Construction Element(subpart) Lead Frame Gold Bond Wire Silver Paste M
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Material Number Product Line Compliance Date RoHS Compliant CD143A Series Diode Products July 2008
Construction Element(subpart) Lead Frame Gold Bond Wire Silver Paste Molding Component
Homogeneous Material Lead Frame Silicon Conductor Attach Outer Total weight
Material weight 0.017090 0.010036 0.000234 0.000540 0.012000 0.039964
Homogeneous Material\ Substances Copper Silicon Other material Gold Silver Epoxy Silica fused Epoxy resin Phenol resin
CASRN
applicable
Materials Mass
Material Mass total unit 40.770 2.0600 23.420 0.4780 0.5867 1.05 0.2963 26.690 3.1400 1.8840
Subpart mass total 42.830
7440-50-8 7440-31-5 7440-21-3
7440-57-5 7440-22-4 9003-36-5 60676-86-0 68928-70-1 29690-62-2
23.9 0.5867 1.3470 31.400
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