The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

Input- mixerstages especially TV-tuners MHz. Features Integr


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



BF961
Input- mixerstages especially TV-tuners MHz.
Features
Integrated gate protection diodes High cross modulation performance noise figure
High AGC-range feedback capacitance input capacitance
BF961 Marking: BF961 Plastic case Drain, Source, Gate Gate
Absolute Maximum Ratings
Parameters Drain source voltage Drain current Gate 1/gate 2-source peak current Total power dissipation Tamb 60°C Channel temperature Storage temperature range Symbol ±IG1/2SM Ptot Tstg Value +150 Unit
Maximum Thermal Resistance
Parameters Channel ambient glass fibre printed board 1.5) plated with TELEFUNKEN Semiconductors Rev. 16-Jan-97 Symbol RthChA Value Unit
BF961
Electrical Characteristics
Tamb 25_C, unless otherwise specified Parameters Test Conditions Drain-source breakdown voltage -VG1S -VG2S Gate 1-source breakdown voltage ±IG1S VG2S Gate 2-source breakdown voltage ±IG2S VG1S Gate 1-source leakage current ±VG1S VG2S Gate 2-source leakage current ±VG2S VG1S Drain current VG1S VG2S Gate 1-source cut-off voltage VG2S Gate 2-source cut-off voltage VG1S Type Symbol V(BR)DS ±V(BR)G1SS ±V(BR)G2SS ±IG1SS ±IG2SS IDSS IDSS IDSS -VG1S(OFF) -VG2S(OFF) Min. 10.5 Typ. Max. Unit
BF961 BF961A BF961B
Electrical Characteristics
VG2S MHz, Tamb 25°C, unless otherwise specified Parameters Test Conditions Forward transadmittance Gate 1-input capacitance Gate 2-input capacitance VG1S VG2S Feedback capacitance Output capacitance Power gain VG1S VG2S range VG2S Noise figure VG1S VG2S Type Symbol y21s Cissg1 Cissg2 Crss Coss Min. Typ. Max. Unit
nGps
TELEFUNKEN Semiconductors Rev. 16-Jan-97
BF961
Typical Characteristics 25_C unless otherwise specified)
Y21S Forward Transadmittance Total Power Dissipation
12159
-1.5-1.0-0.5 VDS=15V f=1MHz VG2S=5V
12162
Tamb Ambient Temperature
VG1S Gate Source Voltage
Figure Total Power Dissipation Ambient Temperature
Drain Current
12160
Figure Forward Transadmittance Gate Source Voltage
issg1 Gate Input Capacitance
VG1S= 0.6V 0.4V 0.2V -0.2V -0.4V -0.6V -0.8V
-1.5 -1.0 -0.5 VG1S Gate Source Voltage VDS=15V VG2S=4V f=1MHz
Drain Source Voltage
12163
Figure Drain Current Drain Source Voltage
12161
Figure Gate Input Capacitance Gate Source Voltage
issg2 Gate Input Capacitance
Y21S Forward Transadmittance
VDS=15V IDS=10mA
VG1S=0.5V
VDS=15V VG1S=0 f=1MHz
-0.5V
12164
VG2S Gate Source Voltage
VG2S Gate Source Voltage
Figure Forward Transadmittance Gate Source Voltage
Figure Gate Input Capacitance Gate Source Voltage
TELEFUNKEN Semiconductors Rev. 16-Jan-97
BF961
Output Capacitance
12165
VG2S=4V f=1MHz 700MHz
12167
VDS=15V VG2S=4V f=50.700MHz ID=5mA 10mA 20mA
f=50MHz 100MHz 200MHz 300MHz 400MHz 500MHz
600MHz
(y21)
Drain Source Voltage
Figure Output Capacitance Drain Source Voltage
12166
Figure Short Circuit Forward Transfer Admittance
12168
f=700MHz 600MHz 500MHz 400MHz 300MHz 200MHz 100MHz ID=20mA VDS=15V VG2S=4V ID=5.20mA f=50.700MHz
f=700MHz 600MHz 500MHz 400MHz 300MHz 200MHz 100MHz VDS=15V VG2S=4V ID=5.20mA f=50.700MHz
ID=5mA
(y11)
(y22)
Figure Short Circuit Input Admittance
Figure Short Circuit Output Admittance
TELEFUNKEN Semiconductors Rev. 16-Jan-97
BF961
Dimensions
12242
TELEFUNKEN Semiconductors Rev. 16-Jan-97
BF961
Ozone Depleting Substances Policy Statement
policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances.
reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423
TELEFUNKEN Semiconductors Rev. 16-Jan-97

Other recent searches


TPS31xxExx - TPS31xxExx   TPS31xxExx Datasheet
TPS31xxH20 - TPS31xxH20   TPS31xxH20 Datasheet
TPS31xxK33 - TPS31xxK33   TPS31xxK33 Datasheet
SBR05U20LPS - SBR05U20LPS   SBR05U20LPS Datasheet
LM5088 - LM5088   LM5088 Datasheet
HT1602 - HT1602   HT1602 Datasheet
APT47GA60JD40 - APT47GA60JD40   APT47GA60JD40 Datasheet
2N7000 - 2N7000   2N7000 Datasheet
2N7002 - 2N7002   2N7002 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive