Functionally compatible with CMD's PACDN1408 protection device transie

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Functionally compatible with CMD's PACDN1408 protection device transie

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CM1205 Channel Protection Array Chip Scale Package
Functionally compatible with CMD's PACDN1408 protection device transient voltage suppressors single package Optiguardcoated improved reliability assembly In-system Electrostatic Discharge (ESD) protection +25kV contact discharge 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space eases layout space critical applications compared discrete solutions traditional wire bonded packages RoHS compliant (lead-free) 10-bump
CM1205 transient voltage suppressor array provides very high level protection sensitive electronic components that subjected ESD. CM1205 will safely dissipate strikes levels well beyond maximum requirements forth 61000-4-2 international standard (Level +8kV contact discharge). I/Os rated +25kV using 61000-4-2 contact discharge method. Using MIL-STD-883D (Method 3015) specification Human Body Model (HBM) ESD, pins protected contact discharges greater than +30kV. Chip Scale Package format this device enables extremely small footprints that necessary portable electronics such cellular phones, PDAs, internet appliances PCs. large solder bumps allow standard attachment laminate boards without underfill. CM1205 features OptiGuardcoating improved reliability assembly available with RoHS compliant lead-free finishing.
Applications
protection sensitive electronic equipment port, keypad button circuitry protection portable devices Wireless Handsets Handheld PDAs Players Digital Cameras Camcorders Notebooks Desktop
Electrical Schematic
CM1205-08CP
2008 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214 Issue 06/03/08
Fax: 408.263.7846
www.cmd.com
CM1205
PACKAGE PINOUT DIAGRAMS
VIEW
(Bumps Down View)
Orientation Marking
BOTTOM VIEW
(Bumps View)
120508
CM1205-08 10-bump Package
Notes: These drawings scale.
Ordering Information
PART NUMBERING INFORMATION
Bumps Package Ordering Part Number1 CM1205-08CP Part Marking 120508
Note Parts shipped Tape Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range RATING +150 UNITS
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING UNITS
2008 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214 Issue 06/03/08
Fax: 408.263.7846
www.cmd.com
CM1205
Specifications (cont'd)
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL VREV ILEAK VSIG PARAMETER Reverse Standoff Voltage Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system Withstand Voltage Human Body Model, MIL-STD-883, Method 3015 Contact Discharge 61000-4-2 Level Clamping Voltage during Discharge MIL-STD-883 (Method 3015), Positive Transients Negative Transients Channel Capacitance CONDITIONS IDIODE=10A VIN=3.3V ILOAD 10mA -1.2 Notes Notes 2.5V 1MHz, Note -0.8 -0.4 UNITS
VESD
Note TA=25°C unless otherwise specified. this document refers lower supply voltage. Note applied channel pins with respect GND, time. other channels open. pins tied ground. Note These parameters guaranteed design characterization.
2008 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214 Issue 06/03/08
Fax: 408.263.7846
www.cmd.com
CM1205
Application Information
Refer Application Note AP-217, "The Chip Scale Package", detailed description Chip Scale Packages offered California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Flux Ratio Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature VALUE 0.300mm Round Non-Solder Mask defined pads 0.350mm Round 0.125 0.150mm 0.360mm Round 50/50 volume Clean (Entek Plus 106A) +50m +20m seconds 260°C
Non-Solder Mask Defined 0.300mm DIA.
Solder Stencil Opening 0.360mm DIA.
Solder Mask Opening 0.350mm DIA.
Figure Recommended Non-Solder Mask Defined Illustration
Temperature (°C)
1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure Lead-free (SnAgCu) Solder Ball Reflow Profile
2008 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214 Issue 06/03/08
Fax: 408.263.7846
www.cmd.com
CM1205
Mechanical Details
CM1205-08CP Mechanical Specifications CM1205-08CP supplied 10-bump custom Chip Scale Package (CSP). Dimensions presented below. Mechanical Package Diagrams
BOTTOM VIEW
PACKAGE DIMENSIONS
Package Bumps Millimeters Custom Inches
OptiGuardCoating
1.109 1.154 1.199 0.0437 0.0454 0.0472 3.059 3.104 3.149 0.1204 0.1222 0.1240 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.612 0.682 0.751 0.0241 0.0268 0.0296 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
0.35 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
tape reel
NOTE: DIMENSIONS MILLIMETERS
Controlling dimension: millimeters
Package Dimensions CM1205-08CP 10-bump Chip Scale Package Tape Reel Specifications
POCKET SIZE (mm) 3.28 1.32 0.81
Cover Tape
PART NUMBER CM1205-08CP
CHIP SIZE (mm) 3.104 1.154 0.682
TAPE WIDTH
REEL DIAMETER 178mm (7")
REEL 3500
Pitches Cumulative Tolerance Tape ±0.2
tape feeder reference only including draft. Concentric around
Embossment
User Direction Feed
Center Lines Cavity
Figure Tape Reel Mechanical Data
2008 California Micro Devices Corp. rights reserved.
McCarthy Blvd., Milpitas, 95035-5112
Tel: 408.263.3214 Issue 06/03/08
Fax: 408.263.7846
www.cmd.com

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