Construction Element(subpart) Lead Frame Gold Bond Wire Homogeneo
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Material Number Product Line Compliance Date RoHS Compliant CDSOT23 Series Diode Products 2006
Construction Element(subpart) Lead Frame Gold Bond Wire
Homogeneous Material Lead Frame Silicon Conductor
Material weight 0.0257 0.014340 0.000352
Homogeneous Material\ Substances Copper Silicon Other material Gold
CASRN
applicable
Materials Mass
Material Mass total unit 40.770 2.0600 23.420 0.4780 0.5867 1.05 0.235 0.075 26.690 3.1400 1.8840
Subpart mass total 42.830
7440-50-8 7440-31-5 7440-21-3
7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 68928-70-1 29690-62-2
23.9 0.5867
Silver Paste
Attach
0.000808
Silver Copper Silica fused
1.3470
Molding Component
Outer Total weight
0.018840 0.060000
Epoxy resin Phenol resin
31.400
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