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CPD96V 500mA Schottky Diode Chip PROCESS DETAILS Process Siz


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Schottky Diode
CPD96V
500mA Schottky Diode Chip
PROCESS DETAILS Process Size Thickness Anode Bonding Area Side Metalization Back Side Metalization EPITAXIAL PLANAR MILS MILS MILS
GEOMETRY GROSS INCH WAFER 28,028 PRINCIPAL DEVICE TYPES CMLSH05-4
ANODE
BACKSIDE CATHODE
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(29-August 2006)
CPD96V
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(29-August 2006)

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