Construction Element (subpart) Homogeneous Material Material
|
|
|
Top Searches for this datasheet
Material Number Product Line Compliance Date RoHS Compliant CM453232 Series Wirewound Chip Inductor 26-January-2007
Construction Element (subpart)
Homogeneous Material
Material weight [mg]
Core
Ferrite
52.538
Wire Terminal
Copper wire Phosphor Bronze
14.17 8.502
Adhesive
Epoxy
3.27
Homogeneous Material\ Substances Iron oxide (Fe2O3) Nickel oxide (NiO) Zinc oxide (ZnO) Copper xide(CuO) Lead oxide (PbO) Copper (Cu) Polyester Resin Copper (Cu) (Sn) Bis-phenol type epoxy resin Silica oxide (SiO2) Hardener
CASRN
applicable
Materials Mass 100%
1309-37-1 1313-99-1 1314-13-2 1317-38-0 1317-36-8 7440-50-8 7440-50-8 7440-31-5 7631-86-9 25928-94-3
Material Mass total unit 29.3% 3.9% 9.6% 4.8% 0.6% 12.4% 0.6% 7.2% 0.6%
Subpart mass total
48.2%
7.8%
Molding Compound
Epoxy Resin
30.52 109(mg)
Epoxy Resin
100%
Total weight
This Document updated 26-January-2007
Headquarters Riverside www.bourns.com CASRN: Registry Number® Registered Trademark American Chemical Society
page
Important remarks:
responsibility user verify they accessing latest version.
Headquarters Riverside
www.bourns.com CASRN: Registry Number® Registered Trademark American Chemical Society
page
Other recent searches
TS393C - TS393C TS393C Datasheet
KV1720S - KV1720S KV1720S Datasheet
BGA2003 - BGA2003 BGA2003 Datasheet
74LCX86 - 74LCX86 74LCX86 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
