Drawn Approval CUSTOMER Approval Rev. September 2008 ww
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Specification WH2001
Drawn Approval
CUSTOMER
Approval
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Packing Soldering
CONTENTS
Absolute Maximum Ratings Electro Characteristics Outline Dimension Electro-Optical characteristic Diagram Color Binning Rank WH603R Reliability tests
Precaution
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
WH2001
Description
Vary Thin Reflector type Surface-mounted chip device. Pb-free RoHS complaint component. High brightness Thermal Resistance Tape Reel packing.
WH2001
Features
Emitted Color White chromaticity
Material InGaN
Applications
Electric appliance Other decoration lighting
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Absolute maximum ratings
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operation Temperature Storage Temperature Symbol Topr. Tstg. Value
(Ta=25)
Unit
conditions: Pulse width Tw0.1ms Duty ratio1/10.
Electro-Optical Characteristics
Parameter Forward Voltage Reverse Current Luminous Intensity*2 Luminous Flux Symbol Chromaticity Coordinates*3 Viewing Angle*4 21/2 Condition IF=20 VR=5V IF=20 IF=20 IF=20 IF=20 IF=20 0.28 0.25 1800 2600 0.34 0.34
(Ta=25)
Unit
luminous intensity measured peak spatial pattern which aligned with mechanical axis package. standard colorimetric system off-axis where luminous intensity peak intensity. [Note] products confirm listed minimum maximum specifications electric optical characteristics, when operated Rev. 20mA within maximum ratings shown above. measurements were made under standardized environment SSC. (Tolerance ±10%, color coordinate ±0.01, ±0.1V)
September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
3.Outline Dimension
[TOP VIEW]
[SIDE VIEW]
[BOTTOM VIEW]
[INNER CIRCUIT]
Tolerance: ±0.1, Unit:
Recommended Soldering Design
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Forward Current, [mA]
Relative Intensity
Electro-Optical characteristic Diagram
Forward Current Forward Voltage
(Ta=25
Forward Voltage,
Relative Luminous Intensity Forward Current
(Ta=25
Forward Current[mA]
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Forward current IF(mA)
Electro-Optical characteristic Diagram
Ambient Temperature Allowable Forward Current
Ambient temperature Ta(?
Radiation Diagram
(Ta=25
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity (a.u.)
Electro-Optical characteristic Diagram
Spectrum
(TA=25, IF=20mA)
Wavelength (nm)
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Color Binning
Rev. September 2008 www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
coordinate
Color Binning
0.34
0.32
0.30
0.28
0.26
0.26
0.28
0.30
0.32
0.34
coordinate
Color Rank
0.2966
0.2851 0.2983 0.3095 0.3095 0.2983 0.3123 0.3254
0.2583 0.2639 0.2881 0.2811 0.2811 0.2881 0.3135 0.3079
0.2851
0.2639 0.2700 0.2951 0.2881 0.3079 0.3300 0.3357 0.3135
0.2983
0.2881 0.2951 0.3184 0.3135 0.3357 0.3135 0.3184 0.3400
0.2726 0.2875 0.2983 0.3254
0.2875 0.3011 0.3123 0.3257
0.3381 0.3257 0.3123
0.3123 0.3011 0.3142
Rev. September 2008
Measurement Uncertainty Color Coordinates 0.01
www.ZLED.com Document SSC-QP-7-07-24 (Rev.00)
Rank WH2001
Luminous Intensity: [mcd]
Rank
[mcd] 1000 1550 1550 2600
Condition =20mA
Color Coordinate:
Rank
0.2966 0.2583 0.2851 0.2639 0.2983 0.2881 0.3095 0.2811 0.3254 0.3079 0.3257 0.3357
0.2851 0.2639 0.2726 0.2700 0.2875 0.2951 0.2983 0.2881 0.3381 0.3300 0.3123 0.3135
0.2983 0.2881 0.2875 0.2951 0.3011 0.3184 0.3123 0.3135 0.3257 0.3357 0.3011 0.3184
0.3095 0.2811 0.2983 0.2881 0.3123 0.3135 0.3254 0.3079 0.3123 0.3135 0.3142 0.3400
Condition
=20mA
Forward voltage:
Condition =20mA
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
Reliability Tests
Item
Life Test High Temperature Operating Temperature Operating Thermal Shock Resistance soldering Heat (Human Body Model) High Temperature Storage Temperature Storage Temperature Humidity Storage Temperature Humidity Operating
Condition
20mA 20mA 20mA (30min) (30min) (Transfer time 10sec, 1Cycle 1hr) 10sec 1kV, 1.5k 100pF 85%, 20mA
Note
1000hrs 1000hrs 1000hrs cycles time time 1000hrs 1000hrs 1000hrs 100hrs
Failures
0/22 0/22 0/22 0/40 0/22 0/22 0/22 0/22 0/22 0/22
Judging Criteria Reliability Tests
Notes Upper Standard Level Lower Standard Level.
USL[1]
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
3.7±0.1
(2.75)
±0.2
Label
Tolerance: ±0.2, Unit:
Quantity: 2,000pcs./Reel Cumulative Tolerance: Cumulative Tolerance/10pitches ±0.2mm Adhesion Strength Cover Tape: Adhesion strength 0.1-0.7N when over tape turned from carrier tape at10°angle carrier tape. Package: P/N, Manufacturing data Code quantity indicated damp proof Package.
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
+0.2
Packing
4.0±0.1
+0.1
2.9±0.1 1.75±0.1 3.5±0.05 8.0±0.1 0.25±0.05
Marking Direction
0.85±0.1
11.4
±0.3
±0.2
Reel Packing Structure
Reel
Product No.: SSC-WH2001 Quantity 2000 Batch/Lot number :############
Aluminum Vinyl
Product No.: SSC-WH2001 Quantity 2000 Batch/Lot number ############
Outer
*Material: Paper(SW3B(B)) 7inch
MADE KOREA
TYPE
SIZE(mm)
Acriche
RoHS
CHIP
PART SSCWh2001 CODE Q'YT 20,000EA DATE
SEOUL SEMICONDUCTOR CO.,LTD
Semiconductor EcoLight
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
Soldering
Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 sec. Max. Max.
2.5~5 sec.
2.5~5 sec. Pre-heating 120~150
Max. sec. Max. 60sec. Max. Above
120sec. Max.
sec. Max.
Lead-Free Solder
Lead-frame Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 sec. Max. Max.
sec.
sec. Pre-heating 150~200
Max. sec. Max. 60sec. Max. Above
120sec. Max.
sec. Max.
Hand Soldering conditions exceed seconds maximum under soldering iron.
encapsulated material LEDs silicone. Precautions should taken avoid strong pressure encapsulated part. when using chip mounter, picking nozzle that does affect silicone resign should used.
Note case that soldered products reused soldering process, don't guarantee products.
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
Precaution
Storage order avoid absorption moisture, recommended store desiccator) with desiccant. Otherwise, store them following environment recommended. Temperature 5~30 Humidity 60%HR max. Attention after opened However corresponded SMD, when soldered dip, interfacial separation affect light transmission efficiency, causing light intensity drop. Attention followed. After opened mounted, soldering shall quickly. Keeping fraction Temperature Humidity less than case more than week passed after opening change color indicator desiccant components shall dried 10-12hr. 60±5. case supposed components humid, shall dried dip-solder just before. 100Hr 80±5 12Hr 100±5. mechanical force excess vibration shall accepted apply during cooling process normal temp. after soldering. Quick cooling shall avoid. Components shall mounted warped direction PCB. Anti radioactive design considered products listed here Gallium arsenide used some products listed this publication. These products dangerous they burned smashed process disposal. also dangerous drink liquid inhale generated such products when chemically disposed. (10) This device should used type fluid such water, oil, organic solvent etc. When washing required, should used. (11) When LEDs illuminating, operating current should decided after considering ambient maximum temperature. (12) LEDs must stored maintain clean atmosphere. LEDs stored months more after being shipped from SSC, sealed container with nitrogen atmosphere should used storage. (13) LEDs must soldered within seven days after opening moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold close opening then store place. (15) appearance specifications product modified improvement without notice.
Rev. September 2008 www.ZLED.com
Document SSC-QP-7-07-24 (Rev.00)
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