Input mixer stages tuner. Features Integrated gate protectio

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Input mixer stages tuner. Features Integrated gate protectio

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BF996S
Input mixer stages tuner.
Features
Integrated gate protection diodes noise figure feedback capacitance
High cross modulation performance input capacitance High AGC-range
9279
BF996S Marking: Plastic case (SOT 143) Source; Drain; Gate Gate
Absolute Maximum Ratings
Parameters Drain source voltage Drain current Gate 1/gate 2-source peak current Total power dissipation Tamb 60°C Channel temperature Storage temperature range Symbol ±IG1/G2SM Ptot Tstg Value +150 Unit
Maximum Thermal Resistance
Parameters Channel ambient glass fibre printed board 1.5) plated with Symbol RthChA Value Unit
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF996S
Electrical Characteristics
Tamb 25°C Parameters Test Conditions Drain-source breakdown voltage -VG1S -VG2S Gate 1-source breakdown voltage ±IG1S VG2S Gate 2-source breakdown voltage ±IG2S VG1S Gate 1-source leakage current ±VG1S VG2S Gate 2-source leakage current ±VG2S VG1S Drain current VG1S VG2S Type Symbol V(BR)DS ±V(BR)G1SS ±V(BR)G2SS ±IG1SS ±IG2SS IDSS IDSS IDSS -VG1S(OFF) -VG2S(OFF) Min. 10.5 Typ. Max. Unit
Gate 1-source cut-off voltage VG2S Gate 2-source cut-off voltage VG1S
Electrical Characteristics
VG2S MHz, Tamb 25°C Parameters Test Conditions Forward transadmittance Gate input capacitance Gate input capacitance VG1S VG2S Feedback capacitance Output capacitance Power gain VG2S range VG2S Noise figure VG2S Type Symbol y21s Cissg1 Cissg2 Crss Coss Min. Typ. 18.5 10.8 Max. Unit
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF996S
Common Source S-Parameters VG2S
VDS/V ID/mA f/MHz 1000 1100 1200 1300 1000 1100 1200 1300 1000 1100 1200 1300 0.99 0.98 0.95 0.92 0.89 0.86 0.83 0.80 0.78 0.75 0.72 0.70 0.68 0.99 0.98 0.95 0.92 0.88 0.85 0.82 0.79 0.76 0.73 0.71 0.68 0.66 0.99 0.98 0.94 0.91 0.87 0.84 0.81 0.78 0.75 0.72 0.69 0.67 0.65 -8.5 -17.7 -24.6 -32.1 -39.2 -45.8 -52.3 -58.7 -64.7 -70.7 -76.6 -82.5 -88.6 -9.0 -18.7 -26.0 -33.7 -41.2 -48.3 -55.1 -61.6 -67.9 -74.2 -80.2 -86.4 -92.3 -9.4 -19.4 -27.1 -35.0 -42.9 -50.3 -57.2 -63.9 -70.4 -76.8 -82.9 -89.0 -95.1 1.45 1.52 1.33 1.26 1.18 1.11 1.05 0.99 0.93 0.88 0.84 0.80 0.76 1.82 1.90 1.67 1.58 1.48 1.39 1.32 1.24 1.17 1.11 1.06 1.01 0.97 2.01 2.10 1.84 1.74 1.63 1.53 1.45 1.37 1.29 1.22 1.17 1.12 1.07 164.9 150.9 134.7 121.3 108.4 96.5 85.0 74.1 63.6 53.1 43.7 33.6 24.1 165.3 151.8 136.3 123.3 110.9 99.5 88.7 78.1 67.9 57.9 48.7 38.9 29.6 165.4 152.0 136.7 123.8 111.5 100.3 89.6 79.4 69.2 59.4 50.2 40.8 31.5 0.001 0.003 0.004 0.004 0.005 0.005 0.004 0.004 0.004 0.004 0.004 0.004 0.006 0.002 0.003 0.004 0.005 0.005 0.005 0.005 0.004 0.004 0.004 0.004 0.004 0.006 0.002 0.003 0.004 0.005 0.005 0.005 0.005 0.005 0.004 0.004 0.004 0.004 0.006 82.2 75.6 67.7 62.8 57.8 57.3 58.9 63.3 73.1 83.5 102.1 120.4 131.7 81.9 75.0 67.2 61.8 56.3 55.8 56.7 60.7 69.9 80.0 98.9 118.2 130.5 81.4 74.6 66.4 60.8 55.1 54.4 54.9 58.5 67.3 76.7 95.2 115.3 128.7 0.99 0.98 0.97 0.95 0.93 0.92 0.90 0.88 0.86 0.85 0.83 0.82 0.80 0.99 0.98 0.96 0.95 0.93 0.91 0.90 0.88 0.86 0.84 0.83 0.81 0.80 0.98 0.97 0.96 0.94 0.92 0.91 0.89 0.87 0.86 0.84 0.83 0.81 0.79 -3.4 -7.1 -9.7 -12.3 -15.1 -17.4 -19.7 -22.0 -24.3 -26.2 -28.4 -30.5 -32.7 -3.5 -7.2 -9.8 -12.6 -15.3 -17.8 -20.0 -22.4 -24.6 -26.6 -28.8 -31.0 -33.3 -3.6 -7.3 -10.0 -12.9 -15.7 -18.0 -20.4 -22.7 -25.0 -27.1 -29.4 -31.6 -33.9
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF996S
Dimensions
12240
TELEFUNKEN Semiconductors Rev. 17-Apr-96
BF996S
Ozone Depleting Substances Policy Statement
policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances.
reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423
TELEFUNKEN Semiconductors Rev. 17-Apr-96

Input mixer stages tuner. Features Integrated gate protectio

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