Material Group Ceramic Conductor Glaze Material Weight 0.2069 0.0024 0
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4608H-LF Series Networks 05/18/2005
Material Group Ceramic Conductor Glaze Material Weight 0.2069 0.0024 0.0515 0.0171 0.0275 0.0012 0.0023 0.0031 0.0035 0.0012 0.0509 0.0029 0.0001 0.0396 0.0014 0.0002 0.0789 0.0789 0.0158 0.0039 0.0197 0.6091 Materials Alumina Silver Lead Monoxide Ruthenium (IV) Oxide Silicon Dioxide Calcium Oxide Zircon Aluminum Oxide Diboron Trioxide Chromium(III) Oxide Steel Alloys Silver Copper Silver Copper Silica, Victreous Bisphenol Epoxy Resin BTDA Antimony Oxide TBBPA
applicable
Average Mass 33.97 0.40 8.46 2.81 4.52 0.19 0.38 0.51 0.57 0.20
52.00
1344-28-1 7440-22-4 1317-36-8 12036-10-1 7631-86-9 1305-78-8 14940-68-2 1344-28-1 1303-86-2 1308-38-9 7440-31-5 7440-22-4 7440-50-8 7440-31-5 7440-22-4 7440-50-8 60676-86-0 25036-25-3 2421-28-5 1309-64-4 79-94-7
Terminal Pins Steel Plating 8.35 0.48 0.02
8.86
Termination Solder 6.51 0.24 0.03
6.78
Body Plastic 12.95 12.95 2.59 0.63 3.24
32.36
Total Weight
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