Watt Zener Diode Chip PROCESS DETAILS Process Size Thickness Anod
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CPZ19
Watt Zener Diode Chip
PROCESS DETAILS Process Size Thickness Anode Bonding Area Side Metalization Back Side Metalization EPITAXIAL PLANAR MILS MILS MILS
GEOMETRY GROSS INCH WAFER 36,600 PRINCIPAL DEVICE TYPES CMPZ5235B THRU CMPZ5261B
BACKSIDE CATHODE
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(22-April 2008)
CPZ19
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(22-April 2008)
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