DS5871-1.3 August 2008 (LN26346) Double Side Cooling High Surge C
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DCR2950W65
DS5871-1.3 August 2008 (LN26346)
Double Side Cooling High Surge Capability
PARAMETERS VDRM IT(AV) ITSM dV/dt* dI/dt 6500V 2945A 38500A 1500V/µs 300A/µs
APPLICATIONS
High Power Drives High Voltage Power Supplies Static Switches VOLTAGE RATINGS
Part Ordering Number Repetitive Peak Voltages VDRM VRRM 6500 6000 5500 5000 Conditions
Higher dV/dt selections available
DCR2950W65* DCR2950W60 DCR2950W55 DCR2950W50
-40° 125° IDRM IRRM 300mA, VDRM, VRRM 10ms, VDSM VRSM VDRM VRRM 100V respectively
Lower voltage grades available. 6200V 6500V
Outline type code: (See Package Details further information)
Fig. Package outline
ORDERING INFORMATION
When ordering, select required part number shown Voltage Ratings selection table. example: DCR2950W65
Note: Please complete part number when ordering quote this number future correspondence relating your order.
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DCR2950W65
SEMICONDUCTOR
CURRENT RATINGS
Tcase unless stated otherwise
Symbol Double Side Cooled IT(AV) IT(RMS)
Parameter
Test Conditions
Max.
Units
Mean on-state current value Continuous (direct) on-state current
Half wave resistive load
2945 4629 4430
SURGE RATINGS
Symbol ITSM
Parameter Surge (non-repetitive) on-state current fusing
Test Conditions 10ms half sine, Tcase 125°
Max. 38.85 7.55
Units
THERMAL MECHANICAL RATINGS
Symbol Rth(j-c) Parameter Thermal resistance junction case Test Conditions Double side cooled Single side cooled Anode Cathode Rth(c-h) Thermal resistance case heatsink Clamping force 76.0kN (with mounting compound) Virtual junction temperature On-state (conducting) Reverse (blocking) Tstg Storage temperature range Clamping force Double side Single side Min. 68.0 Max. 0.00631 0.01115 0.01453 0.0014 0.0028 84.0 Units
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DCR2950W65
SEMICONDUCTOR
DYNAMIC CHARACTERISTICS
Symbol IRRM/IDRM dV/dt dI/dt
Parameter Peak reverse off-state current Max. linear rate rise off-state voltage Rate rise on-state current
Test Conditions VRRM/VDRM, Tcase 125° VDRM, 125° gate open From VDRM IT(AV) Gate source 30V, 0.5µs, 125°
Repetitive 50Hz Non-repetitive
Min.
Max. 1500
Units V/µs A/µs A/µs
VT(TO)
Threshold voltage level Threshold voltage High level
2400A Tcase 125° 2400 72000A Tcase 125° 500A 2400A Tcase 125° 2400A 72000A Tcase 125° VDRM, gate source 30V, 0.5µs,
0.94 1.13 0.343 0.264
On-state slope resistance level On-state slope resistance High level
Delay time
Turn-off time
125° 200V, dI/dt 1A/µs, dVDR/dt 20V/µs linear
1200
Stored charge Latching current Holding current
2000A, 125° dI/dt 1A/µs, RG-K 500A,
2800
6400
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DCR2950W65
SEMICONDUCTOR
GATE TRIGGER CHARACTERISTICS RATINGS
Symbol
Parameter Gate trigger voltage Gate non-trigger voltage Gate trigger current Gate non-trigger current
Test Conditions VDRM Tcase VDRM, Tcase 125° VDRM Tcase VDRM, Tcase 125°
Max.
Units
CURVES
7000
Instantaneous on-state current
6000 5000 4000 3000 2000 1000 125° 125°
Instantaneous on-state voltage
Fig.2 Maximum minimum on-state characteristics
VEQUATION (IT) C.IT+D.
Where
0.914146 -0.3808 0.00016 0.015311 these values valid 125° 500A 7200A
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DCR2950W65
SEMICONDUCTOR
Maximum case temperature, case 1000 2000 3000 4000 5000
Mean power dissipation (kW)
1000 2000 3000 4000 5000
Mean on-state current, IT(AV)
Fig.3 On-state power dissipation sine wave
Mean on-state current, IT(AV)
Fig.4 Maximum permissible case temperature, double side cooled sine wave
Maximum heatsink temperature, Heatsink 1000 2000 3000 4000
Mean power dissipation (kW)
d.c.
Mean on-state current, IT(AV)
1000 2000 3000 4000 5000 6000 7000
Mean on-state current, IT(AV)
Fig.5 Maximum permissible heatsink temperature, double side cooled sine wave Fig.6 On-state power dissipation rectangular wave
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DCR2950W65
SEMICONDUCTOR
Maximum permissible case temperature Tcase 1000 2000 3000 4000 5000 6000 7000 Maximum heatsik temperature Theatsink (oC) d.c.
1000 2000 3000 4000 5000 6000 d.c.
Mean on-state current, IT(AV)
Mean on-state current, IT(AV)
Fig.7 Maximum permissible case temperature, double side cooled rectangular wave
Double Side Cooling
Fig.8 Maximum permissible heatsink temperature, double side cooled rectangular wave
Double side cooled Anode side cooled Cathode side cooled C/kW) C/kW) C/kW) 1-exp. (t/ti))] 0.8816 0.0106818 1.5197 0.0170581 1.4106 0.0158344 1.2993 0.058404 3.2398 0.2424644 2.4667 0.1786951 2.8048 0.3584979 5.7622 6.013 6.7451 3.6201 1.3305 1.1285 0.6312 15.364 3.9054 6.196
Thermal Impedance, Zth(j-c) C/kW)
Anode Side Cooling Cathode Sided Cooling
Conduction
0.001 0.01
Tables show increments thermal resistance th(j-c) when device operates conduction angles other than d.c.
Double side cooling sine. 1.00 1.16 1.33 1.48 1.61 1.66 rect. 0.67 0.97 1.13 1.31 1.51 1.61 Anode Side Cooling sine. 0.94 1.08 1.23 1.37 1.47 1.52 rect. 0.64 0.91 1.06 1.22 1.38 1.47 Cathode Sided Cooling sine. 0.95 1.09 1.25 1.38 1.49 1.54 rect. 0.65 0.92 1.07 1.23 1.40 1.49
Time
Fig.9 Maximum (limit) transient thermal impedance junction case C/kW)
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DCR2950W65
SEMICONDUCTOR
Conditions: Tcase 125°C Pulse width 10ms
Conditions: Tcase= 125°C half-sine wave
Surge current, (kA)
Surge current, ITSM- (kA)
Number cycles
Fig.10 Multi-cycle surge current
Pulse width, (ms)
Fig.11 Single-cycle surge current
40,000 35,000
7066.1*(di/dt)
Reverse recovery current,
59.812*(di/dt)0.7589
0.4891
30,000 Stored Charge, (uC) 25,000 20,000 15,000 10,000 5,000 Rate decay on-state current, di/dt (A/us)
3539.7*(di/dt)
0.5991
41.906*(di/dt)0.8147
Rate decay on-state current, di/dt (A/us)
Conditions: VRpeak 3900V, 2600V snubber apprpriate control reverse volts
Conditions: 125oC VRpeak 3900V, 2600V snubber apprpriate control reverse volts
Fig.10 Reverse recovery charge
Fig.11 Reverse recovery current
ITSM
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DCR2950W65
SEMICONDUCTOR
Pulse Width 1000 10000 Pulse Power (Watts) Frequency
Gate trigger voltage,
Upper Limit
Preferred gate drive area
25oC
-40oC
Lower Limit
Gate trigger current IGT,
Fig12 Gate Characteristics
Lower Limit Upper Limit 100W 150W -40C
Gate trigger voltage,
Gate trigger current,
Fig. Gate characteristics
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DCR2950W65
SEMICONDUCTOR
PACKAGE DETAILS
further package information, please contact Customer Services. dimensions unless stated otherwise. SCALE.
Device DCR1594SW28 DCR1595SW42 DCR1596SW52 DCR5450W22 DCR4910W28 DCR4100W42 DCR3640W52 DCR2950W65 DCR2450W85
Maximum Minimum Thickness Thickness (mm) (mm) 27.34 26.79 27.57 27.02 27.69 27.14 27.265 26.715 27.34 26.79 27.57 27.02 27.69 27.14 27.95 27.4 28.31 27.76
Clamping force: 76kN ±10% Lead length: 420mm Lead terminal connector: ring Package outline type code:
Fig.14 Package outline
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DCR2950W65
SEMICONDUCTOR
POWER ASSEMBLY CAPABILITY Power Assembly group provide support service those customers requiring more than basic semiconductor, developed flexible range heatsink clamping systems line with advances device voltages current capability semiconductors. offer extensive range liquid cooled assemblies covering full range circuit designs general today. Assembly group offers high quality engineering support dedicated designing units satisfy growing needs customers. Using latest methods team design applications engineers provide Power Assembly Complete Solution (PACs). HEATSINKS Power Assembly group proprietary range extruded aluminium heatsinks which have been designed optimise performance Dynex semiconductors. Data with respect natural, forced liquid cooling (with flow rates) available request. further information device clamps, heatsinks assemblies, please contact your nearest sales representative Customer Services.
Stresses above those listed this data sheet cause permanent damage device. extreme conditions, with semiconductors, this include potentially hazardous rupture package. Appropriate safety precautions should always followed. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR Doddington Road, Lincoln Lincolnshire, 3LF. United Kingdom. Tel: +44(0)1522 500500 Fax: +44(0)1522 500550 CUSTOMER SERVICE Tel: +44(0)1522 502753 502901. Fax: +44(0)1522 500020
Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION RESALE. PRODUCED UNITED KINGDOM.
This publication issued provide information only which (unless agreed Company writing) used, applied reproduced purpose form part order contract regarded representation relating products services concerned. warranty guarantee express implied made regarding capability, performance suitability product service. Company reserves right alter without prior notice specification, design price product service. Information concerning possible methods provided guide only does constitute guarantee that such methods will satisfactory specific piece equipment. user's responsibility fully determine performance suitability equipment using such information ensure that publication data used date been superseded. These products suitable medical products whose failure perform result significant injury death user. products materials sold services provided subject Company's conditions sale, which available request. brand names product names used this publication trademarks, registered trademarks trade names their respective owners.
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