CPD74 Monolithic Isolated Quad Switching Diode Chip PROCESS
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CPD74
Monolithic Isolated Quad Switching Diode Chip
PROCESS DETAILS Size Thickness Anode Bonding Area Side Metalization Back Side Metalization MILS MILS MILS
Cathode Bonding Area MILS
GEOMETRY GROSS INCH WAFER 10,000 PRINCIPAL DEVICE TYPES CMEDA-6i
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(28-August 2006)
CPD74
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(28-August 2006)
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