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SWT805-S CUSTOMER Checked Approved SUPPLIER Drawn Approved


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*Customer
SWT805-S
CUSTOMER Checked Approved
SUPPLIER Drawn Approved
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Contents
Description Absolute Maximum Ratings Electro Characteristics Optical characteristics Reliability Test Item Condition Color Binning Material Outline Dimension Packing Soldering Precaution Handling Silicone Resin LEDs
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Revision History
Revision
Date
October. 2008
Page.
Initial release
Summary
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Z-Power X10490 Technical Data Sheet
SWT805-S
Description This surface-mount comes standard package dimension. substrate made molded plastic reflector sitting bent lead frame. attached within reflector cavity cavity encapsulated epoxy silicone. package design coupled with careful selection component materials allow these products perform with high reliability larger temperature range 100. high reliability feature crucial Automotive interior Indoor ESS.
Features
White colored package InGaN/Sic material Suitable assembly soldering methods Pb-Free Reflow soldering application RoHS compliant
Applications
White Back-light unit Electric Signs Signals Interior automotive Office Automation, Electrical Appliances, Industrial Equipment
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Absolute maximum ratings*1
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol
Value +100
Unit
Topr Tstg
Care taken that power dissipation does exceed absolute maximum rating product. measured 1msec pulse width 1/10 duty ratio.
Electric characteristics
Parameter Forward Voltage*1 Reverse Current Luminous Intensity*2 Luminous flux Viewing Angle
Symb
Condition =20mA VR=5V =20mA =20mA
1,400
1,900 4.75
2,500
Unit
=20mA
deg.
*1.Forward Voltage Measurement allowance ±0.1V *2.The luminous intensity measured peak spatial pattern which aligned with mechanical axis package. Luminous Intensity Measurement allowance off-axis where luminous intensity peak intensity. Estimated time degradation initial luminous intensity.
[Note] measurements were made under standardized environment SSC.
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity
Forward Current [mA]
Forward Current [mA]
Optical characteristics
Forward Current Forward Voltage
(Ta=25
Relative Luminous Intensity Forward Current
(Ta=25
Forward Voltage
Forward Current [mA]
Forward Current Derating Curve
(Ta=25
Radiation Diagram
Ambient Temperature
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Reliability Test
Item Thermal Shock Temperature Cycle High Temperature Storage High Temperature High Humidity Storage Temperature Storage Operating Endurance Test High Temperature Humidity Life High Temperature Life Test Temperature Life Test ESD(HBM) Reference Internal Reference EIAJ ED-4701 EIAJ ED-4701 Test Condition =-40oC (30MIN) 100oC (30MIN) =-40oC (30MIN) 25oC (5MIN) 100oC (30MIN) 25oC (5MIN) =100oC =85oC, RH=85% =-40oC =25oC, =20mA =60oC, RH=90%, =20mA =60oC, =20mA =-40oC, =20mA 1.5k; 100pF Duration Cycle Cycle Cycle 1,000 Hours Number Damage 0/22 0/22 0/22
EIAJ ED-4701
1,000 Hours
0/22
EIAJ ED-4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D
1,000 Hours 1,000 Hours 1,000 Hours 1,000 Hours 1,000 Hours Time
0/22 0/22 0/22 0/22 0/22 0/22
Criteria Judging Damage
Item Forward Voltage Reverse Current Luminous Intensity Symbol Condition =20mA VR=5V =20mA Criteria Judgement LSL*2 USL*1
Note Upper Standard Level
Lower Standard Level
*ESD guarantee condition
Item Test Condition 1,000 Criteria Judgement =100 below Test Form CONTACT
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
coords.
Color Coordinate Code Description
0.36
6300K
0.34 0.32 0.30 0.28 0.26 0.24 0.22
7000K 7500K 8000K 8400K 8900K 9900K 10800K 13000K 15000K 20000 30000
6700K
6500K
Rev.
0.25
0.26
0.27
0.28
0.29
0.30
0.31
0.32 January, 2009 0.33
www.acriche.com www.acriche.com
coords.
Document SSC-QP-7-07-24 (Rev.00)
*CIE RANK
<IF=20mA, Ta=25> 0.2720 0.2670 0.2743 0.2795 0.2850 0.2880 0.2920 0.2893 0.2795 0.2743 0.2815 0.2870 0.2893 0.2920 0.2960 0.2935 0.2870 0.2815 0.2885 0.2940 0.2935 0.2960 0.3000 0.2975 0.2940 0.2885 0.2955 0.3010 0.2975 0.3000 0.3040 0.3015 0.2885 0.2830 0.2900 0.2955 0.3000 0.3025 0.3065 0.3040 0.2815 0.2760 0.2830 0.2885 0.2960 0.2985 0.3025 0.3000 0.2830 0.2775 0.2845 0.2900 Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00) 0.2743 0.2690 0.2760 0.2815 0.2920 0.2948 0.2985 0.2960 0.2760 0.2705 0.2775 0.2830 0.2670 0.2620 0.2690 0.2743 0.2880 0.2910 0.2948 0.2920 0.2690 0.2638 0.2705 0.2760 0.2620 0.2570 0.2638 0.2690
0.2820 0.2850 0.2893 0.2865 0.2865 0.2893 0.2935 0.2910 0.2910 0.2935 0.2975 0.2950 0.2950 0.2975 0.3015 0.2990
*Measurement Uncertainty Color Coordinates 0.007
*CIE RANK
<IF=20mA, Ta=25> 0.3010 0.2955 0.3025 0.3080 0.3015 0.3040 0.3080 0.3055 0.3080 0.3025 0.3095 0.3150 0.3055 0.3080 0.3120 0.3095 0.3150 0.3095 0.3165 0.3220 0.3095 0.3120 0.3160 0.3135 0.3220 0.3165 0.3235 0.3290 0.3135 0.3160 0.3200 0.3175 0.3165 0.3110 0.3180 0.3235 0.3160 0.3185 0.3225 0.3200 0.3095 0.3040 0.3110 0.3165 0.3120 0.3145 0.3185 0.3160 0.3110 0.3055 0.3125 0.3180 Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00) 0.3025 0.2970 0.3040 0.3095 0.3080 0.3105 0.3145 0.3120 0.3040 0.2985 0.3055 0.3110 0.2955 0.2900 0.2970 0.3025 0.3040 0.3065 0.3105 0.3080 0.2970 0.2915 0.2985 0.3040 0.2900 0.2845 0.2915 0.2970
0.2990 0.3015 0.3055 0.3030 0.3030 0.3055 0.3095 0.3070 0.3070 0.3095 0.3135 0.3110 0.3110 0.3135 0.3175 0.3150
*Measurement Uncertainty Color Coordinates 0.007
Code
Code Description Part Number SWT805
Code Luminous Intensity Forward Voltage
Luminous Intensity (mcd) 20mA Min. 1,600 1,700 1,800 1,900 2,000 2,100 2,200 Max. 1,700 1,800 1,900 2,000 2,100 2,200 2,300
Color Rank 20mA A0~M0 A1~M1 A2~M2 A3~M3 A4~M4 A5~M5
Forward Voltage 20mA Code Min. Max.
Material
item Material Reflector Wire Gold Encapsulate Silicone Chip
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
0.75
Outline Dimension
0.75
Anode
Cathode
Tolerance: ±0.2
Recommended Solder Pattern
Management Molding surface
Tolerance:+
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
packing
11.4
LABLE ±0.2
Tolerance: ±0.2, Unit:
Quantity 2,000pcs/Reel Cumulative Tolerance Cumulative Tolerance/10 pitches ±0.2mm Adhesion Strength Cover Tape Adhesion strength 0.1-0.7N when cover tape turned from carrier tape angle carrier tape Package P/N, Manufacturing data Code quantity indicated damp proof Package Rev.
January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Reel Packing Structure
Reel
QUANTITY XXXX NUMBER XXXXXXXXXX PART NUMBER
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI
Aluminum Vinyl
QUANTITY XXXX NUMBER XXXXXXXXXX PART NUMBER
SEOUL SEMICONDUCTOR CO., LTD.
Outer Structure
Material Paper(SW3B(B))
TYPE 7inch
SIZE (mm)
SIDE
MADE KOREA
QUANTITY XXXX NUMBER XXXXXXXXXX PART NUMBER
SEOUL SEMICONDUCTOR CO., LTD.
Acriche
RoHS
Semiconductor EcoLight
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
soldering
Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 sec. Max. Max. sec. Max.
2.5~5 sec.
2.5~5 sec. Pre-heating 120~150
Max. sec. Max. 60sec. Max. Above
120sec. Max.
Lead-Free Solder
Lead-frame Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 sec. Max. Max. sec. Max.
sec.
sec. Pre-heating 150~200
Max. sec. Max. 60sec. Max. Above
120sec. Max.
Hand Soldering conditions exceed seconds maximum under soldering iron.
encapsulated material LEDs silicone. Precautions should taken avoid strong pressure encapsulated part. when using chip mounter, picking nozzle that does affect silicone resign should used.
Note case that soldered products reused soldering process, don't guarantee products.
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
precaution
Storage order avoid absorption moisture, recommended store desicator) with desiccant. Otherwise, store them following environment recommended. Temperature Humidity maximum 70%RH Attention after open. correspond SMD, when soldered dip, interfacial separation affect light transmission efficiency, causing light intensity drop. Attention followed; Keeping fraction Temperature Humidity less than case more than week passed after opening change color indicator desiccant, components shall dried 10-12hr. mechanical force excess vibration shall accepted apply during cooling process normal temperature after soldering. Quick cooling shall avoided. Components shall mounted warped direction PCB. Anti radioactive design considered products. This device should used type fluid such water, oil, organic solvent etc. When washing required, should used. When LEDs illuminating, operating current should decided after considering ambient maximum temperature. (10) LEDs must soldered within seven days after opening moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold close opening then store place. (12) appearance specifications product modified improvement without notice.
Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)
Handling Silicone Resin LEDs
During processing, mechanical stress surface should minimized much possible. Sharp objects types should used pierce sealing compound.
general, LEDs should only handled from side. way, this also applies LEDs without silicone sealant, since surface also become scratched.
When populating boards production, there basically restrictions regarding form pick place nozzle, except that mechanical pressure surface resin must prevented. This assured choosing pick place nozzle which larger than LED's reflector area. Silicone differs from materials conventionally used manufacturing LEDs. These conditions must considered during handling such devices. Compared standard encapsulants, silicone generally softer, surface more likely attract dust. mentioned previously, increased sensitivity dust requires special care during processing. cases where minimal level dirt dust particles cannot guaranteed, suitable cleaning solution must applied surface after soldering components. suggests using isopropyl alcohol cleaning. case other solvents used, must assured that these solvents dissolve package resin. Ultrasonic cleaning recommended. Ultrasonic cleaning cause damage LED. Rev. January, 2009 www.acriche.com www.acriche.com Document SSC-QP-7-07-24 (Rev.00)

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