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SGA/SGC Series SOT-86 Package SnPb Plated SGA-2186 SGA-2286
Top Searches for this datasheetReliability Report SGA/SGC Series SOT-86 Package SnPb Plated SGA-2186 SGA-2286 SGA-2386 SGA-2486 SGA-3286 SGA-3386 SGA-3486 SGA-3586 SGA-4186 SGA-4286 SGA-4386 SGA-4486 SGA-4586 SGA-5286 SGA-5386 SGA-5486 SGA-5586 SGA-6286 SGA-6386 SGA-6486 Matte RoHS Compliant SGA-2186Z SGA-2286Z SGA-2386Z SGA-2486Z SGA-3286Z SGA-3386Z SGA-3486Z SGA-3586Z SGA-4186Z SGA-4286Z SGA-4386Z SGA-4486Z SGA-4586Z SGA-5286Z SGA-5386Z SGA-5486Z SGA-5586Z SGA-6286Z SGA-6386Z SGA-6486Z SGC-2386Z SGC-2486Z SGC-4386Z SGC-4486Z SGC-6386Z Technology Broomfield 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-105584 SGA/SGC SOT-86 Reliability Report Overview This reliability report describes reliability test conditions results series Transistors Gain Blocks. data comprised initial qualification tests reliability monitoring tests. These tests include humidity (autoclave), extreme cold environments (temperature cycling), moisture sensitivity (MSL-1 solder reflow testing). Introduction Sirenza Microdevices' family Silicon Germanium (SiGe) Gain Blocks that offer benefits attainable with conventional silicon bipolar technologies. This family products offer lower power consumption, high output power high efficiency, high integration levels, cost. Sirenza Microdevices family products cost, high performance SiGe gain blocks. These Darlington designs contain patented active bias network that provides stable current over temperature process variations. III. Fabrication Technology These amplifiers manufactured using Silicon Germanium Heterojunction Bipolar Transistor (HBT) technology. This self-aligned emitter, double poly process been production foundry since 1998. process been successfully used wide range RFIC products including PAs, DECT front transceivers, LNAs VCOs. This process offers comparable performance GaAs HBTs with added advantages mature high producible Silicon wafer processing. Package Type These SGA/SGC products packaged plastic encapsulated SOT-86 package that assembled using highly reproducible automated assembly process. designates lead-free lead frame using matte plated leads Green molding compound. mounted using industry standard thermally electrically conductive silver epoxy. SGA/SGC SOT-86 Reliability Report Qualification Methodology Sirenza Microdevices qualification process consists series tests designed stress various potential failure mechanisms. This testing performed ensure that Sirenza Microdevices products robust against potential failure modes that could arise from various package failure mechanisms stressed. qualification testing based JEDEC test methods common semiconductor industry. FMEA approach used determine test methods included qualification plan. manufacturing test specifications used PASS/FAIL criteria initial final DC/RF tests. Qualification Family SGA/SGC products same technology, process materials, well assembly process materials. parts numbers listed cover page categorized qualification family qualified association when family member successfully completes qualification. VII. Operational Life Testing Sirenza Microdevices defines operational life testing biased elevated temperature test performed maximum operational junction temperature limit. SGA/SGC family, maximum operational temperature limit 150oC. purpose operational life test statistically show that product operated maximum operational ratings will reliable operating several hundred devices total time 1000 hours. results this test expressed device hours that calculated multiplying total number devices passing test number hours tested. VIII. Moisture Sensitivity Level Level Device SGA/SGC family products have successfully completed hours moisture soak (85oC/85%RH), followed three passes through convection reflow oven 270oC versions), 235oC (non-Z versions). successful completion this test classifies part JESD 22-A113B Moisture Sensitivity Level (MSL-1). MSL-1 indicates that special pack requirements time limits from opening static reflow exist these products. MSL-1 highest level moisture resistance that device classified according above mentioned standard. SGA/SGC SOT-86 Reliability Report Electrostatic Discharge Classification Sirenza Microdevices classifies Human Body Model (HBM) electrostatic discharge (ESD) according JESD22-A114 convention. pair combinations were tested. Each pair stressed static voltage level using positive negative pulse polarity determine weakest pair combination. weakest pair tested with devices below above failure voltage classify part. Pass/Fail status part determined manufacturing test specification. class quoted indicates that device passed exposure certain voltage, does pass next higher level. following table indicates JESD sensitivity classification levels. Class Passes 1000 2000 Fails <250 1000 2000 4000 Part Number SGA-2186/2186Z SGA-2386/2386Z SGA-2486/2486Z SGA-3x86/3x86Z SGA-4186/4186Z SGA-4286/4286Z SGA-4486/4486Z SGA-4586/4586Z SGA-5286/5286Z SGA-5486/5486Z SGA-6486/6486Z SGA-6586/6586Z Rating Operational Life Test Results Date Q1-00 Q3-00 Q4-00 Q2-02 Q4-02 Q3-03 Q4-04 Q4-04 Test Duration 1000 1000 1000 1000 1000 1000 1000 1000 Junction Temperature 125°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C Quantity Device Hours 398,000 42,000 60,000 42,000 42,000 20,000 40,000 80,000 SGA/SGC SOT-86 Reliability Report Qualification Test Results Group Test Name Test Condition/ Standard MSL1 Reflow 235oC Peak JESD22-A113C (Non-Z version) Preconditioning(1) MSL1 Reflow 270oC Peak JESD22-A113C version) Air, Soldered -65oC 150oC dwell, transition 1000 cycles JESD22-A104B (Non-Z version) Temperature Cycling Air, Soldered -65oC 150oC dwell, transition 1000 cycles JESD22-A104B version) -65°C +150°C dwell, transition cycles JESD22-A104B (Non-Z version) Temperature Cycle -65°C +150°C dwell, transition 1000 cycles JESD22-A104B version) Pass Pass Pass Sample Size 1480 Results Pass Pass Pass Preconditioning Test Groups unit removed bond defect (FA04173) SGA/SGC SOT-86 Reliability Report Qualification Test Results Group Test Name Test Condition/ Standard 150°C(3) 1000 hours JESD22-A108B (Non-Z version) 150°C 1000 hours JESD22-A108B version) Tamb=110°C, 85%RH Biased, hours JESD22-A110B (Non-Z version) HAST Tamb=110°C, 85%RH Biased, hours JESD22-A110B version) Tamb=121°C, 100%RH Un-Biased, hours JESD22-A102C (Non-Z version) Autoclave Tamb=121°C, 100%RH Un-Biased, hours JESD22-A102C version) units were done Tj=125C Sample Size Results Pass High Temperature Operating Life Pass Pass Pass Pass Pass SGA/SGC SOT-86 Reliability Report Qualification Test Results Group Test Name Test Condition/ Standard -40°C +85°C Cycled bias on/5'off) 1000 cycles JESD22-A109A (Non version) -40°C +85°C Cycled bias on/5'off) 1000 cycles JESD22-A109A version) Tamb=-40°C 1000 hours (Non version) Tamb=-40°C 1000 hours version) Tamb=150°C 1000 hours JESD22-A103B (Non version) Tamb=150°C 1000 hours JESD22-A103B version) Sample Size Results Pass Power Temperature Cycle Pass Pass Temperature Storage Pass Pass High Temperature Storage Pass SGA/SGC SOT-86 Reliability Report Qualification Test Results Group Test Name Whisker Test Condition/ Standard Tamb=60°C, 90%RH 2600 hours Look Steam Condition Condition 215°C JESD22-B102C (Non-Z version) Look Steam Condition Condition 215°C JESD22-B102C version) Look Steam Condition Condition 245°C JESD22-B102C version) Sample Size Results Pass Pass Pass Solderability Pass SGA/SGC SOT-86 Reliability Report XII. Junction Temperature Determination issue performing qualification testing accurately determine junction temperature device. Sirenza Microdevices uses spot size emissivity corrected infrared camera measurement resolve surface temperature device maximum operational power dissipation. Results displayed below SGA-6486 SGA-6586Z. Figure Infrared Thermal Image SGA-6486, 4.65V, 80.3mA, Tlead 85.5°C SGA/SGC SOT-86 Reliability Report Figure Infrared Thermal Image SGA-6586Z, 4.50V, 80.2mA, Tlead 84.5°C Other recent searchesU109A - U109A U109A Datasheet TR-5 - TR-5 TR-5 Datasheet TDA7200 - TDA7200 TDA7200 Datasheet PM50CS1D060 - PM50CS1D060 PM50CS1D060 Datasheet iP0003 - iP0003 iP0003 Datasheet HJS30 - HJS30 HJS30 Datasheet GSM850 - GSM850 GSM850 Datasheet GSM850 - GSM850 GSM850 Datasheet 74AC125 - 74AC125 74AC125 Datasheet
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