BOARD SPECIFICATIONS P.C. Board Thickness min. 1.4mm Drilled Hole

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BOARD SPECIFICATIONS P.C. Board Thickness min. 1.4mm Drilled Hole

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Multi-Line Module Connectors CompactPCI® Series 7200
BOARD SPECIFICATIONS
P.C. Board Thickness min. 1.4mm Drilled Hole 0.7±0.025 Copper Plate 25-50µm Plate 4-10µm Plated Hole 0.6±0.05
DIELECTRIC WITHSTANDING VOLTAGE
Designation Within a+c+e Between rows a+b+c a+b+c+d a+b+c+d+e Within Between rows Fully Loaded 1500 Every Other Position 1500 1500 1500 Chessboard Pattern 1500 1200
CREEPAGE DISTANCES CLEARANCES DEPENDENT CONTACT LAYOUT
Fully Loaded Designation Within Between rows Within Between rows Every Other Position Chessboard Pattern
Backplane Daughter Card Backplane Daughter Card Backplane Daughter Card Male Female Male Female Male Female Connector Connector Connector Connector Connector Connector
a+c+e a+b+c a+b+c+d a+b+c+d+e
DERATING DIAGRAM
Curve Alternate rows, every other position (Chessboard pattern) Curve rows, every other position Curve Every position
Multi-Line Module Connectors CompactPCI® Series 7200
Multi-Line Module Connectors CompactPCI® Series 7200
Electrical Performance High Frequency Characteristics Series 7200
relation today's market requirements Hard Metric Connectors designed excellent performance high frequency applications. Unique design guarantees excellent signal transmission. Reduced crosstalk versions with optional, modular shielding available. Transmission characteristics measured simulated time frequency domain (see Plot below). Test reports available which allow total overview about technical performance. enable advanced circuit simulation, Spice Simulation Program (Simulator Program Integrated Circuit) available site: www.avx.com. uniform contact spacing, constant distances total encapsulation terminals almost ideal 50Ohm characteristic impedance well very propagation delay consistent signal skew reached.
Test Boards Spice Model Verification
comparison between Spice Model Simulation corresponding measurements with this test board made verify simulation.
90.0 Connector 80.0 Impedance (Ohms)
70.0 Microstrip 60.0 50.0 Cable 40.0 Time (E-9) Pressfit pins Microstrip
Plot showing impedance curve This diagram shows typical impedance signal path from first connector daughter card second connector backplane. y-axis directly shows impedance Ohm.
Multi-Line Module Connectors CompactPCI® 7200
High Frequency Characteristics Series 7200
table below will summarize electrical performance board with similar assignments. Beside already stated continuous Impedance Propagation Delay, connectors also perform very Capacitance Inductance which makes them ideal high speed applications.
Parameter Capacitance (pF) 300MHz Inductance (nH) 300MHz Characteristic Impedance Propagation Delay (ps) Signal Skew (ps) Near Crosstalk (dB) 300MHz Reflection Factor 300MHz VSWR 300MHz Reflection Loss (dB) 300MHz -25.4 (a-b) 0.016 1.03 35.9 0.016 1.03 35.9
0.016 1.03 35.9
-22.2 (d-e) 0.017 1.03 35.4 0.04 1.08 28.0
Configuration Crosstalk Measurements
Shielding Ground Signal
Configuration Through Measurements
Shielding Ground Signal

BOARD SPECIFICATIONS P.C. Board Thickness min. 1.4mm Drilled Hole

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