Construction Element(subpart) Lead Frame Homogeneous Material Lea
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Material Number Product Line Compliance Date RoHS Compliant CDSOT236 Series Diode Products 2006
Construction Element(subpart) Lead Frame
Homogeneous Material Lead Frame
Material weight 0.0257
Homogeneous Material\ Substances Copper
CASRN
applicable
Materials Mass
Material Mass total unit 40.770 2.0600 23.420 0.4780 0.5867 1.05 0.235 0.075 26.690 3.1400 1.8840
Subpart mass total 42.830
7440-50-8 7440-31-5 7440-21-3
7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 68928-70-1 29690-62-2
Gold Bond Wire
Silicon Conductor
0.014340 0.000352
Silicon Other material Gold
23.9 0.5867
Silver Paste
Attach
0.000808
Silver Copper Silica fused
1.3470
Molding Component
Outer Total weight
0.018840 0.060000
Epoxy resin Phenol resin
31.400
This Document updated 18-march 2009 Important remarks:
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