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Bourns Rep District Sales Managers Bourns Rep Distributor Managers Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team

R TO RKS SIS TWO RE NE

November, 2004
Reliable Electronic Solutions
Bourns Rep District Sales Managers Bourns Rep Distributor Managers Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team
R TO RKS SIS TWO RE NE
All Bourns® Resistor Networks Product Line Offering to be Lead Free by January, 2005
Bourns will complete the transition of its resistor networks to lead free versions in January 2005. All Models - 4100, 4300, 4400, 4600, and 4800 - will be available in a version that is lead free per RoHS requirements. Each data sheet will note that the lead free version is RoHS compliant. The lead free version will be indicated by the addition of an "LF" suffix for thick-film-on-ceramic networks and an "L" suffix for thin-film-on-ceramic-networks. A "Roadmap of Conversion of Chip Arrays, Chip Resistors, and Resistor Networks to Lead Free" is included as a summary of availability and as a specific reference that explains to which models the "LF" and "L" should be added to indicate lead free (see page 2). There have been questions about the reverse compatibility of lead free products to processes that were used with tin-lead terminations. We have also included the "Bourns Minimum Soldering Profile for Lead Free Chip Resistors, Chip Arrays, and Resistor Networks with 63Sn / 37Pb Solder Paste" (see page 3). This profile details the minimum soldering conditions to which we have tested lead free parts with tin-lead solder. At the minimum conditions noted, reflow and acceptable bonding was achieved in low-volume testing. Pricing and lead time for resistor networks with lead free terminations will remain the same as pricing and lead time for networks with tin-lead terminations. Contact Information: AMERICAS / ASIA PACIFIC Greg Gray greg.gray@bourns.com Phone: 541-496-4837 Best Regards, Wil Cantrell Product Manager Bourns® Resistor Networks Product Line EUROPE: Cathal Sheehan cathal.sheehan@bourns.com Phone: +353 21 4515 295
All Bourns® Resistor Networks Product Line Offering to be Lead Free by January, 2005 November, 2004 Page 2 of 3
Roadmap of Conversion of Chip Arrays, Chip Resistors, and Resistor Networks to Lead Free
See "Bourns Minimum Soldering Profile for Lead Free Chip Resistors and Arrays"
All Bourns® Resistor Networks Product Line Offering to be Lead Free by January, 2005 November, 2004 Page 3 of 3
Bourns Minimum Soldering Profile for Lead Free Chip Resistors, Chip Arrays, and Resistor Networks with 63Sn / 37Pb Solder Paste
225 °C
170 °C
Temperature (°C)
175 150 °C
183 °C 60 - 90 seconds Ramp Down 3 °C / second
125 120 - 150 seconds
75 Ramp Up 3 °C / second maximum
25 0 50 100 150 Time (seconds) 200 250 300