Switch Transistor Chip PROCESS DETAILS Process Size Thickness Bas
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CP192V
Switch Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER 52,920 PRINCIPAL DEVICE TYPES 2N3904 CMKT3904 CMLT3904E CMPT3904 CMST3904 CXT3904 CZT3904 EPITAXIAL PLANAR MILS MILS MILS MILS
BACKSIDE COLLECTOR
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(15-August 2006)
CP192V
Typical Electrical Characteristics
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(15-August 2006)
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