Chopper Transistor Chip PROCESS DETAILS Process Size Thickness Ba
|
|
|
Top Searches for this datasheet
CP734V
Chopper Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization Geometry GROSS INCH WAFER 11,210 PRINCIPAL DEVICE TYPES CMPT404A MPS404A Epitaxial Planar 31.5 31.5 MILS MILS MILS MILS
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(12-August 2008)
CP734V
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(12-August 2008)
Other recent searches
TEW5335 - TEW5335 TEW5335 Datasheet
REJ03D0156 - REJ03D0156 REJ03D0156 Datasheet
0300 - 0300 0300 Datasheet
QESM04 - QESM04 QESM04 Datasheet
LA78041 - LA78041 LA78041 Datasheet
LA78041BUSICCRT - LA78041BUSICCRT LA78041BUSICCRT Datasheet
LA768X - LA768X LA768X Datasheet
LA780412 - LA780412 LA780412 Datasheet
HIP4011 - HIP4011 HIP4011 Datasheet
ENN7404 - ENN7404 ENN7404 Datasheet
SVC226 - SVC226 SVC226 Datasheet
CVCO33CL-0453-0504 - CVCO33CL-0453-0504 CVCO33CL-0453-0504 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
