filter lines device Filters attenuate -30dB 3GHz package minimizes cro

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CSPRC032A Channel Filter Network
filter lines device Filters attenuate -30dB 3GHz package minimizes cross-talk 9-bump 2.485mm 0.985mm Chip Scale Package (CSP), 0.5mm pitch 0.30mm Eutectic solder bumps Ultra small footprint suitable portable devices Lead-free version available
CSPRC032A 4-channel pass filter (RC-R configuration) Chip Scale Package (CSP). Many portable applications require attenuation signals 800-3000 band. California Micro Devices' unique thin film technology provides minimum -25dB attenuation over this frequency band. bump size pitch these filters selected such that device placed directly printed circuit board using conventional assembly techniques. pin-out device features signal `flow through' design, allowing optimal signal routing. solder bump contacts 63/37 Sn/Pb alloy (Sn/ Ag/Cu lead-free finish) 0.30 diameter. CSPRC032A available space-saving, lowprofile Chip Scale Package with optional lead-free finishing.
Applications
filtering sections wireless devices Cellular phones Cordless phones Internet appliances PDAs Laptop computers
Electrical Schematic
43pF
43pF
43pF
43pF
2005 California Micro Devices Corp. rights reserved. 11/09/05
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
CSPRC032A
PACKAGE PINOUT DIAGRAMS
(Bumps Down View)
VIEW
(Bumps View)
BOTTOM VIEW
Orientation Marking
032A
CSPRC032A Package
Notes: These drawings scale. Lead-free devices specified using character side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Number1 CSPRC032A
Lead-free Finish2
Bumps
Package
Part Marking 032A
Ordering Part Number1
CSPRC032AG
Note Parts shipped Tape Reel form unless otherwise specified.
Note Lead-free devices specified using character side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Storage Temperature Range Power Rating Resistor
+150
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING UNITS
2005 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
Part Marking 032A UNITS
11/09/05
Orientation Marking (see note
CSPRC032A
ELECTRICAL OPERATING CHARACTERISTICS(NOTE
SYMBOL ILEAK TOLR TOLC PARAMETER Leakage Current, Resistance Capacitance Resistor Absolute Tolerance Capacitor Absolute Tolerance Temperature Coefficient Resistance C=43pF Note CONDITIONS VIN=6.0V UNITS ppm/°C ppm/°C
+150 Temperature Coefficient Capacitance Note +500 Filter Cutoff Frequency ZSOURCE=0, ZLOAD= ZSOURCE=50, ZLOAD=50 R=50, C=43pF;
Note Electrical Operating Characteristics guaranteed over Operating Temperature Range unless otherwise specified. Note Parameters guaranteed design characterization.
Filter Performance
CSPRC032 Filter Typical Measured Frequency Response (S21) Measurement
measurement done with 50-source 50-load impedance using HP8753C Network Analyzer with HP85047A S-parameter Test Set.
2005 California Micro Devices Corp. rights reserved. 11/09/05
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
CSPRC032A
Application Information
Refer Application Note AP-217, "The Chip Scale Package", detailed description Chip Scale Packages offered California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Flux Ratio VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 0.150mm 0.330mm Round 50/50 volume Clean +50µm +20µm 240°C
Temperature (°C)
Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous seconds 260°C Maximum Soldering Temperature Eutectic Devices using Eutectic Solder Paste Maximum Soldering Temperature Lead-free Devices using Lead-free Solder Paste
Non-Solder Mask Defined 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
(Entek Plus 106A)
Figure Recommended Non-Solder Mask Defined Illustration
1:00.0
2:00.0 3:00.0 Time (minutes)
4:00.0
Figure Eutectic (SnPb) Solder Ball Reflow Profile
2005 California Micro Devices Corp. rights reserved.
Figure Lead-free (SnAgCu) Solder Ball Reflow Profile
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/09/05
CSPRC032A
Mechanical Details
Mechanical Specifications CSPRC032A offered custom Chip Scale Package (CSP). Dimensions presented below. complete information CMD's Chip Scale Packaging, California Micro Devices Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
SIDE VIEW
Package Bumps Custom Millimeters 0.985 2.485 0.500 0.500 Inches
PACKAGE DIMENSIONS
0.940 2.440 0.495 0.495
1.030 2.530 0.505 0.505
0.0370 0.0388 0.0406 0.0961 0.0978 0.0996 0.0195 0.0197 0.0199 0.0195 0.0197 0.0199
0.30 DIA. 63/37 Sn/Pb (Eutectic) 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115 0.561 0.355 0.605 0.380 0.649 0.405 0.0221 0.0238 0.0256 0.0140 0.0150 0.0160
DIMENSIONS MILLIMETERS
Package Dimensions CSPRC032A 9-bump Chip Scale Package
tape reel
3500 pieces
Controlling dimension: millimeters
Tape Reel Specifications
PART NUMBER CSPRC032A
PKG. SIZE (mm)
POCKET SIZE (mm) 2.62 1.12 0.762
TAPE WIDTH
REEL DIA.
REEL 3500
2.485 0.985 0.605
178mm (7")
Pitches Cumulative Tolerance Tape ±0.2
Cover Tape
tape feeder reference only including draft. Concentric around
Embossment
User Direction Feed
Center Lines Cavity
Figure Tape Reel Mechanical Data
2005 California Micro Devices Corp. rights reserved. 11/09/05
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com

filter lines device Filters attenuate -30dB 3GHz package minimizes cro

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