Construction Element(subpart) Dice High-melting point solder paste Lea
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Material Number Product Line Compliance Date RoHS Compliant CD216A Series Diode Products 2005
Construction Element(subpart) Dice High-melting point solder paste Lead frame clip
Homogeneous Material Silicon with metal Tin-Lead solder
Material weight 0.00064
Homogeneous Material\ Substances Silicon Nickel Lead Silver Copper Iron Silica(Si02)
CASRN
applicable
Materials Mass 93.5 97.7 70.01
Material Mass total unit 3.920 0.044 4.675 0.250 0.075 40.07 0.873 33.69 9.625 2.406 2.406
Subpart mass total
7440-21-3 7440-02-0 7439-92-1 7440-31-5
7440-22-4 7440-50-8 7439-89-6
0.0008
Copper alloy
0.00656
7631-86-9 68928-70-1 1309-64-4 29690-82-2
7440-31-5
Mould compound
Epoxy material
0.0077
Epoxy resin Antimony Trioxide Phenolic resin
48.12
Plating
solder Total weight
0.00016 0.016
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