SGA/SGC Series SOT-89 Package SnPb Plated SGA-5289 SGA-5389

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SGA/SGC Series SOT-89 Package SnPb Plated SGA-5289 SGA-5389

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Reliability Report
SGA/SGC Series SOT-89 Package
SnPb Plated
SGA-5289 SGA-5389 SGA-5489 SGA-5589 SGA-6289 SGA-6389 SGA-6489 SGA-6589 SGA-7489 SGA-9089 SGA-9189 SGA-9289
Matte RoHS Compliant
SGA-5289Z SGA-5389Z SGA-5489Z SGA-5589Z SGA-6289Z SGA-6389Z SGA-6489Z SGA-6589Z SGA-7489Z SGA-9089Z SGA-9189Z SGA-9289Z SGC-6289Z SGC-6389Z SGC-6489Z
information provided herein believed reliable press time. RFMD assumes responsibility inaccuracies omissions. RFMD assumes responsibility this information, such information shall entirely user's risk. Data subject change. Technology Broomfield 80021 Phone: (800) SMI-MMIC http://www.rfmd.com Document RQR-105585
SGA/SGC SOT-89 Reliability Report
Overview This reliability report describes reliability test conditions results series Transistors Gain Blocks. data comprised initial qualification tests reliability monitoring tests. These tests include humidity (autoclave), extreme cold environments (temperature cycling), moisture sensitivity (MSL1 solder reflow testing). Introduction RFMD's' SGA-5, SGA-6, SGA-7 family Silicon Germanium (SiGe) Gain Blocks that offer benefits attainable with conventional silicon bipolar technologies. This family products offer lower power consumption, high output power high efficiency, high integration levels, cost. RFMD's SGA-9 product family low-cost high-performance SiGe transistors that off-chip matching maximum flexibility. These products used higher power applications with linearity requirements +42.0dBm OIP3 RFMD's family products cost, high performance SiGe gain blocks. These Darlington designs contain patented active bias network that provides stable current over temperature process variations. III. Fabrication Technology These amplifiers manufactured using Silicon Germanium Heterojunction Bipolar Transistor (HBT) technology. This self-aligned emitter, double poly process been production foundry since 1998. process been successfully used wide range RFIC products including PAs, DECT front transceivers, LNAs VCOs. This process offers comparable performance GaAs HBTs with added advantages mature high producible Silicon wafer processing. Package Type These SGA/SGC products packaged plastic encapsulated SOT-89 package that assembled using highly reproducible automated assembly process. designates lead-free lead frame using matte plated leads Green molding compound. mounted using industry standard thermally electrically conductive silver epoxy.
SGA/SGC SOT-89 Reliability Report
Qualification Methodology RFMD qualification process consists series tests designed stress various potential failure mechanisms. This testing performed ensure that RFMD products robust against potential failure modes that could arise from various package failure mechanisms stressed. qualification testing based current JEDEC test methods common semiconductor industry time qualification. FMEA approach used determine test methods included qualification plan. manufacturing test specifications used PASS/FAIL criteria initial final DC/RF tests. Qualification Family SGA/SGC products same technology, process materials, well assembly process materials. parts numbers listed cover page categorized qualification family qualified association when family member successfully completes qualification. VII. Operational Life Testing RFMD defines operational life testing biased elevated temperature test performed maximum operational junction temperature limit. SGA/SGC family, maximum operational temperature limit 150oC. purpose operational life test statistically show that product operated maximum operational ratings will reliable operating several hundred devices total time 1000 hours. results this test expressed device hours that calculated multiplying total number devices passing test number hours tested. VIII. Moisture Sensitivity Level MSL1 Device SGA/SGC family products have successfully completed hours moisture soak (85oC/85%RH), followed three passes through convection reflow oven 270oC versions), 235oC (non-Z versions). successful completion this test classifies part JESD 22-A113 Moisture Sensitivity Level (MSL1). MSL1 indicates that special pack requirements time limits from opening static reflow exist these products. MSL1 highest level moisture resistance that device classified according above mentioned standard.
SGA/SGC SOT-89 Reliability Report
Electrostatic Discharge Classification RFMD classifies Human Body Model (HBM) electrostatic discharge (ESD) according JESD22-A114 convention. pair combinations were tested. Each pair stressed static voltage level using positive negative pulse polarity determine weakest pair combination. weakest pair tested with devices below above failure voltage classify part. Pass/Fail status part determined manufacturing test specification. class quoted indicates that device passed exposure certain voltage, does pass next higher level. following table indicates JESD sensitivity classification levels.
Class
Passes 1000 2000
Fails <250 1000 2000 4000
Part Number SGA-5389/5389Z SGA-6289/6289Z SGA-6389/6389Z SGA-6489/6489Z SGA-7489/7489Z SGA-9089/9089Z SGA-9189/9189Z SGA-9289/9289Z SGC-6289Z SGC-6489Z
Rating
Operational Life Test Results
Part SGA-9189 SGA-7289Z SGA-9289Z SGC-6489Z Test Duration 1000 1000 1000 1000 Junction Temperature 150°C 150°C 150°C 150°C Quantity Device Hours 189,000 80,000 80,000 80,000
SGA/SGC SOT-89 Reliability Report
Reliability Test Results
Group Test Name Test Condition/ Standard MSL1 Reflow 235oC Peak JESD22-A113 (Non-Z version) Preconditioning(1) MSL1 Reflow 270oC Peak JESD22-A113 version) Air, Soldered -65oC 150oC dwell, transition 1000 cycles JESD22-A104 version) -65°C +150°C dwell, transition cycles JESD22-A104 (Non-Z version) Temperature Cycle -65°C +150°C dwell, transition 1000 cycles JESD22-A104 version) Pass Pass Sample Size Results Pass
Pass
Temperature Cycling
Pass
Preconditioning Test Groups failure test discrepancy
SGA/SGC SOT-89 Reliability Report
Reliability Test Results
Group Test Name Test Condition/ Standard 150°C 1000 hours JESD22-A108 (Non-Z version) 150°C 1000 hours JESD22-A108 version) Tamb=110°C, 85%RH Biased, hours JESD22-A110 version) Tamb=121°C, 100%RH Un-Biased, hours JESD22-A102 (Non-Z version) Autoclave Tamb=121°C, 100%RH Un-Biased, hours JESD22-A102 version) -40°C +85°C Cycled bias on/5'off) 1000 cycles JESD22-A109 Pass Sample Size Results Pass
High Temperature Operating Life
Pass
Pass
HAST
Pass
Pass
Power Temperature Cycle
SGA/SGC SOT-89 Reliability Report
Reliability Test Results
Group Test Name Temperature Storage Test Condition/ Standard Tamb=-40°C 1000 hours version) Tamb=150°C 1000 hours JESD22-A103 Tamb=150°C 1000 hours JESD22-A103 Tamb=51°C, 80%RH 1000 hours Tamb=20-30°C 30-80% months Whisker Tamb=60°C months Temp Cycle -55°C +85°C 1000cycles Sample Size Results Pass
Pass
High Temperature Storage
Pass
Pass
Pass
Pass
Pass
SGA/SGC SOT-89 Reliability Report
Reliability Test Results
Group Test Name Test Condition/ Standard Look Steam Condition Condition 215°C JESD22-B102 (Non-Z version) Look Steam Condition Condition 215°C JESD22-B102 version) Look Steam Condition Condition 245°C JESD22-B102 version) Sample Size Results Pass
Pass
Solderability
Pass
SGA/SGC SOT-89 Reliability Report
XII. Junction Temperature Determination issue performing qualification testing accurately determine junction temperature device. RFMD uses spot size emissivity corrected infrared camera measurement resolve surface temperature device maximum operational power dissipation. Typical result displayed below SGA-9189.
SGA/SGC SOT-89 Reliability Report
XIII. Thermal Resistance (junction lead) Junction temperature measurements determine thermal resistance (Rth) product. Statistically calculated thermal resistances (°C/W) given table below.
Part SGA-5289/Z SGA-5389/Z SGA-5489/Z SGA-5589/Z SGA-6289/Z SGA-6389/Z SGA-6489/Z SGA-6589/Z SGA-7489/Z SGA-9089/Z SGA-9189/Z SGA-9289/Z SGC-6389/Z SGC-6289/Z SGC-6489/Z (C/W)

SGA/SGC Series SOT-89 Package SnPb Plated SGA-5289 SGA-5389

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