Construction Element(subpart) Dice High-melting point Solder paste Lea
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Material Number Product Line Compliance Date RoHS Compliant CD214A Series Diode Products 2005
Construction Element(subpart) Dice High-melting point Solder paste Lead frame clip
Homogeneous Material Silicon with metal Tin-Lead solder
Material weight 0.00192
Homogeneous Material\ Substances Silicon Nickel Lead Silver Copper Iron Silica(Si02)
CASRN
applicable
Materials Mass 93.5 0.05 97.73 2.13 19.99 4.99 4.99
Material Mass total unit 2.94 0.033 3.74 0.06 40.62 0.8853 35.22 10.06 2.515 2.515
Subpart mass total
7440-21-3 7440-02-0 7439-92-1 7440-31-5
7440-22-4 7440-50-8 7439-89-6
0.00256
Copper alloy
0.0266
41.56
7631-86-9 68928-70-1 1309-64-4 29690-82-2
7440-31-5
Mould compound
Epoxy material
0.0322
Plating
solder Total weight
0.00064 0.06400
Epoxy resin Antimony Trioxide Phenolic resin
50.31
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