Construction Element(subpart) Lead Frame High Temp Solder Paste Moldin
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Material Number Product Line Compliance Date RoHS Compliant CD1607 Series Diode Products 2005
Construction Element(subpart) Lead Frame High Temp Solder Paste Molding Component
Homogeneous Material Lead/Wire Silicon Solder Paste Outer Total weight
Material weight 0.02535 0.000731 0.002494 0.01143 0.04005
Homogeneous Material\ Substances Copper Silicon Other material Lead Silica fused Epoxy resin
CASRN
applicable
Materials Mass 97.99 1.99 98.02 1.99 94.99
Material Mass total unit 62.10 1.267 1.791 0.0365 5.922 0.3117 8.571
Subpart mass total 63.37 1.827 6.234 28.57
7440-50-8 7440-02-0 7440-21-5
7439-92-1 7440-31-5 60676-86-0 68928-70-1
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