Schottky Diode High Current Schottky Diode Chip PROCESS DETA
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CPD48V
Schottky Diode
High Current Schottky Diode Chip
PROCESS DETAILS Process Size Thickness Anode Bonding Area Side Metalization Back Side Metalization EPITAXIAL PLANAR MILS MILS MILS
GEOMETRY GROSS INCH WAFER 59,940 PRINCIPAL DEVICE TYPES CMPSH-3 Series CMSSH-3 Series CMXSH-3 CMKSH-3T
BACKSIDE CATHODE Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(8-October 2008)
CPD48V
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(8-October 2008)
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