DFM100PXM33-A000 DS5564-1.2 June 2008(LN26129) FEATURES

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DFM100PXM33-A000 DS5564-1.2 June 2008(LN26129) FEATURES

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DFM100PXM33-A000
DFM100PXM33-A000
DS5564-1.2 June 2008(LN26129)
FEATURES
Reverse Recovery Charge High Switching Speed Forward Voltage Drop Isolated Base Baseplate With Substrates
PARAMETERS VRRM (typ) (max) (max)
3300V 2.5V 100A 200A
2(K2)
1(A2/K1)
3(A1)
APPLICATIONS
Chopper Diodes Boost Buck Converters Free-wheel Circuits Snubber Circuits Resonant Converters Induction Heating Multi-level Switch Inverters
Common anode, part number: DFM100PXM33-A006
Series connection, part number: DFM100PXM33-A000
2(A2)
1(K2/K1)
3(A1)
Common cathode, part number: DFM100PXM33-A005
2(K2) 1(A2/A1) 3(K1)
DFM100PXM33-A000 module houses series connected pair 3300 volt, fast recovery diodes (FRDs). Designed power loss, module suitable variety high voltage applications motor drives power conversion. Configurations with common cathode common anode available request. Fast switching times reverse recovery losses allow high frequency operation making device suitable latest drive designs employing high frequency switching. These modules incorporate electrically isolated base plates inductance construction enabling circuit designers optimise circuit layouts utilise grounded heat sinks safety.
Fig. Circuit diagrams
ORDERING INFORMATION
Order
DFM100PXM33-A000 Series connection DFM100PXM33-A005 Common cathode DFM100PXM33-A006 Common anode
Note: When ordering, please complete part number. Outline type code: (See package details further information) Fig. Electrical connections (not scale)
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DFM100PXM33-A000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' cause permanent damage device. extreme conditions, with semiconductors, this include potentially hazardous rupture package. Appropriate safety precautions should always followed. Exposure Absolute Maximum Ratings affect device reliability. Tcase 25°C unless stated otherwise Symbol VRRM Pmax Visol Parameter Repetitive peak reverse voltage Forward current (per arm) Max. forward current value fuse current rating Maximum power dissipation Isolation voltage Partial discharge 125°C Tcase 70°C Tcase 115°C, 10ms, 125°C Tcase 25°C, 125°C Commoned terminals base plate. RMS, min, 50Hz IEC1287. 2450V, 1800V, 50Hz Test Conditions Max. 3300 Units kA2s
THERMAL MECHANICAL RATINGS
Internal insulation: Baseplate material: Creepage distance: Clearance: (Critical Tracking Index): AlSiC 20mm 10mm Test Conditions Continuous dissipation junction case Rth(c-h) Thermal resistance case heatsink (per module) Tstg Junction temperature Storage temperature range Screw torque Mounting Electrical connections Mounting torque (with mounting grease) °C/kW Min. Typ.
Symbol Rth(j-c)
Parameter Thermal resistance diode (per arm)
Max.
Units °C/kW
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DFM100PXM33-A000
STATIC ELECTRICAL CHARACTERISTICS
25°C unless stated otherwise. Symbol Parameter Peak reverse current Forward voltage Test Conditions 3300V, 125°C 100A 100A, 125°C Inductance Min. Typ. Max. Units
DYNAMIC ELECTRICAL CHARACTERISTICS
25°C unless stated otherwise. Symbol Erec Parameter Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions 100A, dIF/dt 600A/µs, 1800V Min. Typ. Max. Units
125°C unless stated otherwise. Symbol Erec Parameter Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions 100A, dIF/dt 500A/µs, 1800V Min. Typ. Max. Units
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DFM100PXM33-A000
TYPICAL CHARACTERISTICS
25°C 125°C
Transient thermal impedance, (j-c) (°C/kW
measured power busbars auxiliary terminals
1000
Forward current,
(°C/KW) (ms) 0.01
Forward voltage,
0.001
5.909 31.2918 44.503 134.6466 0.0843 3.7205 33.2138 236.5275
Pulse width,
Fig. Diode typical forward characteristics
Power dissipation, Ptot
Fig. Transient thermal impedance
forward current,
Case temperature, Tcase (°C) Case temperature, Tcase (°C)
Fig. Power dissipation
Fig. current rating case temperature
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DFM100PXM33-A000
125°C
Reverse recovery current,
1000 1500 2000 2500 Reverse voltage,
3000
3500
Fig. RBSOA
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DFM100PXM33-A000
PACKAGE DETAILS
further package information, please contact Customer Services. dimensions unless stated otherwise. SCALE.
Nominal weight: 550g Module outline type code:
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POWER ASSEMBLY CAPABILITY
Power Assembly group provide support service those customers requiring more than basic semiconductor, developed flexible range heatsink clamping systems line with advances device voltages current capability semiconductors. offer extensive range liquid cooled assemblies covering full range circuit designs general today. Assembly group offers high quality engineering support dedicated designing units satisfy growing needs customers. Using latest methods team design applications engineers provide Power Assembly Complete Solution (PACs).
HEATSINKS
Power Assembly group proprietary range extruded aluminium heatsinks which have been designed optimise performance Dynex semiconductors. Data with respect natural, forced liquid cooling (with flow rates) available request. further information device clamps, heatsinks assemblies, please contact your nearest sales representative Customer Services.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR Doddington Road, Lincoln. Lincolnshire. 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: (0)1522 502753 502901. Fax: (0)1522 500020 Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION RESALE. PRODUCED UNITED KINGDOM
This publication issued provide information only which (unless agreed Company writing) used, applied reproduced purpose form part order contract regarded representation relating products services concerned. warranty guarantee express implied made regarding capability, performance suitability product service. Company reserves right alter without prior notice specification, design price product service. Information concerning possible methods provided guide only does constitute guarantee that such methods will satisfactory specific piece equipment. user's responsibility fully determine performance suitability equipment using such information ensure that publication data used date been superseded. These products suitable medical products whose failure perform result significant injury death user. products materials sold services provided subject Company's conditions sale, which available request. brand names product names used this publication trademarks, registered trademarks trade names their respective owners.
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DFM100PXM33-A000 DS5564-1.2 June 2008(LN26129) FEATURES

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