Construction Element(subpart) Lead Frame Gold Bond Wire Silver Paste M
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Material Number Product Line Compliance Date RoHS Compliant CDSOD323 Series Diode Products 2006
Construction Element(subpart) Lead Frame Gold Bond Wire Silver Paste Molding Component
Homogeneous Material Lead Frame Silicon Wafer Conductor Attach
Material weight 0.002570 0.001434 0.000035 0.000081
Homogeneous Material\ Substances Copper Silicon Other material Gold Silver Copper Silica fused Epoxy resin Phenol resin
CASRN
applicable
Materials Mass
Material Mass total unit 40.770 2.0600 23.420 0.4780 0.5867 1.05 0.235 0.075 26.690 3.1400 1.8840
Subpart mass total 42.830
7440-50-8 7440-31-5 7440-21-3
7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 68928-70-1 29690-62-2
23.9 0.5867 1.3470
Outer Total weight
0.001884 0.00600
31.400
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