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Small Signal Transistor High Current Transistor Chip PROCESS


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CP714
Small Signal Transistor
High Current Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER 6,936 PRINCIPAL DEVICE TYPES CBCP69 CBCX69 CZT751 MPS750 MPS751 EPITAXIAL PLANAR MILS MILS MILS MILS
BACKSIDE COLLECTOR
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(8-October 2008)
CP714
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(8-October 2008)

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