N27M, 4N28M H11A4M Min. Typ.* Max. Unit CHARACTERISTICS 10mA, 10V, -55°C 10mA, 10V, +100°C (SAT) Collector-Emitter Saturation Voltage 2mA, 50mA 0.5mA, 10mA 4N35M, 4N36M, 4N37M 4N35M, 4N36M, 4N37M 4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M H11A1M, H11A2M, H11A3M, H11A4M, H11A5M CHARACTERISTICS Non-Saturated Turn-on Time 10mA, 10V, (Fig. 4N25M, 4N26M, 4N27M, 4N28M, H11A1M, H11A2M, H11A3M, H11A4, H11A5M 4N35M, 4N36M, 4N37M 4N25M, 4N26M, 4N27M, 4N28M, H11A1M, H11A2M, H11A3M, H11A4M, H11A5M 4N35M, 4N36M, 4N37M 2mA, 10V, (Fig. TOFF Turn-off Time 10mA, 10V, (Fig. 2mA, 10V, (Fig. Typical values 25°C ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Typical Performance Curves Fig. Forward Voltage Forward Current 5.0V 25°C Normalized Fig. Normalized Forward Current FORWARD VOLTAGE NORMALIZED -55°C 25°C 100°C FORWARD CURRENT (mA) FORWARD CURRENT (mA) Fig. Normalized Ambient Temperature Fig. (Unsaturated) NORMALIZED CTRRBE CTRRBE(OPEN)) NORMALIZED Normalized 25°C 1000 AMBIENT TEMPERATURE (°C) RBE- BASE RESISTANCE Fig. (Saturated) Fig. Collector-Emitter Saturation Voltage Collector Current NORMALIZED CTRRBE CTRRBE(OPEN)) VCE= (SAT) COLLECTOR-EMITTER SATURATION VOLTAGE 25°C 0.01 1000 0.001 0.01 RBE- BASE RESISTANCE COLLECTOR CURRENT (mA) ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Typical Performance Curves (Continued) Fig. Switching Speed Load Resistor 1000 25°C 1000 10000 100000 Fig. Normalized Toff R-LOAD RESISTOR NORMALIZED (ton(RBE) ton(open)) SWITCHING SPEED (µs) RBE- BASE RESISTANCE Fig. Normalized toff Fig. Dark Current Ambient Temperature ICEO COLLECTOR -EMITTER DARK CURRENT (nA) 10000 25°C NORMALIZED toff (toff(RBE) toff(open)) 1000 10000 100000 1000 0.01 0.001 RBE- BASE RESISTANCE AMBIENT TEMPERATURE (°C) TEST CIRCUIT WAVE FORMS INPUT PULSE INPUT Adjust produce toff OUTPUT PULSE OUTPUT Figure Switching Time Test Circuit Waveforms ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Package Dimensions Through Hole 8.13-8.89 0.4" Lead Spacing 8.13-8.89 6.10-6.60 6.10-6.60 5.08 (Max.) 3.28-3.53 0.25-0.36 7.62 (Typ.) 5.08 (Max.) 3.28-3.53 0.25-0.36 0.38 (Min.) 2.54-3.81 0.38 (Min.) 0.20-0.30 2.54-3.81 (0.86) 0.41-0.51 1.02-1.78 0.76-1.14 2.54 (Bsc) (Typ.) (0.86) 0.41-0.51 1.02-1.78 0.76-1.14 10.16-10.80 2.54 (Bsc) 0.20-0.30 Surface Mount 8.13-8.89 (1.78) (1.52) (2.54) 6.10-6.60 8.43-9.90 (7.49) (10.54) (0.76) Rcommended Layout 0.25-0.36 3.28-3.53 5.08 (Max.) 0.38 (Min.) 2.54 (Bsc) (0.86) 0.41-0.51 1.02-1.78 0.76-1.14 0.16-0.88 (8.13) 0.20-0.30 Note: dimensions ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Ordering Information Option option SR2V Order Entry Identifier (Example) 4N25M 4N25SM 4N25SR2M 4N254N25VM 4N25TVM 4N25SVM 4N25SR2VM Description Standard Through Hole Device Surface Mount Lead Bend Surface Mount; Tape Reel 0.4" Lead Spacing 0884 0884, 0.4" Lead Spacing 0884, Surface Mount 0884, Surface Mount, Tape Reel Marking Information 4N25 Definitions Fairchild logo Device number mark (Note: Only appears parts ordered with option order entry table) digit year code, e.g., digit work week ranging from `01' `53' Assembly package code *Note Parts that have option (see definition above) that marked with date code `325' earlier marked portrait format. ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers Carrier Tape Specification 12.0 0.20 0.05 0.30 0.05 1.75 0.10 11.5 21.0 0.20 24.0 10.1 0.20 0.1/-0 User Direction Feed Reflow Profile Time above 183°C >245°C 260°C 1.822°C/Sec Ramp rate Time ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com 4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers TRADEMARKS following includes registered unregistered trademarks service marks, owned Fairchild Semiconductor and/or global subsidiaries, intended exhaustive list such trademarks. Build Transfer LogicEcoSPARK® EfficentMaxEZSWITCH* Fairchild® Fairchild Semiconductor® FACT Quiet Series® FACT FAST® FastvCoreFlashWriter® FPSF-PFS FRFET® Global Power Resource Green FPSGreen OPTOPLANAR® Programmable Active DroopQFET® QSQuiet SeriesRapidConfigureSaving world, 1mW/W/kW timeSmartMaxSMART STARTSPM® STEALTHSuperFETSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SupreMOSSyncFET TinyBoostTinyBuckTinyLogic® DetectµSerDes SPMPower-SPMPowerTrench® PowerXS Ultra FRFETUniFETVCXVisualMaxXS Power Franchise® EZSWITCHand FlashWriter® trademarks System General Corporation, used under license Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION, DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. THESE SPECIFICATIONS EXPAND TERMS WORLDWIDE TERMS CONDITIONS, SPECIFICALLY WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support, device, system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy also stated external website, www.fairchildsemi.com, under Sales Support. Counterfeiting semiconductor parts growing problem industry. manufacturers semiconductor products experiencing counterfeiting their parts. Customers inadvertently purchase counterfeit parts experience many problems such loss brand reputation, substandard performance, failed applications, increased cost production manufacturing delays. Fairchild taking strong measures protect ourselves customers from proliferation counterfeit parts. Fairchild strongly encourages customers purchase Fairchild parts either directly from Fairchild from Authorized Fairchild Distributors listed country page cited above. Products customers either from Fairchild directly from Authorized Fairchild Distributors genuine parts, have full traceability, meet Fairchild's quality standards handling storage provide access Fairchild's full range up-to-date technical product information. Fairchild Authorized Distributors will stand behind warranties will appropriately address warranty issues that arise. Fairchild will provide warranty coverage other assistance parts bought from Unauthorized Sources. Fairchild committed combat this global problem encourage customers their part stopping this practice buying direct from authorized distributors. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Preliminary Identification Needed Obsolete Product Status Formative Design First Production Full Production Production Definition Datasheet contains design specifications product development. Specifications change manner without notice. Datasheet contains preliminary data; supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice improve design. Datasheet contains specifications product that discontinued Fairchild Semiconductor. datasheet reference information only. Rev. ©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com Other recent searchesXN06114 - XN06114 XN06114 Datasheet XN6114 - XN6114 XN6114 Datasheet SOT89 - SOT89 SOT89 Datasheet BCX54 - BCX54 BCX54 Datasheet BCX55 - BCX55 BCX55 Datasheet BCX56 - BCX56 BCX56 Datasheet Si5432DC - Si5432DC Si5432DC Datasheet LTC2280 - LTC2280 LTC2280 Datasheet LTC2282 - LTC2282 LTC2282 Datasheet LTC2284 - LTC2284 LTC2284 Datasheet LTC2286 - LTC2286 LTC2286 Datasheet LTC2287 - LTC2287 LTC2287 Datasheet LTC2288 - LTC2288 LTC2288 Datasheet LTC2289 - LTC2289 LTC2289 Datasheet LTC2290 - LTC2290 LTC2290 Datasheet LTC2291 - LTC2291 LTC2291 Datasheet LTC2292 - LTC2292 LTC2292 Datasheet LTC2293 - LTC2293 LTC2293 Datasheet LTC2294 - LTC2294 LTC2294 Datasheet LTC2295 - LTC2295 LTC2295 Datasheet LTC2296 - LTC2296 LTC2296 Datasheet LTC2297 - LTC2297 LTC2297 Datasheet LTC2298 - LTC2298 LTC2298 Datasheet LTC2299 - LTC2299 LTC2299 Datasheet LMU16 - LMU16 LMU16 Datasheet KCSC56-101 - KCSC56-101 KCSC56-101 Datasheet
Privacy Policy | Disclaimer |