August 2002 Seiko Epson Corporation Observation Surface Cond

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August 2002 Seiko Epson Corporation Observation Surface Cond

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Quality Evaluation Data Lead-free Peripheral Packages (Sn-Bi plating)
August 2002
Seiko Epson Corporation
Observation Surface Condition Sn-Bi Type Lead Plating Soldering Evaluation Lead Plating
Solderability test results stand-alone packages hours steam aging pre-process immersion deactivated flux (NA200) seconds soldering seconds High-temperature storage pre-process: hours immersion deactivated flux (NA200) seconds soldering seconds Observation mounting condition hours steam aging pre-process reflow mounting) Fillet condition when using Sn-Ag-Cu solder paste Fillet condition when using Sn-Pb solder paste
Evaluation Bonding Reliability after Secondary Mount
Evaluation bonding reliability after secondary mount Dependence bonding reliability density Bonding reliability Sn-Bi plating/Sn-Ag-Cu solder paste Bonding reliability Sn-Pb plating/Sn-Pb eutectic solder paste
Reflow Temperature Profile Used Mount Testing Whisker Evaluation Density Dependence) Soldering Evaluation Conventional Reflow Conditions Evaluation Package Heat Resistance Cautions when Mounting Lead-free Solder Products
Observation Surface Condition Sn-Bi Type Lead Plating
Dependence lead bend appearance density
frame
Sn-1.5%
-3.0%
-4.5%
-6.0%
alloy frame
Sn-1.5%
-3.0%
-4.5%
-6.0%
Plating cracks lead bend increase density increases. (Plating cracks deep enough expose lead's base metal)
Package evaluated:
2-1. Solderability test results
Test conditions
Steam aging hours deactivated flux immersion seconds dipped solder seconds
Judgment
Solder's area: above
Result
problems related solder's area
frame
0/11
alloy
0/11
0/11 0/11
2-1. Solderability test results
Test conditions
High-temperature storage hours deactivated flux immersion seconds dipped solder seconds Solder's area: above
Judgment
Result
problems related solder's area
frame
0/11
alloy
0/11
0/11 0/11
2-2. Observation mounting condition
*Fillet shape after Sn-Ag-Cu solder paste mounting
Steam aging hours pre-processing Reflow mounting (see mounting profile separate sheet)
1.5%
3.0%
4.5%
Package evaluated: (Cu-lead)
2-2.(2) Observation mounting condition
*Fillet shape after Sn-Pb (eutectic) solder paste mounting
Steam aging hours pre-processing Reflow mounting (see mounting profile separate sheet)
1.5%
3.0%
4.5%
Package evaluated: (Cu-lead)
3-1. Evaluation bonding reliability after secondary mount
Test conditions Judgment Result Test conditions minutes minutes 2000 cycles) after mounting measurement lead bonding strength Criteria: lead pulling strength should more after 1000 cycles under test conditions, strength degradation should less. strength degradation found after 2000 cycles, there likely problem
Plating lead: Sn-2Bi
1100 1000 Average Maximum Minimum
Pulling strength (gf)
Baseline value
Cycles Frame
Default
1000cyc frame
2000cyc
Default
1000cyc frame
2000cyc
Default
1000cyc frame
2000cyc
Default
1000cyc frame
2000cyc
Sn-Ag-Cu paste
Sn-Pb paste
3-2. Dependence bonding reliability density
Bonding reliability Sn-Bi plating/Sn-Ag-Cu solder paste
1000
Average Maximum Minimum
Pulling strength (gf) 1000cyc 2000cyc 2000cyc 1000cyc 1000cyc 2000cyc 2000cyc 1000cyc 2000cyc 1000cyc
1000cyc 6.0%
0.0%
Sn-Pb plating
1.5%
3.0% Sn-Bi plating
4.5%
Sn-Ag-Cu solder paste
Sn-3.0Ag-0.5Cu
Package evaluated: (Cu-lead)
2000cyc
0cyc
0cyc
0cyc
0cyc
0cyc
0cyc
Mounting condition: Sectional photos lead junction directions)
Solder paste Lead plating
Sn-Ag-Cu Sn-Bi
Front
Back
Package evaluated: (Cu-lead)
Bonding reliability Sn-Bi plating/Sn-Pb eutectic solder paste
1000
Average
Maximum Minimum
Pulling strength (gf)
1000cyc 2000cyc 1000cyc 2000cyc 1000cyc 2000cyc 2000cyc 1000cyc 2000cyc 1000cyc 1000cyc 2000cyc
0cyc
0cyc
0cyc
0cyc
0cyc
0.0% Sn-Pb plating
1.5%
3.0%
4.5%
0cyc
6.0%
Sn-Bi plating Sn-Pb eutectic solder paste
Package evaluated: (Cu-lead)
Mounting condition: Sectional photos lead junction directions)
Solder paste Lead plating
Sn-Pb
Sn-Bi
Front
Back
Package evaluated: (Cu-lead)
Reflow Temperature Profile Used Mount Testing
Temperature Elapsed time (seconds)
Under Above Solder
Whisker Evaluation Density Dependence)
view (x1000) after 1000 hours
Alloy
Sn-1.5%Bi
-3.0%Bi
-4.5%Bi
-6.0%Bi
frame
Sn-1.5%Bi
-3.0%Bi
-4.5%Bi
-6.0%Bi
confirmed occurrence whisker
Package evaluated:
Soldering Evaluation Conventional Reflow Conditions
Test conditions Judgment Result
Reflow peak temperature:
Sn-Bi plating/Sn-Pb eutectic solder paste
Solder's area: above problems related solder's area
Time(s)
Temperature
QFP24X24-208-0.5(Sn-2Bi)
Evaluation Package Heat Resistance
lead-free products, certifiable value package heat resistance been changed (peak). This value used test each package heat resistance specified, after which each package ranked.
Test flow
Drying Reflow heat resistance test Judgment
Humidification
Each package rank storage requirements which apply from when moisture-proof wrapping been opened until reflow mounting process. Consequently, there heat resistance requirements that include storage requirements (after opening moisture-proof wrapping) reflow mounting requirements.
Storage rank Storage environments after opening package 85%RH less 70%RH less 70%RH less 70%RH less specified individually Within months year) Within month Within hours week) Within hours days) specified individually
Contact sales staff information product-related storage requirements mounting requirements.
Cautions when Mounting Lead-free Solder Products
When using soldering methods such infrared reflow reflow, which heats entire package (QFP, SOP, PLCC, etc.), sure remain within following range parameters when performing reflow times. Note that cracks other problems more likely occur when plastic packages absorb moisture, sure maintain proper storage conditions. Temperature profile: temperature profile infrared reflow furnace which temperature resin's surface temperature) should maintained within range described below. Maximum temperature: maximum temperature requirement resin surface, given peak temperature package body's surface, that resin surface temperature must exceed more than seconds. This temperature should kept possible reduce load caused thermal stress package, which soldering short periods only recommended. addition using suitable temperature profile, also recommend that check carefully confirm good soldering results.
Maximum peak temperature: seconds
Package body surface temperature
Pre-heating Heating above seconds seconds
Time
Contact sales staff information storage conditions opened packages mounting profiles each product.

August 2002 Seiko Epson Corporation Observation Surface Cond

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