1.9'' MATRIX DISPLAY inch (48.3 height power consumption RoHS Com
|
|
|
Top Searches for this datasheet
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
Notes: dimensions millimeters (inches) Tolerance 0.25mm (0.01") unless otherwise specified
Feb. 2005 Rev.
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
Internal Circuit Diagram
A5582-2 SERIES DIAGRAM (COLUMN ANODE)
C5582-2 SERIES DIAGRAM (COLUMN CATHODE)
Feb. 2005 Rev.
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
DEVICE SELECTION GUIDE
Part Number 5582-2G Material Chip Emitted Color Green Face Segment Gray White
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Dissipation segment Peak Current segment (1/10 Duty Cycle @1KHz Continuous Forward Current segment Reverse Voltage Operating Temperature Range Storage Temperature Range
(Ta=25°C)
Symbol
TOPR TSTG
Rating
-40~+85 -40~+85
Unit
Solder temperature from body seconds 260°C
OPTICAL-ELECTRICAL CHARACTERISTICS
Parameter
Ave. Luminous Intensity Forward Voltage/segment Reverse Current/segment Spectrum Line Half-Width Dominant Wavelength Peak Wavelength
Symbol Test Condition
10mA 10mA 10mA 10mA 10mA
5000
13000 2.05
Unit
Feb. 2005 Rev.
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: GREEN
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
WAVE SOLDERING
American Opto Plus C/A5582-2G
1.9'' MATRIX DISPLAY
inch (48.3 height power consumption RoHS Compliance Case mold type
LAMP HANDLING APPLICATION PRECAUTIONS STORAGE
recommended store products following conditions: Humidity: Temperature: 40°C (41°F 105°F) Shelf life sealed bag: month 40°C
FORMING
forming lead must done before solding, during after soldering Avoid applying stress resin order prevent epoxy fracture break bonding wire. While forming, please equivalent hold bend pin. from base resin minimum distance place bending lead Avoid bending lead same point twice more
SOLDERING
stress applied lead pins when they heated, otherwise disconnection occur. When mounted into P.C. board, pitch spacing should aligned carefully avoid causing stress lead wires. Mounting direction (electrode direction) Display should perpendicular direction curve After soldering, don't bend
CLEANING
Avoid using unspecified chemical solvent clean LED. example, Trichoroethylene, Chlorosen, Acetone, Diflon S3MC. cleaning method only taken under normal temperature minute less required Special attention should taken when using chemicals claning because some chemicals damage surface epoxy.
Other recent searches
SP8J5 - SP8J5 SP8J5 Datasheet
MPC860 - MPC860 MPC860 Datasheet
MPC860UMAD - MPC860UMAD MPC860UMAD Datasheet
EN8774A - EN8774A EN8774A Datasheet
LA6581M - LA6581M LA6581M Datasheet
DS-1 - DS-1 DS-1 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
