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CP704 High Current Transistor Chip PROCESS DETAILS Process S


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CP704
High Current Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER 23,450 PRINCIPAL DEVICE TYPES MPSA55 MPSA56 EPITAXIAL PLANAR MILS MILS MILS MILS
BACKSIDE COLLECTOR Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
-August 2006)
Typical Electrical Characteristics
CP704
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
-August 2006)

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