FMA3007 2GHZ 20GHZ MMIC AMPLIFIER Die: 3.15mmx1.78mm Pr
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FMA3007
FMA3007
2GHZ 20GHZ MMIC AMPLIFIER
Die: 3.15mmx1.78mm
Product Description
FMA3007 high performance 2GHz 20GHz Gallium Arsenide monolithic travelling wave amplifier. suitable broadband communication, instrumentation, electronic warfare applications. fabricated using RFMD's 0.25µm process.
Features
17dBm Output Power 11dB Gain Input Return Loss<-13dB Output Return Loss<-11dB Voltage Gain Control
Applications
Optimum Technology Matching® Applied GaAs GaAs MESFET InGaP SiGe BiCMOS BiCMOS SiGe GaAs pHEMT CMOS HEMT
Input
Output
Test Instrumentation Electronic Warfare Broadband Communication Infrastructure
Parameter Electrical Specifications1,
Small Signal Gain Input Return Loss Output Return Loss Reverse Isolation Output Power Compression
Min.
Specification Typ.
10.5 11.5
Max.
11.5 12.5
Unit
Condition
2GHz 12GHz 12GHz 20GHz 2GHz 20GHz 2GHz 20GHz 2GHz 20GHz 2GHz 10GHz 20GHz 2GHz 4.5GHz 4.5GHz 20GHz =3.5V, =-0.38V, =+1V
Noise Figure Drain Current Drain Voltage
Note: 1TAMBIENT =+25°C Device biased constant gate voltage, measured wafer with Measurement Conditions =-0.38V, =3.5V, =+1V.
MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless ConnectivityTM, PowerStar®, POLARISTOTAL RADIOand UltimateBlueare trademarks RFMD, LLC. BLUETOOTH trademark owned Bluetooth SIG, Inc., U.S.A. licensed RFMD. other trade names, trademarks registered trademarks property their respective owners. ©2006, Micro Devices, Inc.
DS090218
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
FMA3007
Absolute Maximum Ratings
Parameter
Input Power (PIN) Gain Voltage (VG1) Drain Voltage (VG2) Total Power Dissipation (PTOT) Gain Compression (comp) Thermal Resistivity (JC) Operating Temperature (TOPER) Storage Temperature (TSTG)
Rating
Unit
Caution! sensitive device.
Exceeding combination Absolute Maximum Rating conditions cause permanent damage device. Extended application Absolute Maximum Rating conditions device reduce device reliability. Specified typical performance functional operation device under Absolute Maximum Rating conditions implied. RoHS status based EUDirective2002/95/EC time this document revision). information this publication believed accurate reliable. However, responsibility assumed Micro Devices, Inc. ("RFMD") use, infringement patents, other rights third parties, resulting from use. license granted implication otherwise under patent patent rights RFMD. RFMD reserves right change component circuitry, recommended application circuitry specifications time without prior notice.
°C/W
Layout
Name Description
input (+Ve) temperature monitoring diode (-Ve) temperature monitoring diode Ground Gate control Gain control output Ground Drain voltage
Coordinates
140, 1153 2097, 2321, 2545, 2769, 2993, 3004, 1141 2800, 1650 2550, 1650
Note: Coordinates referenced from bottom left corner center bond opening.
Size
3150x1780
Thickness Min. Bond Pitch Min. Bond Opening (mxm)
100x100
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
DS090218
FMA3007
Typical Measured Performance Wafer
TAMBIENT =25°C; (VG1 =-0.38V, =3.5V, =+1V).
14.00 12.00 10.00 (dB) 8.00 6.00 4.00 2.00 0.00 Frequency (GHz)
equency
0.00 -10.00 -20.00 (dB) -30.00 -40.00 -50.00 -60.00
0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00 -50.00 Frequency (GHz)
(dB)
-70.00 Frequency
Noise Figure
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00 Frequency(GHz)
Gain (dB)
Gain Control Voltage
Noise Figure (dB)
-0.5 -0.4 -0.3 -0.2 -0.1
Frequency=10GHz
DS090218
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
FMA3007
Typical Measured Performance Wafer
TAMBIENT =-40°C +85°C; (VG1 =-0.38V, =3.5V, =+1V).
0.00 -10.00 -20.00 (dB) -30.00 -40.00
Degrees
14.00 12.00 10.00 (dB) 8.00 6.00 4.00 2.00 0.00 Frequency (GHz)
Degrees
-50.00 -60.00
Degrees Degrees
Frequency (GHz
0.00 -5.00 -10.00 (dB)
0.00 -10.00 -20.00 (dB) -30.00 -40.00 -50.00
-15.00 -20.00 -25.00 -30.00 -35.00 -40.00
Degrees Degrees
Degrees
-60.00 -70.00
Degrees
quency (GHz)
Frequency (GHz)
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
DS090218
FMA3007
S-Parameters
=-0.38V, =3.5V, =+1V
DS090218
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
FMA3007
S-Parameters, continued
Frequency Angle Angle Angle Angle 11.12 0.11 22.84 3.43 76.53 0.01 -22. -27.22 11.31 0.11 19.06 3.43 71.78 0.01 -27. -36.26 11.5 0.11 14.69 3.44 67.04 0.01 -31. -45.16 11.69 0.11 9.79 3.45 62.28 0.01 -37. -55.08 11.88 0.11 6.23 3.47 57.43 0.01 -42. -65.94 12.07 0.11 1.32 3.49 52.51 0.01 -48. -77.17 12.26 0.10 -2.75 3.52 47.60 0.02 -52. -17.48 12.45 0.10 -7.08 3.54 42.70 0.02 -57. 77.51 12.64 0.10 -11.05 3.58 37.72 0.02 -64. 63.15 12.83 0.10 -15.83 3.62 32.50 0.02 -71. 48.80 13.02 0.09 -20.74 3.65 27.22 0.02 -76. 33.57 13.21 0.09 -26.37 3.68 21.86 0.02 -82. 17.88 13.4 0.08 -33.12 3.72 16.46 0.02 -16. 1.73 13.59 0.08 -39.86 3.75 11.01 0.02 -13.77 13.78 0.07 -46.40 3.78 5.41 0.02 -28.48 13.97 0.07 -54.81 3.80 -0.34 0.02 -41.98 14.16 0.06 -64.08 3.81 -6.03 0.02 -54.27 14.35 0.05 -72.76 3.82 -11.60 0.02 -65.54 14.54 0.05 -47.47 3.84 -17.22 0.02 -76.15 14.73 0.04 47.91 3.85 -22.91 0.02 -50.08 14.92 0.04 71.00 3.85 -28.64 0.02 48.74 15.11 0.03 53.20 3.84 -34.30 0.02 76.52 15.3 0.03 33.02 3.84 -39.83 0.02 69.26 15.49 0.04 13.93 3.85 -45.39 0.02 62.48 15.68 0.04 -4.28 3.85 -51.01 0.02 56.54 15.87 0.04 -18.94 3.85 -56.69 0.02 50.74 16.06 0.05 -30.60 3.85 -62.28 0.02 45.36 16.25 0.05 -41.49 3.85 -67.91 0.03 41.50 16.44 0.06 -51.22 3.86 -73.44 0.03 37.88 16.63 0.06 -59.08 3.87 -79.17 0.03 35.17 16.82 0.07 -68.00 3.87 -84.87 0.03 31.98 17.01 0.07 -76.62 3.87 -18.55 0.03 -13. 28.68 17.2 0.07 -83.90 3.87 83.72 0.03 -18. 25.14 17.39 0.07 17.35 3.87 77.99 0.03 -24. 22.71 17.58 0.07 82.44 3.88 72.22 0.03 -29. 20.43 17.77 0.07 76.96 3.89 66.41 0.03 -35. 18.02 17.96 0.07 70.63 3.89 60.59 0.03 -40. 15.16 18.15 0.07 62.97 3.89 54.74 0.03 -46. 11.60 18.34 0.07 54.75 3.89 48.84 0.03 -51. 7.77 18.53 0.06 45.09 3.90 42.97 0.03 -56. 4.20 18.72 0.06 34.89 3.90 37.06 0.03 -61. 1.11 18.91 0.05 25.38 3.90 31.13 0.03 -67. -3.30 19.1 0.04 14.08 3.91 25.16 0.03 -72. -7.78 19.29 0.04 -0.07 3.91 19.10 0.03 -78. -12.88 19.48 0.03 -17.44 3.92 13.14 0.03 -84. -19.22 19.67 0.02 -45.86 3.93 6.99 0.03 -17. -24.90 19.86 0.02 -13.12 3.95 0.89 0.03 -30.45 0.03 61.43 3.96 -5.39 0.03 -37.05
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
DS090218
FMA3007
Biasing Circuit Schematic
100nF 100pF 100pF 100nF
Output Input
100nF 100pF
Assembly Diagram
recommended that connections made using bond wires 25µm diameter maximum length 300µm. Improved input return loss achieved, compensate bond wire length, with addition microstrip transformer shown above.
Bill Materials
tracks should characteristic material. Capacitor 100pF Chip Capacitor Capacitor 100pF 0402
DS090218
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
FMA3007
Preferred Assembly Instructions
GaAs devices fragile should handled with great care. Specially designed collets should used where possible. back metalized recommended mounting method conductive epoxy. Epoxy should applied attachment surface uniformly sparingly avoid encroachment epoxy face die, ideally should exceed half chip height. automated dispense Ablestick LMISR4 recommended, manual dispense Ablestick 84-1 84-1 LMIT recommended. These should cured temperature 150°C hour oven especially aside epoxy curing only. possible curing oven should flushed with nitrogen. gold-tin (80% eutectic attach melting point approximately 280°C absolute temperature being used depends leadframe material used particular application. maximum time used should kept minimum. This part gold (Au) bond pads requiring gold (99.99% pure) bondwire. recommended that 25.4µm diameter gold wire used. Recommended lead bond technique thermocompression wedge bonding with 0.001" (25µm) diameter wire. Bond force, time stage temperature, ultrasonics critical parameters settings dependent setup application being used. Ultrasonic thermosonic bonding recommended. Bonds should made from first then mounting substrate package. physical length bondwires should minimized especially when making ground connections.
Handling Precautions
avoid damage devices, care should exercised during handling. Proper Electrostatic Discharge (ESD) precautions should observed stages storage, handling, assembly, testing.
ESD/MSL Rating
These devices should treated Class 250V) using human body model defined JEDEC Standard 22A114. Further information control measures found MIL-STD-1686 MIL-HDBK-263. This unpackaged part therefore rating applies.
Application Notes Design Data
Application Notes design data including S-parameters noise parameters available request from www.rfmd.com.
Reliability
MTTF million hours channel temperature 150°C achieved process used manufacture this device.
Disclaimers
This product designed space-based life-sustaining/supporting equipment.
Ordering Information
Quantity
Standard order quanity (waffle pack) Small quantity (25) Sample quantity
Ordering Code
FMA3007-000 FMA3007-000SQ FMA3007-000S3
7628 Thorndike Road, Greensboro, 27409-9421 sales technical support, contact RFMD (+1) 336-678-5570 sales-support@rfmd.com.
DS090218
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