Construction Element(subpart) Lead Frame Gold Bond Wire Homogeneo
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Material Number Product Line Compliance Date RoHS Compliant CDNBS16 Series Diode Products 2006
Construction Element(subpart) Lead Frame Gold Bond Wire
Homogeneous Material Lead Frame Silicon Conductor
Material weight 0.0757 0.01434 0.000352
Homogeneous Material\ Substances Copper Nickel Silicon Other material Gold Silicon Silver Copper Silica fused Epoxy resin Phenol resin
CASRN
applicable
Materials Mass 94.81 4.81 97.99 1.99 99.83 0.976 84.99 5.99
Material Mass total unit 48.23 2.447 9.444 0.1927 0.2352 0.0023 0.4235 0.090 0.030 32.90 3.871 2.322
Subpart mass total 50.87 9.637 0.2365
7440-50-8 7440-02-0 7440-31-5 7440-21-3
7440-57-5 7440-21-3 7440-31-5 7440-22-4 7440-50-8 60676-86-0 68928-70-1 29690-82-2
Silver Paste
Attach
0.000808
0.5430
Molding Component
Outer Total weight
0.0576 0.1488
38.71
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