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January 2009 4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M, H11


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4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
January 2009
4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M, H11A1M, H11A2M, H11A3M, H11A4M, H11A5M General Purpose 6-Pin Phototransistor Optocouplers
recognized (File E90700, Volume recognized (File 102497)
Description
general purpose optocouplers consist gallium arsenide infrared emitting diode driving silicon phototransistor 6-pin dual in-line package.
option (e.g., 4N25VM)
Applications
Power supply regulators Digital logic inputs Microprocessor inputs
Schematic
Package Outlines
ANODE CATHODE CONNECTION EMITTER COLLECTOR BASE
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Absolute Maximum Ratings 25°C unless otherwise specified)
Stresses exceeding absolute maximum ratings damage device. device function operable above recommended operating conditions stressing parts these levels recommended. addition, extended exposure stresses above recommended operating conditions affect device reliability. absolute maximum ratings stress ratings only.
Symbol
TOTAL DEVICE TSTG TOPR TSOL EMITTER IF(pk) DETECTOR VCEO VCBO VECO Collector-Emitter Voltage Collector-Base Voltage Emitter-Collector Voltage Storage Temperature Operating Temperature
Parameter
Value
+150 +100 2.94 1.41 1.76
Units
Wave solder temperature (see page reflow solder profile) Total Device Power Dissipation 25°C Derate above 25°C DC/Average Forward Input Current Reverse Input Voltage Forward Current Peak (300µs, Duty Cycle) Power Dissipation 25°C Derate above 25°C
mW/°C mW/°C
Detector Power Dissipation 25°C Derate above 25°C
Electrical Characteristics 25°C unless otherwise specified)
Individual Component Characteristics Symbol
EMITTER DETECTOR BVCEO BVCBO BVECO ICEO ICBO Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Collector-Base Dark Current Capacitance 1.0mA, 100µA, 100µA, 10V, Input Forward Voltage Reverse Leakage Current 10mA 6.0V 1.18 0.001 1.50
Parameter
Test Conditions
Min.
Typ.*
Max.
Unit
Isolation Characteristics Symbol
VISO RISO CISO
Characteristic
Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance
Test Conditions
60Hz, VI-O VI-O 1MHz
Min.
7500 1011
Typ.* Max.
Units
Vac(pk)
*Typical values 25°C
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2 www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Electrical Characteristics (Continued) 25°C unless otherwise specified)
Transfer Characteristics Symbol
Parameter
Current Transfer Ratio, Collector Emitter
Test Conditions
10mA,
Device
4N35M, 4N36M, 4N37M H11A1M H11A5M 4N25M, 4N26M H11A2M, H11A3M 4N27M, 4N28M H11A4M
Min. Typ.* Max.
Unit
CHARACTERISTICS
10mA, 10V, -55°C 10mA, 10V, +100°C (SAT) Collector-Emitter Saturation Voltage 2mA, 50mA 0.5mA, 10mA
4N35M, 4N36M, 4N37M 4N35M, 4N36M, 4N37M 4N25M, 4N26M, 4N27M, 4N28M, 4N35M, 4N36M, 4N37M H11A1M, H11A2M, H11A3M, H11A4M, H11A5M
CHARACTERISTICS Non-Saturated Turn-on Time 10mA, 10V, (Fig. 4N25M, 4N26M, 4N27M, 4N28M, H11A1M, H11A2M, H11A3M, H11A4, H11A5M 4N35M, 4N36M, 4N37M 4N25M, 4N26M, 4N27M, 4N28M, H11A1M, H11A2M, H11A3M, H11A4M, H11A5M 4N35M, 4N36M, 4N37M
2mA, 10V, (Fig. TOFF Turn-off Time 10mA, 10V, (Fig.
2mA, 10V, (Fig. Typical values 25°C
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Typical Performance Curves
Fig. Forward Voltage Forward Current
5.0V 25°C Normalized
Fig. Normalized Forward Current
FORWARD VOLTAGE
NORMALIZED
-55°C
25°C 100°C
FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
Fig. Normalized Ambient Temperature
Fig. (Unsaturated)
NORMALIZED CTRRBE CTRRBE(OPEN))
NORMALIZED
Normalized 25°C
1000
AMBIENT TEMPERATURE (°C)
RBE- BASE RESISTANCE
Fig. (Saturated)
Fig. Collector-Emitter Saturation Voltage Collector Current
NORMALIZED CTRRBE CTRRBE(OPEN))
VCE=
(SAT) COLLECTOR-EMITTER SATURATION VOLTAGE
25°C
0.01
1000
0.001 0.01
RBE- BASE RESISTANCE
COLLECTOR CURRENT (mA)
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Typical Performance Curves (Continued)
Fig. Switching Speed Load Resistor
1000 25°C 1000 10000 100000
Fig. Normalized
Toff
R-LOAD RESISTOR
NORMALIZED (ton(RBE) ton(open))
SWITCHING SPEED (µs)
RBE- BASE RESISTANCE
Fig. Normalized toff
Fig. Dark Current Ambient Temperature
ICEO COLLECTOR -EMITTER DARK CURRENT (nA)
10000
25°C
NORMALIZED toff (toff(RBE) toff(open))
1000 10000 100000
1000
0.01
0.001
RBE- BASE RESISTANCE
AMBIENT TEMPERATURE (°C)
TEST CIRCUIT
WAVE FORMS
INPUT PULSE
INPUT
Adjust produce toff OUTPUT PULSE
OUTPUT
Figure Switching Time Test Circuit Waveforms
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Package Dimensions
Through Hole
8.13-8.89
0.4" Lead Spacing
8.13-8.89
6.10-6.60 6.10-6.60
5.08 (Max.) 3.28-3.53 0.25-0.36
7.62 (Typ.)
5.08 (Max.) 3.28-3.53
0.25-0.36
0.38 (Min.)
2.54-3.81 0.38 (Min.) 0.20-0.30 2.54-3.81
(0.86) 0.41-0.51 1.02-1.78 0.76-1.14
2.54 (Bsc)
(Typ.) (0.86) 0.41-0.51 1.02-1.78 0.76-1.14 10.16-10.80 2.54 (Bsc) 0.20-0.30
Surface Mount
8.13-8.89
(1.78) (1.52) (2.54)
6.10-6.60 8.43-9.90
(7.49) (10.54)
(0.76)
Rcommended Layout
0.25-0.36
3.28-3.53 5.08 (Max.) 0.38 (Min.) 2.54 (Bsc) (0.86) 0.41-0.51 1.02-1.78 0.76-1.14 0.16-0.88 (8.13)
0.20-0.30
Note: dimensions
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Ordering Information
Option
option SR2V
Order Entry Identifier (Example)
4N25M 4N25SM 4N25SR2M 4N254N25VM 4N25TVM 4N25SVM 4N25SR2VM
Description
Standard Through Hole Device Surface Mount Lead Bend Surface Mount; Tape Reel 0.4" Lead Spacing 0884 0884, 0.4" Lead Spacing 0884, Surface Mount 0884, Surface Mount, Tape Reel
Marking Information
4N25
Definitions
Fairchild logo Device number mark (Note: Only appears parts ordered with option order entry table) digit year code, e.g., digit work week ranging from `01' `53' Assembly package code
*Note Parts that have option (see definition above) that marked with date code `325' earlier marked portrait format.
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
Carrier Tape Specification
12.0 0.20 0.05 0.30 0.05 1.75 0.10
11.5 21.0 0.20 24.0
10.1 0.20
0.1/-0
User Direction Feed
Reflow Profile
Time above 183°C >245°C 260°C
1.822°C/Sec Ramp rate
Time
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com
4NXXM, H11AXM General Purpose 6-Pin Phototransistor Optocouplers
TRADEMARKS following includes registered unregistered trademarks service marks, owned Fairchild Semiconductor and/or global subsidiaries, intended exhaustive list such trademarks. Build Transfer LogicEcoSPARK® EfficentMaxEZSWITCH*
Fairchild® Fairchild Semiconductor® FACT Quiet Series® FACT FAST® FastvCoreFlashWriter® FPSF-PFS
FRFET® Global Power Resource Green FPSGreen OPTOPLANAR®
Programmable Active DroopQFET® QSQuiet SeriesRapidConfigureSaving world, 1mW/W/kW timeSmartMaxSMART STARTSPM® STEALTHSuperFETSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SupreMOSSyncFET
TinyBoostTinyBuckTinyLogic® DetectµSerDes
SPMPower-SPMPowerTrench® PowerXS
Ultra FRFETUniFETVCXVisualMaxXS
Power Franchise®
EZSWITCHand FlashWriter® trademarks System General Corporation, used under license Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION, DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. THESE SPECIFICATIONS EXPAND TERMS WORLDWIDE TERMS CONDITIONS, SPECIFICALLY WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support, device, system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness.
ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy also stated external website, www.fairchildsemi.com, under Sales Support. Counterfeiting semiconductor parts growing problem industry. manufacturers semiconductor products experiencing counterfeiting their parts. Customers inadvertently purchase counterfeit parts experience many problems such loss brand reputation, substandard performance, failed applications, increased cost production manufacturing delays. Fairchild taking strong measures protect ourselves customers from proliferation counterfeit parts. Fairchild strongly encourages customers purchase Fairchild parts either directly from Fairchild from Authorized Fairchild Distributors listed country page cited above. Products customers either from Fairchild directly from Authorized Fairchild Distributors genuine parts, have full traceability, meet Fairchild's quality standards handling storage provide access Fairchild's full range up-to-date technical product information. Fairchild Authorized Distributors will stand behind warranties will appropriately address warranty issues that arise. Fairchild will provide warranty coverage other assistance parts bought from Unauthorized Sources. Fairchild committed combat this global problem encourage customers their part stopping this practice buying direct from authorized distributors. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Preliminary Identification Needed Obsolete Product Status Formative Design First Production Full Production Production Definition Datasheet contains design specifications product development. Specifications change manner without notice. Datasheet contains preliminary data; supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice improve design. Datasheet contains specifications product that discontinued Fairchild Semiconductor. datasheet reference information only.
Rev.
©2005 Fairchild Semiconductor Corporation 4NXXM, H11AXM Rev. 1.0.2
www.fairchildsemi.com

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