Construction Element(subpart) Lead Frame Gold Bond Wire Homogeneo

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Construction Element(subpart) Lead Frame Gold Bond Wire Homogeneo

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Material Number Product Line Compliance Date RoHS Compliant CDNBS08 Series Diode Products 2006
Construction Element(subpart) Lead Frame Gold Bond Wire
Homogeneous Material Lead Frame Silicon Conductor
Material weight 0.0457 0.01434 0.000352
Homogeneous Material\ Substances Copper Silicon Other material Gold Silicon
CASRN
applicable
Materials Mass 95.2 97.95 1.999 98.99 0.98
Material Mass total unit 48.99 2.475 15.82 0.3229 0.3924 0.0039 0.7097 0.150 0.050 26.42 3.108 1.865
Subpart mass total 51.46 16.15 0.3964
7440-50-8 7440-31-5 7440-21-3
7440-57-5
7440-31-5 7440-22-4 7440-50-8 60676-86-0 68928-70-1 29690-82-2
Silver Paste
Attach
0.000808
Silver Copper
0.9099
Molding Component
Outer Total weight
0.0276 0.0888
Silica fused Epoxy resin Phenol resin
31.08
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Construction Element(subpart) Lead Frame Gold Bond Wire Homogeneo

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