Construction Element(subpart) Homogeneous Material Material
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Material Number Product Line Compliance Date RoHS Compliant CD1206 Series Diode Products 2005
Construction Element(subpart)
Homogeneous Material
Material weight
Homogeneous Material\ Substances Glycidy1 bther bispheno1 -AResin Bisphen01 AResin Silicon Lead Silver Copper Silica Epoxy resin Phenol resin
CASRN
applicable
Materials Mass 28.38 70.94
Material Mass total unit
Subpart mass total
28906-96-9 25085-75-0 7440-21-3 7439-92-1
7440-31-5 7440-22-4 7440-50-8
FR-5
Substrate
0.003742
28.38 70.94 7.95 1.99
Wafer Solder paste Plating Molding Component
Chip Solder paste Pure Liquid epoxy Total weight
0.0056 0.0028 0.0014 0.0210 0.0700
7440-31-5
7631-86-9 9003-36-5 19438-60-9
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